JPS51151685A - Method of forming thin layer by cathodic spattering process - Google Patents

Method of forming thin layer by cathodic spattering process

Info

Publication number
JPS51151685A
JPS51151685A JP51069424A JP6942476A JPS51151685A JP S51151685 A JPS51151685 A JP S51151685A JP 51069424 A JP51069424 A JP 51069424A JP 6942476 A JP6942476 A JP 6942476A JP S51151685 A JPS51151685 A JP S51151685A
Authority
JP
Japan
Prior art keywords
thin layer
forming thin
spattering process
cathodic
cathodic spattering
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP51069424A
Other languages
English (en)
Other versions
JPS5527148B2 (ja
Inventor
Deiitaa Poenke Rarufu
Getsutsue Parudemaa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koninklijke Philips NV
Original Assignee
Philips Gloeilampenfabrieken NV
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Philips Gloeilampenfabrieken NV filed Critical Philips Gloeilampenfabrieken NV
Publication of JPS51151685A publication Critical patent/JPS51151685A/ja
Publication of JPS5527148B2 publication Critical patent/JPS5527148B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
JP51069424A 1975-06-18 1976-06-15 Method of forming thin layer by cathodic spattering process Granted JPS51151685A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE2527184A DE2527184C3 (de) 1975-06-18 1975-06-18 Vorrichtung zur Herstellung von Targets für Kathodenzerstäubung

Publications (2)

Publication Number Publication Date
JPS51151685A true JPS51151685A (en) 1976-12-27
JPS5527148B2 JPS5527148B2 (ja) 1980-07-18

Family

ID=5949375

Family Applications (1)

Application Number Title Priority Date Filing Date
JP51069424A Granted JPS51151685A (en) 1975-06-18 1976-06-15 Method of forming thin layer by cathodic spattering process

Country Status (6)

Country Link
US (1) US4049523A (ja)
JP (1) JPS51151685A (ja)
CA (1) CA1075198A (ja)
DE (1) DE2527184C3 (ja)
FR (1) FR2316350A1 (ja)
GB (1) GB1554285A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5459046U (ja) * 1977-09-30 1979-04-24

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4135286A (en) * 1977-12-22 1979-01-23 United Technologies Corporation Sputtering target fabrication method
DE3103509C2 (de) * 1981-02-03 1986-11-20 Günter Dr. Dipl.-Phys. 7801 Buchenbach Kleer Target zum Herstellen dünner Schichten, Verfahren zum Erzeugen des Targets und Verwendung des Targets
US4735701A (en) * 1984-08-21 1988-04-05 Komag, Inc. Disk carrier
US4595481A (en) * 1984-08-21 1986-06-17 Komag, Inc. Disk carrier
JPH0774436B2 (ja) * 1990-09-20 1995-08-09 富士通株式会社 薄膜形成方法
US5306405A (en) * 1992-06-26 1994-04-26 Minnesota Mining And Manufacturing Company Sputtering target and method of manufacture
US5637199A (en) * 1992-06-26 1997-06-10 Minnesota Mining And Manufacturing Company Sputtering shields and method of manufacture
US5656216A (en) * 1994-08-25 1997-08-12 Sony Corporation Method for making metal oxide sputtering targets (barrier powder envelope)
US6582641B1 (en) * 1994-08-25 2003-06-24 Praxair S.T. Technology, Inc. Apparatus and method for making metal oxide sputtering targets
DE19834733C1 (de) * 1998-07-31 2000-04-27 Fraunhofer Ges Forschung Vorrichtung und Verfahren zur Beschichtung und/oder Oberflächenmodifizierung von Gegenständen im Vakuum mittels eines Plasmas
US6641673B2 (en) * 2000-12-20 2003-11-04 General Electric Company Fluid injector for and method of prolonged delivery and distribution of reagents into plasma

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2103623A (en) * 1933-09-20 1937-12-28 Ion Corp Electron discharge device for electronically bombarding materials
DE721580C (de) * 1937-12-25 1942-06-10 Bernhard Berghaus Gaszuleitung und Gasableitung fuer Kathodenzerstaeubungsapparate
FR1533195A (fr) * 1966-03-23 1968-07-19 Centre Nat Rech Scient Perfectionnements apportés aux moyens pour la préparation de couches minces de ferrites
US3464907A (en) * 1967-02-23 1969-09-02 Victory Eng Corp Triode sputtering apparatus and method using synchronized pulsating current
US3595775A (en) * 1969-05-15 1971-07-27 United Aircraft Corp Sputtering apparatus with sealed cathode-shield chamber
FR2071512A5 (ja) * 1969-12-31 1971-09-17 Radiotechnique Compelec
US3791955A (en) * 1972-12-11 1974-02-12 Gte Laboratories Inc Preparation of chalcogenide glass sputtering targets
US3850604A (en) * 1972-12-11 1974-11-26 Gte Laboratories Inc Preparation of chalcogenide glass sputtering targets
US3976555A (en) * 1975-03-20 1976-08-24 Coulter Information Systems, Inc. Method and apparatus for supplying background gas in a sputtering chamber

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5459046U (ja) * 1977-09-30 1979-04-24

Also Published As

Publication number Publication date
GB1554285A (en) 1979-10-17
US4049523A (en) 1977-09-20
DE2527184A1 (de) 1976-12-30
DE2527184C3 (de) 1981-07-02
FR2316350B1 (ja) 1979-06-22
CA1075198A (en) 1980-04-08
FR2316350A1 (fr) 1977-01-28
JPS5527148B2 (ja) 1980-07-18
DE2527184B2 (de) 1980-10-02

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