JPS5558372A - Substrate - Google Patents
SubstrateInfo
- Publication number
- JPS5558372A JPS5558372A JP13235678A JP13235678A JPS5558372A JP S5558372 A JPS5558372 A JP S5558372A JP 13235678 A JP13235678 A JP 13235678A JP 13235678 A JP13235678 A JP 13235678A JP S5558372 A JPS5558372 A JP S5558372A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- substrate
- glass layer
- crystallized
- oxide layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
PURPOSE:To substrate for electrical wiring which is obtainable by forming an oxide layer on the surface of a metal substrate and further forming a crystallized galss layer and molten glass layer thereon and which is flat in the glass layer surface and is superior in dielectric strength. CONSTITUTION:A metal substrate 1 of 0.1-2.0mm thick of Fe-Ni, Fe-Cr, etc. whose coefficients of thermal expansion are approximate to those of glass is heated to 800-1200 deg.C to form an oxide layer 2 on the surface thereof. Next, a crystallized glass layer 3 composed of glass such as Al2O3, SiO2, B2O3, PbO, TiO2, etc. is formed thereon to thicknesses of 10-30mu, after which it is fired at 800-900 deg.C. The surface of this crystallized glass layer 3 is smooth and in its bottom the crystals firmly combine with the oxide layer 2 and are thereby bonded. Further on this is formed a molten glass layer 4 such as of Al2O3, SiO2, B2O3, PbO, etc. to thicknesses of 30-100mu, which is then fired at 800-900 deg.C. The surface of the molten glass layer 4 becomes good wiring members and has superior characteristics as a wiring substrate and substrate for face heater.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53132356A JPS5811112B2 (en) | 1978-10-27 | 1978-10-27 | substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP53132356A JPS5811112B2 (en) | 1978-10-27 | 1978-10-27 | substrate |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5558372A true JPS5558372A (en) | 1980-05-01 |
JPS5811112B2 JPS5811112B2 (en) | 1983-03-01 |
Family
ID=15079439
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP53132356A Expired JPS5811112B2 (en) | 1978-10-27 | 1978-10-27 | substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5811112B2 (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6018994A (en) * | 1983-07-13 | 1985-01-31 | 日立化成工業株式会社 | Method of producing porcelain substrate for printed circuit board |
JPS6045458U (en) * | 1983-09-07 | 1985-03-30 | 株式会社フジクラ | enameled printed circuit board |
JPS6347957A (en) * | 1986-08-15 | 1988-02-29 | Sumitomo Special Metals Co Ltd | Laminated substrate for electronic component |
JPS6347956A (en) * | 1986-08-15 | 1988-02-29 | Sumitomo Special Metals Co Ltd | Laminated substrate for electronic component |
-
1978
- 1978-10-27 JP JP53132356A patent/JPS5811112B2/en not_active Expired
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6018994A (en) * | 1983-07-13 | 1985-01-31 | 日立化成工業株式会社 | Method of producing porcelain substrate for printed circuit board |
JPH0373158B2 (en) * | 1983-07-13 | 1991-11-20 | Hitachi Chemical Co Ltd | |
JPS6045458U (en) * | 1983-09-07 | 1985-03-30 | 株式会社フジクラ | enameled printed circuit board |
JPH0423340Y2 (en) * | 1983-09-07 | 1992-05-29 | ||
JPS6347957A (en) * | 1986-08-15 | 1988-02-29 | Sumitomo Special Metals Co Ltd | Laminated substrate for electronic component |
JPS6347956A (en) * | 1986-08-15 | 1988-02-29 | Sumitomo Special Metals Co Ltd | Laminated substrate for electronic component |
Also Published As
Publication number | Publication date |
---|---|
JPS5811112B2 (en) | 1983-03-01 |
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