JPS5568146A - Staking by wire material rivet - Google Patents
Staking by wire material rivetInfo
- Publication number
- JPS5568146A JPS5568146A JP14028078A JP14028078A JPS5568146A JP S5568146 A JPS5568146 A JP S5568146A JP 14028078 A JP14028078 A JP 14028078A JP 14028078 A JP14028078 A JP 14028078A JP S5568146 A JPS5568146 A JP S5568146A
- Authority
- JP
- Japan
- Prior art keywords
- rivet
- staking
- hole
- punch
- fixed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Insertion Pins And Rivets (AREA)
Abstract
PURPOSE: To achieve the improvement in staking quality and the increased speed of staking process by staking the same axis rivet hole of the first and second substrates on a terminal such as of a variable resistor or the like by means of the wire material rivet comprising cutting its both end faces to plane form in place of an eyelet rivet.
CONSTITUTION: A terminal 10, resistor substrate 9 and insulation plate 8 are so positioned and superposed that the respective rivet holes align to the same axis on a lower die 11. A wire material rivet 7 having undergone cutting is supplied into this rivet hole through the through-hole of an upper die 30 and the lower part is ibserted into the guide hole of the lower die 11. Next, a guide post 25 lowers and an upper holder 26 fixed to this and an upper punch 12 fixed to this lower. A lower punch 13 fixed to a lower punch holder 37 is moved upward by a cam 35 for lower die. Further the rivet 7 is bitten and tentaively staked to the inside face of the rivet hole by descending of the upper punch 12. Next, the tentatively staked assembly is removed from the lower die, the upper punch 12 is fixed and the underformed rivet head of the rivet 7 is pressed by the lower punch 13 to deform the rivet head, whereby final staking is accomplished.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14028078A JPS5568146A (en) | 1978-11-13 | 1978-11-13 | Staking by wire material rivet |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14028078A JPS5568146A (en) | 1978-11-13 | 1978-11-13 | Staking by wire material rivet |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5568146A true JPS5568146A (en) | 1980-05-22 |
Family
ID=15265097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14028078A Pending JPS5568146A (en) | 1978-11-13 | 1978-11-13 | Staking by wire material rivet |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5568146A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108555163A (en) * | 2018-05-17 | 2018-09-21 | 杭州西奥电梯有限公司 | A kind of door-plate quadrangle automatic press-riveting device based on assembly line |
CN111069440A (en) * | 2019-12-16 | 2020-04-28 | 上海交通大学 | Local hot heading connection method of T-shaped structure |
-
1978
- 1978-11-13 JP JP14028078A patent/JPS5568146A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108555163A (en) * | 2018-05-17 | 2018-09-21 | 杭州西奥电梯有限公司 | A kind of door-plate quadrangle automatic press-riveting device based on assembly line |
CN108555163B (en) * | 2018-05-17 | 2024-05-03 | 杭州西奥电梯有限公司 | Automatic door plant four corners is pressed and is riveted device based on assembly line |
CN111069440A (en) * | 2019-12-16 | 2020-04-28 | 上海交通大学 | Local hot heading connection method of T-shaped structure |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
DE3072031D1 (en) | Process for producing a solder connection between a semiconductor device and a carrier substrate, and a semiconductor device made by such method | |
JPS5568146A (en) | Staking by wire material rivet | |
JPS5737865A (en) | Lead frame for integrated circuit | |
EP0023534A3 (en) | Semiconductor device mounting structure and method of mounting | |
JPS55138864A (en) | Method of fabricating semiconductor assembling substrate | |
JPS5748477A (en) | Production of bar- or wire-formed grind stone | |
JPS5323569A (en) | Semiconductor device | |
JPS52103089A (en) | Punching method of goods having based through hole and punching device of goods | |
JPS5533058A (en) | Method of manufacturing diode | |
JPS6420696A (en) | Manufacture of film carrier board | |
JPS53144670A (en) | Production of semiconductor device | |
JPS5338266A (en) | Screening method of semiconductors and device for the same | |
JPS5541761A (en) | Manufacturing semiconductor device | |
JPS5432794A (en) | Manufacturing method of terminal rack | |
JPS5227583A (en) | Terminal plate producing method | |
JPS55106740A (en) | Manufacturing method of grater | |
JPS5380161A (en) | Electrode formation of semiconductor | |
JPS54158337A (en) | Plating method for print substrate | |
JPS57145349A (en) | Lead frame | |
JPS51151070A (en) | Connection method of a semiconductor apparatus | |
JPS5310266A (en) | Production of soldred semiconductor wafers | |
JPS5236975A (en) | Process for production of semiconductor device | |
JPS5311577A (en) | Soldering method for wafers of semiconductor devices | |
JPS6472537A (en) | Solder bump carrier | |
JPS5220774A (en) | Manufacturing method of variable capacitance element |