JPS5577165A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS5577165A
JPS5577165A JP15339378A JP15339378A JPS5577165A JP S5577165 A JPS5577165 A JP S5577165A JP 15339378 A JP15339378 A JP 15339378A JP 15339378 A JP15339378 A JP 15339378A JP S5577165 A JPS5577165 A JP S5577165A
Authority
JP
Japan
Prior art keywords
height
resin
sealed
board
project
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15339378A
Other languages
Japanese (ja)
Inventor
Masahiro Yamane
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP15339378A priority Critical patent/JPS5577165A/en
Publication of JPS5577165A publication Critical patent/JPS5577165A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To obtain a small-sized and easy-to-assemble semiconductor device, by soldering semiconductor pellet onto a radiating metallic board through an insulating board and allowing lead end section to project from all sides of resin sealed body to a prescribed height.
CONSTITUTION: After soldering an alumina substrate 2, a plate-like anode lead 3, an SCR pellet 4, a plate-like gate lead 5 and a cathode 6 onto a radiating board 1, they are sealed by resin 14 except a part of the leads 3, 5 and 6. At this time, all the leads are made to project from 3 sides of the sealed resin 14, which is mutually plane rectangular shape, to a height less than the height t1 of the sealed resin but equal to a height t2 which leaves sufficient strength and to a length l equal to or less than a height t2. It is possible, in this mechanism, to assemble easily, to eliminate influence by external force during assembling and to obtain a small-sized device.
COPYRIGHT: (C)1980,JPO&Japio
JP15339378A 1978-12-06 1978-12-06 Semiconductor device Pending JPS5577165A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15339378A JPS5577165A (en) 1978-12-06 1978-12-06 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15339378A JPS5577165A (en) 1978-12-06 1978-12-06 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS5577165A true JPS5577165A (en) 1980-06-10

Family

ID=15561501

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15339378A Pending JPS5577165A (en) 1978-12-06 1978-12-06 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS5577165A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007285785A (en) * 2006-04-14 2007-11-01 Chugoku Electric Power Co Inc:The Pressure detection tube
EP2058857A3 (en) * 1998-06-02 2011-05-18 SILICONIX Incorporated IC chip package with directly connected leads

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2058857A3 (en) * 1998-06-02 2011-05-18 SILICONIX Incorporated IC chip package with directly connected leads
EP2306513A3 (en) * 1998-06-02 2011-10-12 SILICONIX Incorporated IC chip package with directly connected leads
EP2306515A3 (en) * 1998-06-02 2011-10-26 SILICONIX Incorporated IC chip package with directly connected leads
JP2007285785A (en) * 2006-04-14 2007-11-01 Chugoku Electric Power Co Inc:The Pressure detection tube

Similar Documents

Publication Publication Date Title
JPS5435679A (en) Semiconductor connection method
JPS53105970A (en) Assembling method for semiconductor device
JPS5577165A (en) Semiconductor device
JPS5389664A (en) Package structure of semiconductor device
JPS5357971A (en) Production of semiconductor device
JPS5277669A (en) Plastic ic case
JPS522282A (en) Semiconductor device
JPS56165341A (en) Semiconductor device
JPS55107251A (en) Electronic part and its packaging construction
JPS554988A (en) Semiconductor device
JPS5539617A (en) Manufacturing of glass mold type diode
JPS52119075A (en) Manufacture of semiconductor device
JPS5322589A (en) Hardening resin composition
JPS5267966A (en) Manufacture of semiconductor unit
JPS52125272A (en) Substrate to which semiconductor device is mounted
JPS57121239A (en) Semiconductor device
JPS5317274A (en) Electrode structure of semiconductor element
JPS5461471A (en) Semiconductor device
JPS5211772A (en) Semiconductor device
JPS5418675A (en) Sealing method for semiconductor element
JPS5394874A (en) Connecting method for semiconductor device
JPS5442691A (en) Conductive compound
JPS53140971A (en) Electronic parts package
JPS5275979A (en) Semiconductor device
JPS52146562A (en) Semiconductor integrated circuit device