JPS554922A - Lead frame - Google Patents

Lead frame

Info

Publication number
JPS554922A
JPS554922A JP7647878A JP7647878A JPS554922A JP S554922 A JPS554922 A JP S554922A JP 7647878 A JP7647878 A JP 7647878A JP 7647878 A JP7647878 A JP 7647878A JP S554922 A JPS554922 A JP S554922A
Authority
JP
Japan
Prior art keywords
air vent
frame
resin
vent section
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP7647878A
Other languages
English (en)
Japanese (ja)
Other versions
JPS624862B2 (enrdf_load_stackoverflow
Inventor
Kunihiko Nishi
Yoshiaki Wakashima
Hideo Inayoshi
Nobuo Suzuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP7647878A priority Critical patent/JPS554922A/ja
Publication of JPS554922A publication Critical patent/JPS554922A/ja
Publication of JPS624862B2 publication Critical patent/JPS624862B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP7647878A 1978-06-26 1978-06-26 Lead frame Granted JPS554922A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7647878A JPS554922A (en) 1978-06-26 1978-06-26 Lead frame

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7647878A JPS554922A (en) 1978-06-26 1978-06-26 Lead frame

Publications (2)

Publication Number Publication Date
JPS554922A true JPS554922A (en) 1980-01-14
JPS624862B2 JPS624862B2 (enrdf_load_stackoverflow) 1987-02-02

Family

ID=13606292

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7647878A Granted JPS554922A (en) 1978-06-26 1978-06-26 Lead frame

Country Status (1)

Country Link
JP (1) JPS554922A (enrdf_load_stackoverflow)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61146955U (enrdf_load_stackoverflow) * 1985-02-28 1986-09-10
JPS61146956U (enrdf_load_stackoverflow) * 1985-02-28 1986-09-10
JPS61162063U (enrdf_load_stackoverflow) * 1985-03-28 1986-10-07
JPS61269351A (ja) * 1985-05-23 1986-11-28 Nec Yamagata Ltd 半導体装置用リ−ドフレ−ム
JPS61203562U (enrdf_load_stackoverflow) * 1985-06-07 1986-12-22
JPS6268718A (ja) * 1985-09-20 1987-03-28 Matsushita Electric Ind Co Ltd 円盤状記録媒体成形金型および円盤状記録媒体
JPS6276543U (enrdf_load_stackoverflow) * 1985-10-31 1987-05-16
JPS62134253U (enrdf_load_stackoverflow) * 1986-02-14 1987-08-24
KR100242249B1 (ko) * 1997-05-13 2000-02-01 김규현 패키지성형금형구조 및 반도체패키지

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2022065116A1 (ja) 2020-09-24 2022-03-31 日本化薬株式会社 触媒前駆体、それを用いた触媒、化合物の製造方法及び触媒の製造方法

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61146955U (enrdf_load_stackoverflow) * 1985-02-28 1986-09-10
JPS61146956U (enrdf_load_stackoverflow) * 1985-02-28 1986-09-10
JPS61162063U (enrdf_load_stackoverflow) * 1985-03-28 1986-10-07
JPS61269351A (ja) * 1985-05-23 1986-11-28 Nec Yamagata Ltd 半導体装置用リ−ドフレ−ム
JPS61203562U (enrdf_load_stackoverflow) * 1985-06-07 1986-12-22
JPS6268718A (ja) * 1985-09-20 1987-03-28 Matsushita Electric Ind Co Ltd 円盤状記録媒体成形金型および円盤状記録媒体
JPS6276543U (enrdf_load_stackoverflow) * 1985-10-31 1987-05-16
JPS62134253U (enrdf_load_stackoverflow) * 1986-02-14 1987-08-24
KR100242249B1 (ko) * 1997-05-13 2000-02-01 김규현 패키지성형금형구조 및 반도체패키지

Also Published As

Publication number Publication date
JPS624862B2 (enrdf_load_stackoverflow) 1987-02-02

Similar Documents

Publication Publication Date Title
JPS554922A (en) Lead frame
JPS562148A (en) Manufacture of painted molding and its molding metal mold
JPS55128835A (en) Molding method and mold used therefor
JPS6418617A (en) Manufacture of synthetic resin product having skin material
JPS54107967A (en) Mold
JPS57117935A (en) Molding structure for synthetic resin molding
JPS55117627A (en) Metallic mold for forming plastic
JPS5764956A (en) Semiconductor device
JPS649696A (en) Resin molding with circuit
EP0513376A4 (en) Cubic molded article with built-in cubic conductor circuit and production method thereof
JPS5759735A (en) Method of molding article
JPS57193331A (en) Synthetic resin molded product and manufacture thereof
JPS5297183A (en) Production of air tight terminal
JPS5521126A (en) Marking method in resin mold parts
JPS5662347A (en) Production of resin molded ic
JPS55132213A (en) Method of working ornamental thermosetting resin sheet onto curved surface
JPS5217690A (en) Mold process of rubber or plastics
GB953595A (en) Improvements in or relating to the manufacture of moulds
JPS5692069A (en) Type wheel for printer
JPS57149043A (en) Shell mold material for light alloy casting and mold molded by heating from this
JPS5761541A (en) Transfer molding
JPS5770701A (en) Method of moldingtre to wheel rim
JPS55148412A (en) Stabilizer for electric-discharge lamp provided with capacitor and its manufacture
JPS57171525A (en) Sharp edge molding and processing method
JPS5788748A (en) Semiconductor device