JPS5543475A - Working method of parts of clock or wafer - Google Patents

Working method of parts of clock or wafer

Info

Publication number
JPS5543475A
JPS5543475A JP11766778A JP11766778A JPS5543475A JP S5543475 A JPS5543475 A JP S5543475A JP 11766778 A JP11766778 A JP 11766778A JP 11766778 A JP11766778 A JP 11766778A JP S5543475 A JPS5543475 A JP S5543475A
Authority
JP
Japan
Prior art keywords
substrate
wax
work
impregnated
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11766778A
Other languages
Japanese (ja)
Other versions
JPS6228434B2 (en
Inventor
Katsura Watanabe
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Watch Co Ltd
Original Assignee
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Citizen Watch Co Ltd filed Critical Citizen Watch Co Ltd
Priority to JP11766778A priority Critical patent/JPS5543475A/en
Publication of JPS5543475A publication Critical patent/JPS5543475A/en
Publication of JPS6228434B2 publication Critical patent/JPS6228434B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G04—HOROLOGY
    • G04G—ELECTRONIC TIME-PIECES
    • G04G17/00—Structural details; Housings

Abstract

PURPOSE:To perform the high accurate lapping process and polishing process by making the wax impregnated porous substrate an adhesive substrate and thereby effectively securing the compact parts of the clocks and the electronic equipments. CONSTITUTION:To the metallic powder and the like such as Al2O3, SiO2, the binder such as Co, Ni are added and the obtained is molded, heated and sintered (about 850-1500 deg.C) under the reductive atmosphere, and the porous type sintered plate having porosity of about 40-65%, compression strength of about 100- 700kg/cm<2>. Then, the wax comprising mainly rosin, shellac, and paraffin and having the melting point of about 100 deg.C is impregnated under vacuum or forcibly impregnated under heating on the porous type sintered plate to form the connected substrate. Said substrate 1 has the surface which is wiped and cleaned by the solvent, and thereafter, the work 2 is mounted directly thereon and while applying pressure, the substrate 1 is heated higher than the melting point of the wax, and the wax floating up on the substrate surface 1 due to capillarity is employed for securing the work 2 to the substrate 1 effectively and giving work.
JP11766778A 1978-09-25 1978-09-25 Working method of parts of clock or wafer Granted JPS5543475A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11766778A JPS5543475A (en) 1978-09-25 1978-09-25 Working method of parts of clock or wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11766778A JPS5543475A (en) 1978-09-25 1978-09-25 Working method of parts of clock or wafer

Publications (2)

Publication Number Publication Date
JPS5543475A true JPS5543475A (en) 1980-03-27
JPS6228434B2 JPS6228434B2 (en) 1987-06-19

Family

ID=14717293

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11766778A Granted JPS5543475A (en) 1978-09-25 1978-09-25 Working method of parts of clock or wafer

Country Status (1)

Country Link
JP (1) JPS5543475A (en)

Also Published As

Publication number Publication date
JPS6228434B2 (en) 1987-06-19

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