JPS5586130A - Connection of semiconductor element - Google Patents
Connection of semiconductor elementInfo
- Publication number
- JPS5586130A JPS5586130A JP15855278A JP15855278A JPS5586130A JP S5586130 A JPS5586130 A JP S5586130A JP 15855278 A JP15855278 A JP 15855278A JP 15855278 A JP15855278 A JP 15855278A JP S5586130 A JPS5586130 A JP S5586130A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- film
- substrate
- electrode
- place
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81191—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed only on the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
- H01L2224/8119—Arrangement of the bump connectors prior to mounting
- H01L2224/81193—Arrangement of the bump connectors prior to mounting wherein the bump connectors are disposed on both the semiconductor or solid-state body and another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15855278A JPS5586130A (en) | 1978-12-25 | 1978-12-25 | Connection of semiconductor element |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15855278A JPS5586130A (en) | 1978-12-25 | 1978-12-25 | Connection of semiconductor element |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP60261166A Division JPS61142750A (ja) | 1985-11-22 | 1985-11-22 | 絶縁基板 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5586130A true JPS5586130A (en) | 1980-06-28 |
Family
ID=15674190
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15855278A Pending JPS5586130A (en) | 1978-12-25 | 1978-12-25 | Connection of semiconductor element |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5586130A (ja) |
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS61142750A (ja) * | 1985-11-22 | 1986-06-30 | Hitachi Ltd | 絶縁基板 |
JPS62172785A (ja) * | 1986-01-24 | 1987-07-29 | 三菱電機株式会社 | 電子部品 |
JPS62173171U (ja) * | 1985-12-19 | 1987-11-04 | ||
US4724611A (en) * | 1985-08-23 | 1988-02-16 | Nec Corporation | Method for producing semiconductor module |
US4945980A (en) * | 1988-09-09 | 1990-08-07 | Nec Corporation | Cooling unit |
US4975766A (en) * | 1988-08-26 | 1990-12-04 | Nec Corporation | Structure for temperature detection in a package |
US5014777A (en) * | 1988-09-20 | 1991-05-14 | Nec Corporation | Cooling structure |
US5023695A (en) * | 1988-05-09 | 1991-06-11 | Nec Corporation | Flat cooling structure of integrated circuit |
US5036384A (en) * | 1987-12-07 | 1991-07-30 | Nec Corporation | Cooling system for IC package |
JPH05121865A (ja) * | 1991-10-24 | 1993-05-18 | Sumitomo Kinzoku Ceramics:Kk | セラミツク回路基板 |
US5784779A (en) * | 1995-05-20 | 1998-07-28 | Robert Bosch Gmbh | Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50107463A (ja) * | 1974-01-30 | 1975-08-23 |
-
1978
- 1978-12-25 JP JP15855278A patent/JPS5586130A/ja active Pending
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS50107463A (ja) * | 1974-01-30 | 1975-08-23 |
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4724611A (en) * | 1985-08-23 | 1988-02-16 | Nec Corporation | Method for producing semiconductor module |
JPS61142750A (ja) * | 1985-11-22 | 1986-06-30 | Hitachi Ltd | 絶縁基板 |
JPS62173171U (ja) * | 1985-12-19 | 1987-11-04 | ||
JPH0316220Y2 (ja) * | 1985-12-19 | 1991-04-08 | ||
JPS62172785A (ja) * | 1986-01-24 | 1987-07-29 | 三菱電機株式会社 | 電子部品 |
US5036384A (en) * | 1987-12-07 | 1991-07-30 | Nec Corporation | Cooling system for IC package |
US5023695A (en) * | 1988-05-09 | 1991-06-11 | Nec Corporation | Flat cooling structure of integrated circuit |
US4975766A (en) * | 1988-08-26 | 1990-12-04 | Nec Corporation | Structure for temperature detection in a package |
US4945980A (en) * | 1988-09-09 | 1990-08-07 | Nec Corporation | Cooling unit |
US5014777A (en) * | 1988-09-20 | 1991-05-14 | Nec Corporation | Cooling structure |
JPH05121865A (ja) * | 1991-10-24 | 1993-05-18 | Sumitomo Kinzoku Ceramics:Kk | セラミツク回路基板 |
US5784779A (en) * | 1995-05-20 | 1998-07-28 | Robert Bosch Gmbh | Method for joining an electrical connection of a non-packaged IC component with a conductive strip on a substrate |
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