JPS5544756A - Semiconductor and manufacture thereof - Google Patents

Semiconductor and manufacture thereof

Info

Publication number
JPS5544756A
JPS5544756A JP11822478A JP11822478A JPS5544756A JP S5544756 A JPS5544756 A JP S5544756A JP 11822478 A JP11822478 A JP 11822478A JP 11822478 A JP11822478 A JP 11822478A JP S5544756 A JPS5544756 A JP S5544756A
Authority
JP
Japan
Prior art keywords
insulating film
window
glass
junction
exposed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11822478A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6130736B2 (enExample
Inventor
Masatake Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP11822478A priority Critical patent/JPS5544756A/ja
Publication of JPS5544756A publication Critical patent/JPS5544756A/ja
Publication of JPS6130736B2 publication Critical patent/JPS6130736B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/11—Manufacturing methods

Landscapes

  • Electrodes Of Semiconductors (AREA)
  • Formation Of Insulating Films (AREA)
JP11822478A 1978-09-25 1978-09-25 Semiconductor and manufacture thereof Granted JPS5544756A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11822478A JPS5544756A (en) 1978-09-25 1978-09-25 Semiconductor and manufacture thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11822478A JPS5544756A (en) 1978-09-25 1978-09-25 Semiconductor and manufacture thereof

Publications (2)

Publication Number Publication Date
JPS5544756A true JPS5544756A (en) 1980-03-29
JPS6130736B2 JPS6130736B2 (enExample) 1986-07-15

Family

ID=14731286

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11822478A Granted JPS5544756A (en) 1978-09-25 1978-09-25 Semiconductor and manufacture thereof

Country Status (1)

Country Link
JP (1) JPS5544756A (enExample)

Also Published As

Publication number Publication date
JPS6130736B2 (enExample) 1986-07-15

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