JPS5573749A - Heat-resistant resin composition - Google Patents

Heat-resistant resin composition

Info

Publication number
JPS5573749A
JPS5573749A JP14686178A JP14686178A JPS5573749A JP S5573749 A JPS5573749 A JP S5573749A JP 14686178 A JP14686178 A JP 14686178A JP 14686178 A JP14686178 A JP 14686178A JP S5573749 A JPS5573749 A JP S5573749A
Authority
JP
Japan
Prior art keywords
parts
bismaleimide
heat
resin composition
pref
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP14686178A
Other languages
Japanese (ja)
Other versions
JPS5754060B2 (en
Inventor
Norio Saruwatari
Isao Watanabe
Kazumasa Saito
Katsura Adachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP14686178A priority Critical patent/JPS5573749A/en
Publication of JPS5573749A publication Critical patent/JPS5573749A/en
Publication of JPS5754060B2 publication Critical patent/JPS5754060B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To prepare the title electrical insulating composition having improved adhesivity and dimensional stability without lowering the original heat-resistance and dielectric characteristics, by heat-curing a composition obtained by compounding a bismaleimide compound to a specific butadiene polymer.
CONSTITUTION: A resin composition composed of (A) 100 parts by weight of a liquid polybutadiene having an average molecular weight of 500W5,000 and containing ≥50%, pref. ≥70% of 1,2-butadiene unit having side-chain double bonds, in the polymer chain, and (B) 10W300 parts, pref. 50W150 parts of a bismaleimide compound of formula (R is ≥2C bivalent hydrocarbon group), e.g. N,N'-ethylene- bismaleimide, is mixed with (C) 0.1W10 parts, based on 100 parts of (A)+(B), of an organic peroxide such as benzoyl peroxide, and the mixture is cured by heating. High amount of the bismaleimide component gives improved dimensional stability, especially low thermal expansion.
COPYRIGHT: (C)1980,JPO&Japio
JP14686178A 1978-11-28 1978-11-28 Heat-resistant resin composition Granted JPS5573749A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14686178A JPS5573749A (en) 1978-11-28 1978-11-28 Heat-resistant resin composition

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14686178A JPS5573749A (en) 1978-11-28 1978-11-28 Heat-resistant resin composition

Publications (2)

Publication Number Publication Date
JPS5573749A true JPS5573749A (en) 1980-06-03
JPS5754060B2 JPS5754060B2 (en) 1982-11-16

Family

ID=15417211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14686178A Granted JPS5573749A (en) 1978-11-28 1978-11-28 Heat-resistant resin composition

Country Status (1)

Country Link
JP (1) JPS5573749A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114030A1 (en) * 2015-01-16 2016-07-21 日立化成株式会社 Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2016114030A1 (en) * 2015-01-16 2016-07-21 日立化成株式会社 Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same
US10544305B2 (en) 2015-01-16 2020-01-28 Hitachi Chemical Company, Ltd. Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same

Also Published As

Publication number Publication date
JPS5754060B2 (en) 1982-11-16

Similar Documents

Publication Publication Date Title
JPS5649754A (en) Thermosetting organopolysiloxane composition
JPS55102614A (en) Styrene copolymer and its preparation
JPS5490285A (en) Low shrinkable resin composition
JPS5548245A (en) Silicone resin composition
JPS5573749A (en) Heat-resistant resin composition
JPS5580461A (en) Thermal conductive silicone rubber composition
JPS56151757A (en) Polyimide resin molded article
JPS55110139A (en) Flame-retardant synthetic resin composition
JPS5573726A (en) Heat-resistant resin composition
JPS56115352A (en) Polyurethane polymer composition
JPS5740524A (en) Epoxy resin composition
JPS6475556A (en) Epoxy resin composition for sealing semiconductor
JPS5710641A (en) Wholly aromatic copolyester resin composition
JPS54129094A (en) Thermosetting resin composition
JPS5598244A (en) Thermosetting resin composition
JPS5638335A (en) Rubber composition
JPS5545754A (en) Unsaturated polyester resin composition suitably used as electrical laminate and electrical laminate therefrom
JPS5420091A (en) Preparation of heat-resistant, flexing-resistant rubber
JPS55102641A (en) Thermoplastic composite polymer composition
JPS5592727A (en) Thermosetting resin composition
JPS5783548A (en) Resin composition
JPS5698256A (en) Resin composition
JPS56127612A (en) Thermosetting resin composition
JPS5589340A (en) Crosslinkable resin composition
JPS557860A (en) Thermosetting resin composition