JPS5562193A - Partial plating method of blankded flat bar material - Google Patents

Partial plating method of blankded flat bar material

Info

Publication number
JPS5562193A
JPS5562193A JP13305978A JP13305978A JPS5562193A JP S5562193 A JPS5562193 A JP S5562193A JP 13305978 A JP13305978 A JP 13305978A JP 13305978 A JP13305978 A JP 13305978A JP S5562193 A JPS5562193 A JP S5562193A
Authority
JP
Japan
Prior art keywords
plating
paraffin
flat bar
materials
blanked
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13305978A
Other languages
Japanese (ja)
Other versions
JPS6041718B2 (en
Inventor
Mamoru Onda
Ryozo Yamagishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP13305978A priority Critical patent/JPS6041718B2/en
Publication of JPS5562193A publication Critical patent/JPS5562193A/en
Publication of JPS6041718B2 publication Critical patent/JPS6041718B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Chemically Coating (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To make the plating boundaries of partially plated blanked materials distinct by masking the portions of the blanked flat bar materials not requiring plating with paraffin coating and applying plating.
CONSTITUTION: Molten paraffin 9 is coated by using coating rollers or the like to the portions not requiring plating of blanked copper flat bar materials or the like used for semiconductor lead frames or the like, whereby paraffin maskings 15 are locally formed. Next, the materials are transferred to the plating process being the next process and finally the paraffin is removed. This method yields the partially plated flat bar materials of the distinct plating boundaries of the cut end faces. This is economical because paraffin is reusable.
COPYRIGHT: (C)1980,JPO&Japio
JP13305978A 1978-10-27 1978-10-27 Partial plating method for punched strips Expired JPS6041718B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13305978A JPS6041718B2 (en) 1978-10-27 1978-10-27 Partial plating method for punched strips

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13305978A JPS6041718B2 (en) 1978-10-27 1978-10-27 Partial plating method for punched strips

Publications (2)

Publication Number Publication Date
JPS5562193A true JPS5562193A (en) 1980-05-10
JPS6041718B2 JPS6041718B2 (en) 1985-09-18

Family

ID=15095856

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13305978A Expired JPS6041718B2 (en) 1978-10-27 1978-10-27 Partial plating method for punched strips

Country Status (1)

Country Link
JP (1) JPS6041718B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0106977A2 (en) * 1982-09-30 1984-05-02 International Business Machines Corporation Method and apparatus for electrochemically treating a substrate
JPS59186354A (en) * 1983-04-07 1984-10-23 Furukawa Electric Co Ltd:The Metal member for lead frame
CN106119818A (en) * 2016-08-30 2016-11-16 合肥乐凯科技产业有限公司 A kind of method of inorganic powder surface chemical plating and thin film thereof

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142513A (en) * 1985-12-17 1987-06-25 秋山　実 Heat conductive carpet

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0106977A2 (en) * 1982-09-30 1984-05-02 International Business Machines Corporation Method and apparatus for electrochemically treating a substrate
JPS59186354A (en) * 1983-04-07 1984-10-23 Furukawa Electric Co Ltd:The Metal member for lead frame
CN106119818A (en) * 2016-08-30 2016-11-16 合肥乐凯科技产业有限公司 A kind of method of inorganic powder surface chemical plating and thin film thereof

Also Published As

Publication number Publication date
JPS6041718B2 (en) 1985-09-18

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