JPS5558584A - Manufacture of solid display device - Google Patents

Manufacture of solid display device

Info

Publication number
JPS5558584A
JPS5558584A JP13135978A JP13135978A JPS5558584A JP S5558584 A JPS5558584 A JP S5558584A JP 13135978 A JP13135978 A JP 13135978A JP 13135978 A JP13135978 A JP 13135978A JP S5558584 A JPS5558584 A JP S5558584A
Authority
JP
Japan
Prior art keywords
reverse
main surface
electrodes
wafer
grooves
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP13135978A
Other languages
English (en)
Japanese (ja)
Inventor
Yukihiro Hosomi
Masanobu Nojima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP13135978A priority Critical patent/JPS5558584A/ja
Priority to PCT/JP1979/000175 priority patent/WO1980000897A1/fr
Publication of JPS5558584A publication Critical patent/JPS5558584A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission
    • H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars
    • H01L27/156—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components having potential barriers, specially adapted for light emission in a repetitive configuration, e.g. LED bars two-dimensional arrays
    • G—PHYSICS
    • G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
    • G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
    • G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
    • G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
    • G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Theoretical Computer Science (AREA)
  • Led Devices (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Led Device Packages (AREA)
JP13135978A 1978-10-24 1978-10-24 Manufacture of solid display device Pending JPS5558584A (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP13135978A JPS5558584A (en) 1978-10-24 1978-10-24 Manufacture of solid display device
PCT/JP1979/000175 WO1980000897A1 (fr) 1978-10-24 1979-07-02 Methode de fabrication de dispositifs d'affichage utilisant des diodes a emission lumineuse

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13135978A JPS5558584A (en) 1978-10-24 1978-10-24 Manufacture of solid display device

Publications (1)

Publication Number Publication Date
JPS5558584A true JPS5558584A (en) 1980-05-01

Family

ID=15056074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13135978A Pending JPS5558584A (en) 1978-10-24 1978-10-24 Manufacture of solid display device

Country Status (2)

Country Link
JP (1) JPS5558584A (fr)
WO (1) WO1980000897A1 (fr)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018519665A (ja) * 2015-07-16 2018-07-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス装置およびオプトエレクトロニクス装置の製造方法

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2780981B2 (ja) * 1988-06-27 1998-07-30 三菱電機株式会社 多点発光型半導体レーザ及びその製造方法
US5102824A (en) * 1990-11-05 1992-04-07 California Institute Of Technology Method of manufacturing a distributed light emitting diode flat-screen display for use in televisions
NL1029688C2 (nl) * 2005-08-05 2007-02-06 Lemnis Lighting Ip Gmbh Werkwijze voor het vervaardigen van een elektrische schakeling voorzien van een veelvoud van LED's.
RU2465683C1 (ru) * 2011-08-09 2012-10-27 Вячеслав Николаевич Козубов Способ формирования светоизлучающих матриц
RU2474920C1 (ru) * 2011-11-14 2013-02-10 Вячеслав Николаевич Козубов Способ формирования светоизлучающих матриц
RU2492550C1 (ru) * 2012-05-22 2013-09-10 Вячеслав Николаевич Козубов Способ формирования светоизлучающих матриц
DE102015115812A1 (de) 2015-09-18 2017-03-23 Osram Opto Semiconductors Gmbh Bauelement sowie Verfahren zur Herstellung eines Bauelements
CN105742446B (zh) * 2016-04-29 2018-09-04 京东方科技集团股份有限公司 发光元件及其制备方法
DE102021102332A1 (de) * 2021-02-02 2022-08-04 OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung Verfahren zur herstellung einer anordnung von halbleiterchips und anordnung von halbleiterchips

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3800177A (en) * 1971-12-20 1974-03-26 Motorola Inc Integrated light emitting diode display device with housing
JPS5068497A (fr) * 1973-10-18 1975-06-07
JPS50120284A (fr) * 1974-03-05 1975-09-20
JPS5837997B2 (ja) * 1976-04-20 1983-08-19 松下電器産業株式会社 半導体表示装置

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018519665A (ja) * 2015-07-16 2018-07-19 オスラム オプト セミコンダクターズ ゲゼルシャフト ミット ベシュレンクテル ハフツングＯｓｒａｍ Ｏｐｔｏ Ｓｅｍｉｃｏｎｄｕｃｔｏｒｓ ＧｍｂＨ オプトエレクトロニクス装置およびオプトエレクトロニクス装置の製造方法
US10854783B2 (en) 2015-07-16 2020-12-01 Osram Oled Gmbh Optoelectronic arrangement and method for producing an optoelectronic arrangement
US11527678B2 (en) 2015-07-16 2022-12-13 Osram Oled Gmbh Optoelectronic arrangement and method for producing an optoelectronic arrangement

Also Published As

Publication number Publication date
WO1980000897A1 (fr) 1980-05-01

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