JPS5553450A - Semiconductor device with resin enclosure - Google Patents

Semiconductor device with resin enclosure

Info

Publication number
JPS5553450A
JPS5553450A JP12624778A JP12624778A JPS5553450A JP S5553450 A JPS5553450 A JP S5553450A JP 12624778 A JP12624778 A JP 12624778A JP 12624778 A JP12624778 A JP 12624778A JP S5553450 A JPS5553450 A JP S5553450A
Authority
JP
Japan
Prior art keywords
tab
hole
semiconductor device
resin enclosure
occurence
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12624778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6249742B2 (enrdf_load_stackoverflow
Inventor
Kunihiko Nishi
Yoshiaki Wakashima
Hideo Inayoshi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP12624778A priority Critical patent/JPS5553450A/ja
Publication of JPS5553450A publication Critical patent/JPS5553450A/ja
Publication of JPS6249742B2 publication Critical patent/JPS6249742B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49503—Lead-frames or other flat leads characterised by the die pad
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP12624778A 1978-10-16 1978-10-16 Semiconductor device with resin enclosure Granted JPS5553450A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12624778A JPS5553450A (en) 1978-10-16 1978-10-16 Semiconductor device with resin enclosure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12624778A JPS5553450A (en) 1978-10-16 1978-10-16 Semiconductor device with resin enclosure

Publications (2)

Publication Number Publication Date
JPS5553450A true JPS5553450A (en) 1980-04-18
JPS6249742B2 JPS6249742B2 (enrdf_load_stackoverflow) 1987-10-21

Family

ID=14930433

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12624778A Granted JPS5553450A (en) 1978-10-16 1978-10-16 Semiconductor device with resin enclosure

Country Status (1)

Country Link
JP (1) JPS5553450A (enrdf_load_stackoverflow)

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4556896A (en) * 1982-08-30 1985-12-03 International Rectifier Corporation Lead frame structure
JPS619840U (ja) * 1984-02-24 1986-01-21 新電元工業株式会社 樹脂封止型半導体装置
JPS6280342U (enrdf_load_stackoverflow) * 1985-11-08 1987-05-22
JPS6329956U (enrdf_load_stackoverflow) * 1986-08-08 1988-02-27
US4768078A (en) * 1983-08-31 1988-08-30 Kabushiki Kaisha Toshiba Plastic-molded semiconductor device
US4884124A (en) * 1986-08-19 1989-11-28 Mitsubishi Denki Kabushiki Kaisha Resin-encapsulated semiconductor device
US4942454A (en) * 1987-08-05 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed semiconductor device
US5023699A (en) * 1980-09-01 1991-06-11 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
US5583381A (en) * 1980-09-01 1996-12-10 Hitachi, Ltd. Resin molded type-semiconductor device having a conductor film
US5753969A (en) * 1995-08-15 1998-05-19 Kabushiki Kaisha Toshiba Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
US5986333A (en) * 1997-02-27 1999-11-16 Oki Electric Industry Co., Ltd. Semiconductor apparatus and method for fabricating the same
US6844615B1 (en) * 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices

Cited By (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5583381A (en) * 1980-09-01 1996-12-10 Hitachi, Ltd. Resin molded type-semiconductor device having a conductor film
US5023699A (en) * 1980-09-01 1991-06-11 Hitachi, Ltd. Resin molded type semiconductor device having a conductor film
US4556896A (en) * 1982-08-30 1985-12-03 International Rectifier Corporation Lead frame structure
US5010390A (en) * 1983-08-31 1991-04-23 Kabushiki Kaisha Toshiba Plastic-molded semiconductor device
US4768078A (en) * 1983-08-31 1988-08-30 Kabushiki Kaisha Toshiba Plastic-molded semiconductor device
JPS619840U (ja) * 1984-02-24 1986-01-21 新電元工業株式会社 樹脂封止型半導体装置
JPS6280342U (enrdf_load_stackoverflow) * 1985-11-08 1987-05-22
JPS6329956U (enrdf_load_stackoverflow) * 1986-08-08 1988-02-27
US4884124A (en) * 1986-08-19 1989-11-28 Mitsubishi Denki Kabushiki Kaisha Resin-encapsulated semiconductor device
US4942454A (en) * 1987-08-05 1990-07-17 Mitsubishi Denki Kabushiki Kaisha Resin sealed semiconductor device
US5753969A (en) * 1995-08-15 1998-05-19 Kabushiki Kaisha Toshiba Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
US6326243B1 (en) * 1995-08-15 2001-12-04 Kabushiki Kaisha Toshiba Resin sealed semiconductor device including a die pad uniformly having heat conducting paths and circulating holes for fluid resin
US5986333A (en) * 1997-02-27 1999-11-16 Oki Electric Industry Co., Ltd. Semiconductor apparatus and method for fabricating the same
US6844615B1 (en) * 2003-03-13 2005-01-18 Amkor Technology, Inc. Leadframe package for semiconductor devices

Also Published As

Publication number Publication date
JPS6249742B2 (enrdf_load_stackoverflow) 1987-10-21

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