JPS5548951A - Ic package - Google Patents

Ic package

Info

Publication number
JPS5548951A
JPS5548951A JP12224778A JP12224778A JPS5548951A JP S5548951 A JPS5548951 A JP S5548951A JP 12224778 A JP12224778 A JP 12224778A JP 12224778 A JP12224778 A JP 12224778A JP S5548951 A JPS5548951 A JP S5548951A
Authority
JP
Japan
Prior art keywords
heat
discharge
package
chip
cover
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12224778A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6111469B2 (enrdf_load_stackoverflow
Inventor
Kiyoshi Hayamizu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP12224778A priority Critical patent/JPS5548951A/ja
Publication of JPS5548951A publication Critical patent/JPS5548951A/ja
Publication of JPS6111469B2 publication Critical patent/JPS6111469B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP12224778A 1978-10-03 1978-10-03 Ic package Granted JPS5548951A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12224778A JPS5548951A (en) 1978-10-03 1978-10-03 Ic package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12224778A JPS5548951A (en) 1978-10-03 1978-10-03 Ic package

Publications (2)

Publication Number Publication Date
JPS5548951A true JPS5548951A (en) 1980-04-08
JPS6111469B2 JPS6111469B2 (enrdf_load_stackoverflow) 1986-04-03

Family

ID=14831228

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12224778A Granted JPS5548951A (en) 1978-10-03 1978-10-03 Ic package

Country Status (1)

Country Link
JP (1) JPS5548951A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207770A (ja) * 1984-03-30 1985-10-19 Sumitomo Metal Ind Ltd 圧延機スタンド内ロ−ル研削方法
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPS62168253U (enrdf_load_stackoverflow) * 1986-04-15 1987-10-26
JPH01177972A (ja) * 1988-01-08 1989-07-14 Electric Power Dev Co Ltd 液体ジェット加工装置の研摩材供給装置
US5168671A (en) * 1989-05-30 1992-12-08 Fuji Seiki Machine Works, Ltd. Dressing method and apparatus for super abrasive grinding wheel

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS60207770A (ja) * 1984-03-30 1985-10-19 Sumitomo Metal Ind Ltd 圧延機スタンド内ロ−ル研削方法
US4684975A (en) * 1985-12-16 1987-08-04 National Semiconductor Corporation Molded semiconductor package having improved heat dissipation
JPS62168253U (enrdf_load_stackoverflow) * 1986-04-15 1987-10-26
JPH01177972A (ja) * 1988-01-08 1989-07-14 Electric Power Dev Co Ltd 液体ジェット加工装置の研摩材供給装置
US5168671A (en) * 1989-05-30 1992-12-08 Fuji Seiki Machine Works, Ltd. Dressing method and apparatus for super abrasive grinding wheel

Also Published As

Publication number Publication date
JPS6111469B2 (enrdf_load_stackoverflow) 1986-04-03

Similar Documents

Publication Publication Date Title
GB2088635B (en) Encapsulation for semiconductor integrated circuit chip
GB2132820B (en) Integrated circuit chip package
DE3369428D1 (en) Process for encapsulating semi-conductor components and encapsulated components so obtained
JPS5591856A (en) Semiconductor integrated circuit chip structure
EP0035093A3 (en) Arrangement for packing several fast-switching semiconductor chips
FR2538617B1 (fr) Boitier d'encapsulation pour semiconducteur de puissance, a isolement entree-sortie ameliore
DE3370407D1 (en) Package for a semiconductor chip with lead terminals
JPS5548951A (en) Ic package
GB8332106D0 (en) Semiconductor device encapsulation
DE3381665D1 (de) Halbleiteranordnung in harz-verkapselung.
JPS532083A (en) Liquid cool semiconductor package
GB2146174B (en) Hermetic power chip packages
EP0069902A3 (en) Current rectifier device
JPS53126276A (en) Heat dissipation construction of multichip mounting substrate
DE3380797D1 (en) Semiconductor chip assembly including a thermal radiator plate
JPS54128269A (en) Hybrid package type integrated circuit device
JPS5290268A (en) Semiconductor device
JPS53135579A (en) Liquid sealing semiconductor device
JPS5345987A (en) Semiconductor integrated circuit element
JPS51112177A (en) Semiconductor equipment
JPS533065A (en) Package of semiconductor circuit device
SU1137402A1 (ru) Микросборка
DE3175776D1 (en) Semiconductor memory chip, and a memory device including such chips
IT1164597B (it) Dispositivo distributore di calore auto-posizionante in particolare per la produzione di dispositivi a semiconduttore incapsulati
JPS52155322A (en) Semiconductor rectifier stack