JPS5585667A - Adhering layer forming method - Google Patents

Adhering layer forming method

Info

Publication number
JPS5585667A
JPS5585667A JP15681478A JP15681478A JPS5585667A JP S5585667 A JPS5585667 A JP S5585667A JP 15681478 A JP15681478 A JP 15681478A JP 15681478 A JP15681478 A JP 15681478A JP S5585667 A JPS5585667 A JP S5585667A
Authority
JP
Japan
Prior art keywords
substrate
film
thin film
thick
metal film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15681478A
Other languages
Japanese (ja)
Inventor
Yoshio Takahashi
Shoichi Tsutsumi
Yoshimasa Miura
Susumu Kawakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15681478A priority Critical patent/JPS5585667A/en
Publication of JPS5585667A publication Critical patent/JPS5585667A/en
Pending legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C23COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23CCOATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/02Pretreatment of the material to be coated
    • C23C14/027Graded interfaces

Landscapes

  • Chemical & Material Sciences (AREA)
  • Magnetic Heads (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To form an adhering layer having adhering force between a substrate and a metal film by heat treating a Ti thin film, formed on the substrate, in an inert atmosphere and successively forming other Ti thin film and a magnetic metal film on the above film in the same vacuum state. CONSTITUTION:On a single crystal substrate of rock crystal or sapphire, pref. rock crystal a 500-1000Angstrom thick Ti thin film is formed by vacuum deposition or other method, and it is heat treated at a max. temp. of 800 deg.C to diffuse Ti in the substrate. In case of a rock crystal substrate, H2 gas is used as an atmoshperic gas, and it is important to slowly pass the substrate through the temp. range of 560-590 deg.C in heating and cooling. On the heat treated Ti thin film a 500-1000Angstrom thick Ti thin film and a 3-7mu thick magnetic metal film are formed successively in the same vacuum state. This metal film is a soft magnetic material film for the magnetic core of a magnetic head, and it is pref. a Permalloy film.
JP15681478A 1978-12-21 1978-12-21 Adhering layer forming method Pending JPS5585667A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15681478A JPS5585667A (en) 1978-12-21 1978-12-21 Adhering layer forming method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15681478A JPS5585667A (en) 1978-12-21 1978-12-21 Adhering layer forming method

Publications (1)

Publication Number Publication Date
JPS5585667A true JPS5585667A (en) 1980-06-27

Family

ID=15635904

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15681478A Pending JPS5585667A (en) 1978-12-21 1978-12-21 Adhering layer forming method

Country Status (1)

Country Link
JP (1) JPS5585667A (en)

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