JPS6018994A - Method of producing porcelain substrate for printed circuit board - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a substrate for printed wiring boards having excellent heat resistance and electrical properties. With the recent advancement in electronics, the increasing density of heat exchangers has progressed, and the dissipation of the generated heat and the heat resistance of the base metal are becoming more and more excellent, and the use of alumina, etc. Ceramic round plate etc.1
Historical use is increasing. On the other hand, for the purpose of Shigaku.

Enamel substrates, which can be manufactured into larger substrates and which can be easily formed into three-dimensional shapes that are resistant to scratches, have also begun to attract attention. Shiriki, Shi, Jumei.

Since the shaft frame used for the crawler board is amorphous, it is covered with metal M'T5 such as the iron core, and the surface 5 of the strip is damaged by force during firing.
For example, there is a meniscus at the corner of a through-hole in a gold lead. l! There were drawbacks such as the difficulty in improving the precision of the printed base ribbon during processing. In addition, when explaining the printing paste, because the shaft system of the substrate is softened to 8/8, there is a limit to the firing of the circuit paste, and the paste used for ceramic substrates cannot be used. There were drawbacks such as the inability to eliminate voids and pinholes in the enamel layer with a diameter of nearly 100 μm, which tend to degrade significantly.

11. The present invention does not take into account these points. 10 (Slug
(25,15(BmOs<25.1(SrU<15°4
0 (MgO+CaO+ZnO<70, V<BaO
A step of brazing a metal core with a crushed product of a glass composition containing < 10, and a step of firing this at 700° C. or higher to melt the crushed glass composition and crystallize at least a portion of it. and'(!l-Miyamu is a manufacturing method for printed circuit boards.

This bullet'T: The ratio of the glass composition used] or the abrasive material, the mole% is 10 (Sift (25, '15
(B wing 0x(25,1<5rO(15,40gMgO+
The range is CaO+ZnO<70.0<BaO<10. From W'ELC0x, in the above range, 50<MgO<6
Al with 5.2<BaO<6.2 and BaO+SrO<15. As raw materials for the above-mentioned composition, in addition to the chemical products, it is also possible to use guidoku salt (charcoal salt, nitrate '4F), natural products, and the like. In general, these raw materials are melted to light at a temperature of 1,500 degrees Celsius or higher, preferably 1,000 degrees Celsius. In this way, a glass composition with a negative V amorphous appearance is prepared. It may be added as an additive in an amount less than % of the melting time. Each of these seven representative substances is fL? 1
For example, TiO*, Cr*As mentioned above, the raw materials for the glass composition are melted at an art dealer, then rapidly cooled and crushed into amorphous ducts. The golden order and ancient table... 1. The temperature is over 700°C, so in the 19th century, the temperature is 800°C to 1000°C for more than 6 minutes. During firing, the glaze used in the present invention melts in a short time and rapidly crystallizes and solidifies.

Therefore, when the fluid in the flowing liquid state becomes a dagger, it is possible to suppress the meniscus due to surface tension.
Also, the gap between the particles that existed at the beginning l! The impregnation and other causes of impregnation in 9 and Z6 voids do not grow and remain in a minute state, so the electrical +f factor decreases (1t/).

11. Used in the present invention. 7) A glass composition in which 50 to 100% of the total components crystallize at 900°C or less,
K is preferred for this purpose.

In the present invention, the glaze has a poor re-softening vorticity of the crystallized porcelain and does not soften even at temperatures above 800°C, which reduces the A1 type restrictions on printing pastes and makes it easier to use pastes for ceramic end plates. Effect 4 of expanding the paste selection range?)
The quality of the glaze is about 0 to 40%. The glaze used in the present invention =
%11 disease is caused by mixing with crushed materials.

As mentioned above, there was a limit to the problem of softening of the meniscus and yuzue and voids in the conventional enamel substrate using amorphous glaze 2, but in the present invention, it is possible to improve During the firing of the grade Enoki, the glaze changes from a glassy state to a crystalline feeling (]l-Spoon Kosa+!: By using it, you can try to solve the problems of Jubei. Fruitful example MgO, 58 mol% t BaCOx + 5 mol%, 5
rC (Js2 mol%, 5ift'+s mol%%B103
20 mol% was melted in a platinum crucible at 1500°C (about 1 hour in a bath) and then quenched in a 7.1 roll.
I painted it on a steel plate to crush it. Heat the paste at 850°C for 5 minutes in a forming furnace and roast it. Milky-colored honeysuckle seminal root with Samurai 2. kν or more heart v - "The place where the face was worshiped is about 5 μ ~ 1
A large number of voids of 0 μm were created, and as the swelling grew, large voids of 50 μm or more were observed, and the diameter was 1λ. The meniscus was also softer than conventional amorphous negative yuzu, about 60 μm, more than 1,000 times F, and the printing and annotations were also good. A large number of needle-shaped crystals with a moxibustion strength of 5 to 1 U μ4 were found.

Claims (1)

[Claims] tA, JJjL Department Melt in high vortex and then rapidly cooled, mol%, 10(Sign(25,15(BmOs<25e 1
<5rO(15°40(MgO+CaO+ZnU(70
J (BaO (10f) is a process of coating gold peach core with a crushed product of a glass composition. The printed wiring temporary structure that includes the process of transformation is amazing!i!-Temporary manufacturing method [
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