JPS6425445A - Resin-sealed electronic component device - Google Patents

Resin-sealed electronic component device

Info

Publication number
JPS6425445A
JPS6425445A JP18274487A JP18274487A JPS6425445A JP S6425445 A JPS6425445 A JP S6425445A JP 18274487 A JP18274487 A JP 18274487A JP 18274487 A JP18274487 A JP 18274487A JP S6425445 A JPS6425445 A JP S6425445A
Authority
JP
Japan
Prior art keywords
resin
case
electronic component
climb
component device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP18274487A
Other languages
Japanese (ja)
Other versions
JPH0570304B2 (en
Inventor
Sadao Shimodaira
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP18274487A priority Critical patent/JPS6425445A/en
Publication of JPS6425445A publication Critical patent/JPS6425445A/en
Publication of JPH0570304B2 publication Critical patent/JPH0570304B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE:To completely cover an electronic component and to suppress the climb of resin on leads by forming longitudinal slits on the inner wall of a resin sealing case. CONSTITUTION:A case 1 has slits 2 on its inner wall. The width and the number of the slits 2 are adjusted in response to the materials of the case and resin to entirely uniformize the climb of the resin to be injected on the case. Accordingly, an electronic component 5 to be contained in the case 1 is completely covered, and less resin 4 can be so injected as to reduce the height of the climb of the resin on leads 3.
JP18274487A 1987-07-21 1987-07-21 Resin-sealed electronic component device Granted JPS6425445A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18274487A JPS6425445A (en) 1987-07-21 1987-07-21 Resin-sealed electronic component device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18274487A JPS6425445A (en) 1987-07-21 1987-07-21 Resin-sealed electronic component device

Publications (2)

Publication Number Publication Date
JPS6425445A true JPS6425445A (en) 1989-01-27
JPH0570304B2 JPH0570304B2 (en) 1993-10-04

Family

ID=16123677

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18274487A Granted JPS6425445A (en) 1987-07-21 1987-07-21 Resin-sealed electronic component device

Country Status (1)

Country Link
JP (1) JPS6425445A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10959333B2 (en) 2018-12-19 2021-03-23 Fuji Electric Co., Ltd. Semiconductor device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552685U (en) * 1978-09-30 1980-04-08

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5552685U (en) * 1978-09-30 1980-04-08

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10959333B2 (en) 2018-12-19 2021-03-23 Fuji Electric Co., Ltd. Semiconductor device

Also Published As

Publication number Publication date
JPH0570304B2 (en) 1993-10-04

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