JPS51151685A - Method of forming thin layer by cathodic spattering process - Google Patents
Method of forming thin layer by cathodic spattering processInfo
- Publication number
- JPS51151685A JPS51151685A JP51069424A JP6942476A JPS51151685A JP S51151685 A JPS51151685 A JP S51151685A JP 51069424 A JP51069424 A JP 51069424A JP 6942476 A JP6942476 A JP 6942476A JP S51151685 A JPS51151685 A JP S51151685A
- Authority
- JP
- Japan
- Prior art keywords
- thin layer
- forming thin
- spattering process
- cathodic
- cathodic spattering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE2527184A DE2527184C3 (en) | 1975-06-18 | 1975-06-18 | Apparatus for the production of targets for cathode sputtering |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51151685A true JPS51151685A (en) | 1976-12-27 |
JPS5527148B2 JPS5527148B2 (en) | 1980-07-18 |
Family
ID=5949375
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP51069424A Granted JPS51151685A (en) | 1975-06-18 | 1976-06-15 | Method of forming thin layer by cathodic spattering process |
Country Status (6)
Country | Link |
---|---|
US (1) | US4049523A (en) |
JP (1) | JPS51151685A (en) |
CA (1) | CA1075198A (en) |
DE (1) | DE2527184C3 (en) |
FR (1) | FR2316350A1 (en) |
GB (1) | GB1554285A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5459046U (en) * | 1977-09-30 | 1979-04-24 |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4135286A (en) * | 1977-12-22 | 1979-01-23 | United Technologies Corporation | Sputtering target fabrication method |
DE3103509C2 (en) * | 1981-02-03 | 1986-11-20 | Günter Dr. Dipl.-Phys. 7801 Buchenbach Kleer | Target for producing thin films, method for producing the target and using the target |
US4595481A (en) * | 1984-08-21 | 1986-06-17 | Komag, Inc. | Disk carrier |
US4735701A (en) * | 1984-08-21 | 1988-04-05 | Komag, Inc. | Disk carrier |
JPH0774436B2 (en) * | 1990-09-20 | 1995-08-09 | 富士通株式会社 | Thin film formation method |
US5637199A (en) * | 1992-06-26 | 1997-06-10 | Minnesota Mining And Manufacturing Company | Sputtering shields and method of manufacture |
US5306405A (en) * | 1992-06-26 | 1994-04-26 | Minnesota Mining And Manufacturing Company | Sputtering target and method of manufacture |
US5656216A (en) * | 1994-08-25 | 1997-08-12 | Sony Corporation | Method for making metal oxide sputtering targets (barrier powder envelope) |
US6582641B1 (en) | 1994-08-25 | 2003-06-24 | Praxair S.T. Technology, Inc. | Apparatus and method for making metal oxide sputtering targets |
DE19834733C1 (en) * | 1998-07-31 | 2000-04-27 | Fraunhofer Ges Forschung | Device and method for coating and / or surface modification of objects in a vacuum by means of a plasma |
US6641673B2 (en) * | 2000-12-20 | 2003-11-04 | General Electric Company | Fluid injector for and method of prolonged delivery and distribution of reagents into plasma |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2103623A (en) * | 1933-09-20 | 1937-12-28 | Ion Corp | Electron discharge device for electronically bombarding materials |
DE721580C (en) * | 1937-12-25 | 1942-06-10 | Bernhard Berghaus | Gas supply line and gas discharge line for cathode atomization apparatus |
FR1533195A (en) * | 1966-03-23 | 1968-07-19 | Centre Nat Rech Scient | Improvements in means for the preparation of thin layers of ferrites |
US3464907A (en) * | 1967-02-23 | 1969-09-02 | Victory Eng Corp | Triode sputtering apparatus and method using synchronized pulsating current |
US3595775A (en) * | 1969-05-15 | 1971-07-27 | United Aircraft Corp | Sputtering apparatus with sealed cathode-shield chamber |
FR2071512A5 (en) * | 1969-12-31 | 1971-09-17 | Radiotechnique Compelec | |
US3791955A (en) * | 1972-12-11 | 1974-02-12 | Gte Laboratories Inc | Preparation of chalcogenide glass sputtering targets |
US3850604A (en) * | 1972-12-11 | 1974-11-26 | Gte Laboratories Inc | Preparation of chalcogenide glass sputtering targets |
US3976555A (en) * | 1975-03-20 | 1976-08-24 | Coulter Information Systems, Inc. | Method and apparatus for supplying background gas in a sputtering chamber |
-
1975
- 1975-06-18 DE DE2527184A patent/DE2527184C3/en not_active Expired
-
1976
- 1976-06-10 CA CA254,584A patent/CA1075198A/en not_active Expired
- 1976-06-10 US US05/694,842 patent/US4049523A/en not_active Expired - Lifetime
- 1976-06-15 GB GB24688/76A patent/GB1554285A/en not_active Expired
- 1976-06-15 JP JP51069424A patent/JPS51151685A/en active Granted
- 1976-06-18 FR FR7618568A patent/FR2316350A1/en active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5459046U (en) * | 1977-09-30 | 1979-04-24 |
Also Published As
Publication number | Publication date |
---|---|
JPS5527148B2 (en) | 1980-07-18 |
DE2527184C3 (en) | 1981-07-02 |
CA1075198A (en) | 1980-04-08 |
US4049523A (en) | 1977-09-20 |
DE2527184A1 (en) | 1976-12-30 |
GB1554285A (en) | 1979-10-17 |
FR2316350B1 (en) | 1979-06-22 |
DE2527184B2 (en) | 1980-10-02 |
FR2316350A1 (en) | 1977-01-28 |
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