JPS5577165A - Semiconductor device - Google Patents
Semiconductor deviceInfo
- Publication number
- JPS5577165A JPS5577165A JP15339378A JP15339378A JPS5577165A JP S5577165 A JPS5577165 A JP S5577165A JP 15339378 A JP15339378 A JP 15339378A JP 15339378 A JP15339378 A JP 15339378A JP S5577165 A JPS5577165 A JP S5577165A
- Authority
- JP
- Japan
- Prior art keywords
- height
- resin
- sealed
- board
- project
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To obtain a small-sized and easy-to-assemble semiconductor device, by soldering semiconductor pellet onto a radiating metallic board through an insulating board and allowing lead end section to project from all sides of resin sealed body to a prescribed height.
CONSTITUTION: After soldering an alumina substrate 2, a plate-like anode lead 3, an SCR pellet 4, a plate-like gate lead 5 and a cathode 6 onto a radiating board 1, they are sealed by resin 14 except a part of the leads 3, 5 and 6. At this time, all the leads are made to project from 3 sides of the sealed resin 14, which is mutually plane rectangular shape, to a height less than the height t1 of the sealed resin but equal to a height t2 which leaves sufficient strength and to a length l equal to or less than a height t2. It is possible, in this mechanism, to assemble easily, to eliminate influence by external force during assembling and to obtain a small-sized device.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15339378A JPS5577165A (en) | 1978-12-06 | 1978-12-06 | Semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15339378A JPS5577165A (en) | 1978-12-06 | 1978-12-06 | Semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5577165A true JPS5577165A (en) | 1980-06-10 |
Family
ID=15561501
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15339378A Pending JPS5577165A (en) | 1978-12-06 | 1978-12-06 | Semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5577165A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007285785A (en) * | 2006-04-14 | 2007-11-01 | Chugoku Electric Power Co Inc:The | Pressure detection tube |
EP2058857A3 (en) * | 1998-06-02 | 2011-05-18 | SILICONIX Incorporated | IC chip package with directly connected leads |
-
1978
- 1978-12-06 JP JP15339378A patent/JPS5577165A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP2058857A3 (en) * | 1998-06-02 | 2011-05-18 | SILICONIX Incorporated | IC chip package with directly connected leads |
EP2306513A3 (en) * | 1998-06-02 | 2011-10-12 | SILICONIX Incorporated | IC chip package with directly connected leads |
EP2306515A3 (en) * | 1998-06-02 | 2011-10-26 | SILICONIX Incorporated | IC chip package with directly connected leads |
JP2007285785A (en) * | 2006-04-14 | 2007-11-01 | Chugoku Electric Power Co Inc:The | Pressure detection tube |
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