JPS54158337A - Plating method for print substrate - Google Patents

Plating method for print substrate

Info

Publication number
JPS54158337A
JPS54158337A JP6667078A JP6667078A JPS54158337A JP S54158337 A JPS54158337 A JP S54158337A JP 6667078 A JP6667078 A JP 6667078A JP 6667078 A JP6667078 A JP 6667078A JP S54158337 A JPS54158337 A JP S54158337A
Authority
JP
Japan
Prior art keywords
substrate
plating
thickness
arrow
holes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6667078A
Other languages
Japanese (ja)
Other versions
JPS6011120B2 (en
Inventor
Teruji Natsume
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP6667078A priority Critical patent/JPS6011120B2/en
Publication of JPS54158337A publication Critical patent/JPS54158337A/en
Publication of JPS6011120B2 publication Critical patent/JPS6011120B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/32—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor using vibratory energy applied to the bath or substrate

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)

Abstract

PURPOSE:To enhance the electrical connectibility of the through holes of a print substrate by plating the substrate while periodically applying impacts to the substrate to make plating thickness uniform even in case the ratio of the substrate thickness and the through hole diameter is high. CONSTITUTION:Print substrate 1 dipped in a plating soln. is plated while periodically hitting piston rod 4 of air piston 3 in the direction of arrow P. By the first and second impacts a fresh plating soln. enters through holes 2 in the direction of arrow Q (a) and the direction of arrow Q (b), respectively, and the old plating slon. is pushed out and refreshed. Accordingly, plating thickness in the through holes is made uniform, and the electrical connectibility is enhanced even in case the ratio of the substrate thickness and the through hole diameter is above 2. In case of above 2 the substrate is difficult to be plated by a conventional method. The im pacts are desirable not to exceed 400 times/min, and 10-200 times/min are most effective.
JP6667078A 1978-06-05 1978-06-05 How to plate printed circuit boards Expired JPS6011120B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP6667078A JPS6011120B2 (en) 1978-06-05 1978-06-05 How to plate printed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP6667078A JPS6011120B2 (en) 1978-06-05 1978-06-05 How to plate printed circuit boards

Publications (2)

Publication Number Publication Date
JPS54158337A true JPS54158337A (en) 1979-12-14
JPS6011120B2 JPS6011120B2 (en) 1985-03-23

Family

ID=13322563

Family Applications (1)

Application Number Title Priority Date Filing Date
JP6667078A Expired JPS6011120B2 (en) 1978-06-05 1978-06-05 How to plate printed circuit boards

Country Status (1)

Country Link
JP (1) JPS6011120B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154192A (en) * 1990-10-17 1992-05-27 Fujitsu Ltd Plating of printed wiring board
WO2001072096A1 (en) * 2000-03-23 2001-09-27 Atotech Deutschland Gmbh Treatment of circuit supports with impulse excitation

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH04154192A (en) * 1990-10-17 1992-05-27 Fujitsu Ltd Plating of printed wiring board
WO2001072096A1 (en) * 2000-03-23 2001-09-27 Atotech Deutschland Gmbh Treatment of circuit supports with impulse excitation

Also Published As

Publication number Publication date
JPS6011120B2 (en) 1985-03-23

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