JPS62173171U - - Google Patents
Info
- Publication number
- JPS62173171U JPS62173171U JP1985195371U JP19537185U JPS62173171U JP S62173171 U JPS62173171 U JP S62173171U JP 1985195371 U JP1985195371 U JP 1985195371U JP 19537185 U JP19537185 U JP 19537185U JP S62173171 U JPS62173171 U JP S62173171U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- external metal
- terminal part
- terminal
- connection structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910001252 Pd alloy Inorganic materials 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- SWELZOZIOHGSPA-UHFFFAOYSA-N palladium silver Chemical compound [Pd].[Ag] SWELZOZIOHGSPA-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Multi-Conductor Connections (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Description
図面は本考案の一実施例に係る接続構造の要部
断面図である。 １…配線基板、２…端子部、３…被覆膜、４…
外部金属端子、５…半田。
断面図である。 １…配線基板、２…端子部、３…被覆膜、４…
外部金属端子、５…半田。
Claims (1)
- 金を導体材料とする配線基板の端子部に外部金
属端子をろう付け又は半田付け接合してなるもの
において、配線基板の端子部を銀パラジウム合金
で形成するか又は被覆してなることを特徴とする
配線基板と外部金属端子との接続構造。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985195371U JPH0316220Y2 (ja) | 1985-12-19 | 1985-12-19 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1985195371U JPH0316220Y2 (ja) | 1985-12-19 | 1985-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS62173171U true JPS62173171U (ja) | 1987-11-04 |
| JPH0316220Y2 JPH0316220Y2 (ja) | 1991-04-08 |
Family
ID=31153198
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1985195371U Expired JPH0316220Y2 (ja) | 1985-12-19 | 1985-12-19 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0316220Y2 (ja) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4927646U (ja) * | 1972-06-14 | 1974-03-09 | ||
| JPS5533182A (en) * | 1978-08-31 | 1980-03-08 | Yamatoya Shokai:Kk | Camera for photomechanical process |
| JPS5586130A (en) * | 1978-12-25 | 1980-06-28 | Hitachi Ltd | Connection of semiconductor element |
| JPS57139995A (en) * | 1981-02-24 | 1982-08-30 | Mitsubishi Electric Corp | Method of producing hybrid integrated circuit |
-
1985
- 1985-12-19 JP JP1985195371U patent/JPH0316220Y2/ja not_active Expired
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4927646U (ja) * | 1972-06-14 | 1974-03-09 | ||
| JPS5533182A (en) * | 1978-08-31 | 1980-03-08 | Yamatoya Shokai:Kk | Camera for photomechanical process |
| JPS5586130A (en) * | 1978-12-25 | 1980-06-28 | Hitachi Ltd | Connection of semiconductor element |
| JPS57139995A (en) * | 1981-02-24 | 1982-08-30 | Mitsubishi Electric Corp | Method of producing hybrid integrated circuit |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0316220Y2 (ja) | 1991-04-08 |