JPS55136148A - Seal bonding method - Google Patents
Seal bonding methodInfo
- Publication number
- JPS55136148A JPS55136148A JP4029179A JP4029179A JPS55136148A JP S55136148 A JPS55136148 A JP S55136148A JP 4029179 A JP4029179 A JP 4029179A JP 4029179 A JP4029179 A JP 4029179A JP S55136148 A JPS55136148 A JP S55136148A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- tube
- seal
- seal bonding
- sapphire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
PURPOSE: To reduce occurrence of stress, strain, etc. and perform favorable seal bonding by melting the surface alone of an end of optically polished glass when an inorg. material whose m.p. is higher than that of the glass is seal bonded to the end by heating.
CONSTITUTION: On an end of optically polished glass tube 21 inog. material such as mirror-polished sapphire 22 whose m.p. is higher than that of tube 21 is placed and pressurized with weighting material 23 such as carbon piece of 10g or less. The pressurized adjacent portion alone between tube 21 and sapphire 22 is then seal bonded by strong heating, e.g., from 300°C to 800°C within 1min with heating element 24 such as high frequency heating element. By this method unfavorable influence due to intermediate presence of an adhesive, solder-glass or the like, e.g., pinholes after seal bonding can be eliminated.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4029179A JPS55136148A (en) | 1979-04-05 | 1979-04-05 | Seal bonding method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP4029179A JPS55136148A (en) | 1979-04-05 | 1979-04-05 | Seal bonding method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS55136148A true JPS55136148A (en) | 1980-10-23 |
Family
ID=12576492
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP4029179A Pending JPS55136148A (en) | 1979-04-05 | 1979-04-05 | Seal bonding method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55136148A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6227356A (en) * | 1985-07-25 | 1987-02-05 | Toshiba Corp | Joining method by glass |
JPS62123075A (en) * | 1985-11-21 | 1987-06-04 | 株式会社東芝 | Manufacture of double layer dielectric |
JP2014201452A (en) * | 2013-04-01 | 2014-10-27 | 日本電気硝子株式会社 | Glass-ceramic joined body |
-
1979
- 1979-04-05 JP JP4029179A patent/JPS55136148A/en active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6227356A (en) * | 1985-07-25 | 1987-02-05 | Toshiba Corp | Joining method by glass |
JPS62123075A (en) * | 1985-11-21 | 1987-06-04 | 株式会社東芝 | Manufacture of double layer dielectric |
JP2014201452A (en) * | 2013-04-01 | 2014-10-27 | 日本電気硝子株式会社 | Glass-ceramic joined body |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPS5543819A (en) | Pressure detecting equipment | |
EP0109695A3 (en) | Optical communication element | |
FR2391974A1 (en) | Composite ceramic-metal laminate - with intermediate low modulus, low density material absorbing thermal deformations | |
JPS55136148A (en) | Seal bonding method | |
YU24588A (en) | Process for obtaining rubber - metal connections by using thermostable adhesive | |
JPS51134071A (en) | Method to eliminate crystal defects of silicon | |
JPS5567544A (en) | Glass fusion bonding method for metal plate for seal bonding | |
JPS537093A (en) | Composite panel | |
JPS5219105A (en) | Nonoxidative sintering and forging method | |
DE2961389D1 (en) | Substrate for the detection of alpha-amylase and method for its preparation | |
JPS52104282A (en) | Detection method of scaratches on surface of intermmediate metal mater ials | |
JPS5644622A (en) | Bonding of fiber-reinforced plastic pipe and metal fitting | |
JPS5516439A (en) | Resin seal semiconductor device | |
JPS52140915A (en) | Bonding of troughs | |
JPS56163873A (en) | Grinding of lens-shaped object and similar one | |
JPS52115181A (en) | Sealing method for semiconductor devices | |
JPS5414287A (en) | Stress sensor using elastic surface wave elements | |
JPS53112242A (en) | Soldering method | |
JPS5720575A (en) | Mechanical fuel pump | |
CH632891GA3 (en) | Process for producing a watch-glass | |
JPS53119938A (en) | Method of adhesion | |
JPS5377468A (en) | Ic bonding sealing method | |
JPS53141663A (en) | Sealing member for watch cases | |
Schlimmer | Description of the Bauschinger Effect | |
JPS5610328A (en) | Constant pressure type deoxidizer |