JPS558100A - Method of manufacturing charge coupled device - Google Patents

Method of manufacturing charge coupled device

Info

Publication number
JPS558100A
JPS558100A JP8255779A JP8255779A JPS558100A JP S558100 A JPS558100 A JP S558100A JP 8255779 A JP8255779 A JP 8255779A JP 8255779 A JP8255779 A JP 8255779A JP S558100 A JPS558100 A JP S558100A
Authority
JP
Japan
Prior art keywords
coupled device
charge coupled
manufacturing charge
manufacturing
coupled
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8255779A
Other languages
English (en)
Other versions
JPS6318345B2 (ja
Inventor
Maachin Fueisuto Uorufugangu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Raytheon Co
Original Assignee
Raytheon Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Raytheon Co filed Critical Raytheon Co
Publication of JPS558100A publication Critical patent/JPS558100A/ja
Publication of JPS6318345B2 publication Critical patent/JPS6318345B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76—Unipolar devices, e.g. field effect transistors
    • H01L29/762—Charge transfer devices
    • H01L29/765—Charge-coupled devices
    • H01L29/768—Charge-coupled devices with field effect produced by an insulated gate
    • H01L29/76833—Buried channel CCD
    • H01L29/76841—Two-Phase CCD
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
    • H01L29/06—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions
    • H01L29/10—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by their shape; characterised by the shapes, relative sizes, or dispositions of the semiconductor regions ; characterised by the concentration or distribution of impurities within semiconductor regions with semiconductor regions connected to an electrode not carrying current to be rectified, amplified or switched and such electrode being part of a semiconductor device which comprises three or more electrodes
    • H01L29/1025—Channel region of field-effect devices
    • H01L29/1062—Channel region of field-effect devices of charge coupled devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Solid State Image Pick-Up Elements (AREA)
JP8255779A 1978-06-29 1979-06-29 Method of manufacturing charge coupled device Granted JPS558100A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/920,594 US4216574A (en) 1978-06-29 1978-06-29 Charge coupled device

Publications (2)

Publication Number Publication Date
JPS558100A true JPS558100A (en) 1980-01-21
JPS6318345B2 JPS6318345B2 (ja) 1988-04-18

Family

ID=25444025

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8255779A Granted JPS558100A (en) 1978-06-29 1979-06-29 Method of manufacturing charge coupled device

Country Status (8)

Country Link
US (1) US4216574A (ja)
JP (1) JPS558100A (ja)
AU (1) AU524673B2 (ja)
CA (1) CA1139879A (ja)
DE (1) DE2926334A1 (ja)
FR (1) FR2430093A1 (ja)
GB (1) GB2024507B (ja)
IT (1) IT1120458B (ja)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007302109A (ja) * 2006-05-11 2007-11-22 Yamaha Motor Co Ltd 鞍乗型車両
US9421860B2 (en) 2012-11-12 2016-08-23 Indian Motorcycle International, LLC Two-wheeled vehicle

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4364164A (en) * 1978-12-04 1982-12-21 Westinghouse Electric Corp. Method of making a sloped insulator charge-coupled device
US4360963A (en) * 1981-07-31 1982-11-30 Rca Corporation Method of making CCD imagers with reduced defects
US4521896A (en) * 1982-05-14 1985-06-04 Westinghouse Electric Co. Simultaneous sampling dual transfer channel charge coupled device
US4486946A (en) * 1983-07-12 1984-12-11 Control Data Corporation Method for using titanium-tungsten alloy as a barrier metal in silicon semiconductor processing
FR2578683B1 (fr) * 1985-03-08 1987-08-28 Thomson Csf Procede de fabrication d'une diode anti-eblouissement associee a un canal en surface, et systeme anti-eblouissement obtenu par ce procede
US4607429A (en) * 1985-03-29 1986-08-26 Rca Corporation Method of making a charge-coupled device image sensor
JPS6436073A (en) * 1987-07-31 1989-02-07 Toshiba Corp Manufacture of semiconductor device
US4959701A (en) * 1989-05-01 1990-09-25 Westinghouse Electric Corp. Variable sensitivity floating gate photosensor
US5302543A (en) * 1989-11-06 1994-04-12 Mitsubishi Denki Kabushiki Kaisha Method of making a charge coupled device
AU638812B2 (en) * 1990-04-16 1993-07-08 Digital Equipment Corporation A method of operating a semiconductor device
US6884701B2 (en) * 1991-04-27 2005-04-26 Hidemi Takasu Process for fabricating semiconductor device
JP2910394B2 (ja) * 1992-03-19 1999-06-23 日本電気株式会社 固体撮像素子およびその製造方法
JP2874665B2 (ja) * 1996-09-27 1999-03-24 日本電気株式会社 電荷転送装置の製造方法
KR100524800B1 (ko) * 2002-09-25 2005-11-02 주식회사 하이닉스반도체 반도체 소자의 이중 도핑 분포를 갖는 콘택플러그 형성 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5016482A (ja) * 1973-04-27 1975-02-21
JPS5057780A (ja) * 1973-09-24 1975-05-20
JPS5172288A (ja) * 1974-12-20 1976-06-22 Fujitsu Ltd Handotaisochi

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3927468A (en) * 1973-12-28 1975-12-23 Fairchild Camera Instr Co Self aligned CCD element fabrication method therefor
FR2257145B1 (ja) * 1974-01-04 1976-11-26 Commissariat Energie Atomique
US3931674A (en) * 1974-02-08 1976-01-13 Fairchild Camera And Instrument Corporation Self aligned CCD element including two levels of electrodes and method of manufacture therefor
NL7401939A (nl) * 1974-02-13 1975-08-15 Philips Nv Ladingsgekoppelde inrichting.
US3950188A (en) * 1975-05-12 1976-04-13 Trw Inc. Method of patterning polysilicon
US4063992A (en) * 1975-05-27 1977-12-20 Fairchild Camera And Instrument Corporation Edge etch method for producing narrow openings to the surface of materials
US4062699A (en) * 1976-02-20 1977-12-13 Western Digital Corporation Method for fabricating diffusion self-aligned short channel MOS device

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5016482A (ja) * 1973-04-27 1975-02-21
JPS5057780A (ja) * 1973-09-24 1975-05-20
JPS5172288A (ja) * 1974-12-20 1976-06-22 Fujitsu Ltd Handotaisochi

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007302109A (ja) * 2006-05-11 2007-11-22 Yamaha Motor Co Ltd 鞍乗型車両
US9421860B2 (en) 2012-11-12 2016-08-23 Indian Motorcycle International, LLC Two-wheeled vehicle
US10549804B2 (en) 2012-11-12 2020-02-04 Indian Motorcycle International, LLC Two-wheeled vehicle
US11767074B2 (en) 2012-11-12 2023-09-26 Indian Motorcycle International, LLC Two-wheeled vehicle

Also Published As

Publication number Publication date
FR2430093A1 (fr) 1980-01-25
GB2024507B (en) 1982-07-28
IT7949571A0 (it) 1979-06-28
CA1139879A (en) 1983-01-18
US4216574A (en) 1980-08-12
AU524673B2 (en) 1982-09-30
GB2024507A (en) 1980-01-09
JPS6318345B2 (ja) 1988-04-18
AU4789279A (en) 1980-01-03
DE2926334C2 (ja) 1990-03-22
IT1120458B (it) 1986-03-26
FR2430093B1 (ja) 1985-03-01
DE2926334A1 (de) 1980-01-03

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