JPS6425445A - Resin-sealed electronic component device - Google Patents
Resin-sealed electronic component deviceInfo
- Publication number
- JPS6425445A JPS6425445A JP18274487A JP18274487A JPS6425445A JP S6425445 A JPS6425445 A JP S6425445A JP 18274487 A JP18274487 A JP 18274487A JP 18274487 A JP18274487 A JP 18274487A JP S6425445 A JPS6425445 A JP S6425445A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- case
- electronic component
- climb
- component device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE:To completely cover an electronic component and to suppress the climb of resin on leads by forming longitudinal slits on the inner wall of a resin sealing case. CONSTITUTION:A case 1 has slits 2 on its inner wall. The width and the number of the slits 2 are adjusted in response to the materials of the case and resin to entirely uniformize the climb of the resin to be injected on the case. Accordingly, an electronic component 5 to be contained in the case 1 is completely covered, and less resin 4 can be so injected as to reduce the height of the climb of the resin on leads 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18274487A JPS6425445A (en) | 1987-07-21 | 1987-07-21 | Resin-sealed electronic component device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18274487A JPS6425445A (en) | 1987-07-21 | 1987-07-21 | Resin-sealed electronic component device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6425445A true JPS6425445A (en) | 1989-01-27 |
JPH0570304B2 JPH0570304B2 (en) | 1993-10-04 |
Family
ID=16123677
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18274487A Granted JPS6425445A (en) | 1987-07-21 | 1987-07-21 | Resin-sealed electronic component device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6425445A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10959333B2 (en) | 2018-12-19 | 2021-03-23 | Fuji Electric Co., Ltd. | Semiconductor device |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5552685U (en) * | 1978-09-30 | 1980-04-08 |
-
1987
- 1987-07-21 JP JP18274487A patent/JPS6425445A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5552685U (en) * | 1978-09-30 | 1980-04-08 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10959333B2 (en) | 2018-12-19 | 2021-03-23 | Fuji Electric Co., Ltd. | Semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPH0570304B2 (en) | 1993-10-04 |
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