JPS5573749A - Heat-resistant resin composition - Google Patents
Heat-resistant resin compositionInfo
- Publication number
- JPS5573749A JPS5573749A JP14686178A JP14686178A JPS5573749A JP S5573749 A JPS5573749 A JP S5573749A JP 14686178 A JP14686178 A JP 14686178A JP 14686178 A JP14686178 A JP 14686178A JP S5573749 A JPS5573749 A JP S5573749A
- Authority
- JP
- Japan
- Prior art keywords
- parts
- bismaleimide
- heat
- resin composition
- pref
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To prepare the title electrical insulating composition having improved adhesivity and dimensional stability without lowering the original heat-resistance and dielectric characteristics, by heat-curing a composition obtained by compounding a bismaleimide compound to a specific butadiene polymer.
CONSTITUTION: A resin composition composed of (A) 100 parts by weight of a liquid polybutadiene having an average molecular weight of 500W5,000 and containing ≥50%, pref. ≥70% of 1,2-butadiene unit having side-chain double bonds, in the polymer chain, and (B) 10W300 parts, pref. 50W150 parts of a bismaleimide compound of formula (R is ≥2C bivalent hydrocarbon group), e.g. N,N'-ethylene- bismaleimide, is mixed with (C) 0.1W10 parts, based on 100 parts of (A)+(B), of an organic peroxide such as benzoyl peroxide, and the mixture is cured by heating. High amount of the bismaleimide component gives improved dimensional stability, especially low thermal expansion.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14686178A JPS5573749A (en) | 1978-11-28 | 1978-11-28 | Heat-resistant resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14686178A JPS5573749A (en) | 1978-11-28 | 1978-11-28 | Heat-resistant resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5573749A true JPS5573749A (en) | 1980-06-03 |
JPS5754060B2 JPS5754060B2 (en) | 1982-11-16 |
Family
ID=15417211
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14686178A Granted JPS5573749A (en) | 1978-11-28 | 1978-11-28 | Heat-resistant resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5573749A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016114030A1 (en) * | 2015-01-16 | 2016-07-21 | 日立化成株式会社 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same |
-
1978
- 1978-11-28 JP JP14686178A patent/JPS5573749A/en active Granted
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2016114030A1 (en) * | 2015-01-16 | 2016-07-21 | 日立化成株式会社 | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same |
US10544305B2 (en) | 2015-01-16 | 2020-01-28 | Hitachi Chemical Company, Ltd. | Thermosetting resin composition, resin film for interlayer insulation, composite film, printed wiring board, and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
JPS5754060B2 (en) | 1982-11-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5649754A (en) | Thermosetting organopolysiloxane composition | |
JPS55102614A (en) | Styrene copolymer and its preparation | |
JPS5490285A (en) | Low shrinkable resin composition | |
JPS5548245A (en) | Silicone resin composition | |
JPS5573749A (en) | Heat-resistant resin composition | |
JPS5580461A (en) | Thermal conductive silicone rubber composition | |
JPS56151757A (en) | Polyimide resin molded article | |
JPS55110139A (en) | Flame-retardant synthetic resin composition | |
JPS5573726A (en) | Heat-resistant resin composition | |
JPS56115352A (en) | Polyurethane polymer composition | |
JPS5740524A (en) | Epoxy resin composition | |
JPS6475556A (en) | Epoxy resin composition for sealing semiconductor | |
JPS5710641A (en) | Wholly aromatic copolyester resin composition | |
JPS54129094A (en) | Thermosetting resin composition | |
JPS5598244A (en) | Thermosetting resin composition | |
JPS5638335A (en) | Rubber composition | |
JPS5545754A (en) | Unsaturated polyester resin composition suitably used as electrical laminate and electrical laminate therefrom | |
JPS5420091A (en) | Preparation of heat-resistant, flexing-resistant rubber | |
JPS55102641A (en) | Thermoplastic composite polymer composition | |
JPS5592727A (en) | Thermosetting resin composition | |
JPS5783548A (en) | Resin composition | |
JPS5698256A (en) | Resin composition | |
JPS56127612A (en) | Thermosetting resin composition | |
JPS5589340A (en) | Crosslinkable resin composition | |
JPS557860A (en) | Thermosetting resin composition |