JPS5565448A - Ceramic package for semiconductor device - Google Patents
Ceramic package for semiconductor deviceInfo
- Publication number
- JPS5565448A JPS5565448A JP13887978A JP13887978A JPS5565448A JP S5565448 A JPS5565448 A JP S5565448A JP 13887978 A JP13887978 A JP 13887978A JP 13887978 A JP13887978 A JP 13887978A JP S5565448 A JPS5565448 A JP S5565448A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- ring
- lid
- ceramic body
- depression
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H10W72/5524—
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13887978A JPS5565448A (en) | 1978-11-13 | 1978-11-13 | Ceramic package for semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13887978A JPS5565448A (en) | 1978-11-13 | 1978-11-13 | Ceramic package for semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5565448A true JPS5565448A (en) | 1980-05-16 |
| JPS6129541B2 JPS6129541B2 (OSRAM) | 1986-07-07 |
Family
ID=15232239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13887978A Granted JPS5565448A (en) | 1978-11-13 | 1978-11-13 | Ceramic package for semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5565448A (OSRAM) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6429838U (OSRAM) * | 1987-08-13 | 1989-02-22 | ||
| WO2005011005A1 (ja) * | 2003-07-29 | 2005-02-03 | Hamamatsu Photonics K.K. | 裏面入射型光検出素子及びその製造方法 |
| WO2005086229A1 (ja) * | 2004-03-05 | 2005-09-15 | Neomax Materials Co., Ltd. | 光透過用窓部材、光透過用窓部材を備えた半導体パッケージおよび光透過用窓部材の製造方法 |
| WO2006038395A1 (ja) * | 2004-09-30 | 2006-04-13 | Hitachi, Ltd. | 陽極接合構造を用いた電子装置 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5741102A (en) * | 1980-07-07 | 1982-03-08 | Sameka Sa | Guide apparatus for bar material of automatic lathe |
-
1978
- 1978-11-13 JP JP13887978A patent/JPS5565448A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5741102A (en) * | 1980-07-07 | 1982-03-08 | Sameka Sa | Guide apparatus for bar material of automatic lathe |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6429838U (OSRAM) * | 1987-08-13 | 1989-02-22 | ||
| WO2005011005A1 (ja) * | 2003-07-29 | 2005-02-03 | Hamamatsu Photonics K.K. | 裏面入射型光検出素子及びその製造方法 |
| JP2005051080A (ja) * | 2003-07-29 | 2005-02-24 | Hamamatsu Photonics Kk | 裏面入射型光検出素子及びその製造方法 |
| US7560790B2 (en) | 2003-07-29 | 2009-07-14 | Hamamatsu Photonics K.K. | Backside-illuminated photodetector |
| US7964898B2 (en) | 2003-07-29 | 2011-06-21 | Hamamatsu Photonics K.K. | Back illuminated photodetector |
| WO2005086229A1 (ja) * | 2004-03-05 | 2005-09-15 | Neomax Materials Co., Ltd. | 光透過用窓部材、光透過用窓部材を備えた半導体パッケージおよび光透過用窓部材の製造方法 |
| WO2006038395A1 (ja) * | 2004-09-30 | 2006-04-13 | Hitachi, Ltd. | 陽極接合構造を用いた電子装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6129541B2 (OSRAM) | 1986-07-07 |
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