JPS55136148A - Seal bonding method - Google Patents

Seal bonding method

Info

Publication number
JPS55136148A
JPS55136148A JP4029179A JP4029179A JPS55136148A JP S55136148 A JPS55136148 A JP S55136148A JP 4029179 A JP4029179 A JP 4029179A JP 4029179 A JP4029179 A JP 4029179A JP S55136148 A JPS55136148 A JP S55136148A
Authority
JP
Japan
Prior art keywords
glass
tube
seal
seal bonding
sapphire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP4029179A
Other languages
Japanese (ja)
Inventor
Tatsuo Nomaki
Kiyomitsu Ishihara
Haruaki Natori
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP4029179A priority Critical patent/JPS55136148A/en
Publication of JPS55136148A publication Critical patent/JPS55136148A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To reduce occurrence of stress, strain, etc. and perform favorable seal bonding by melting the surface alone of an end of optically polished glass when an inorg. material whose m.p. is higher than that of the glass is seal bonded to the end by heating.
CONSTITUTION: On an end of optically polished glass tube 21 inog. material such as mirror-polished sapphire 22 whose m.p. is higher than that of tube 21 is placed and pressurized with weighting material 23 such as carbon piece of 10g or less. The pressurized adjacent portion alone between tube 21 and sapphire 22 is then seal bonded by strong heating, e.g., from 300°C to 800°C within 1min with heating element 24 such as high frequency heating element. By this method unfavorable influence due to intermediate presence of an adhesive, solder-glass or the like, e.g., pinholes after seal bonding can be eliminated.
COPYRIGHT: (C)1980,JPO&Japio
JP4029179A 1979-04-05 1979-04-05 Seal bonding method Pending JPS55136148A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP4029179A JPS55136148A (en) 1979-04-05 1979-04-05 Seal bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP4029179A JPS55136148A (en) 1979-04-05 1979-04-05 Seal bonding method

Publications (1)

Publication Number Publication Date
JPS55136148A true JPS55136148A (en) 1980-10-23

Family

ID=12576492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP4029179A Pending JPS55136148A (en) 1979-04-05 1979-04-05 Seal bonding method

Country Status (1)

Country Link
JP (1) JPS55136148A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6227356A (en) * 1985-07-25 1987-02-05 Toshiba Corp Joining method by glass
JPS62123075A (en) * 1985-11-21 1987-06-04 株式会社東芝 Manufacture of double layer dielectric
JP2014201452A (en) * 2013-04-01 2014-10-27 日本電気硝子株式会社 Glass-ceramic joined body

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6227356A (en) * 1985-07-25 1987-02-05 Toshiba Corp Joining method by glass
JPS62123075A (en) * 1985-11-21 1987-06-04 株式会社東芝 Manufacture of double layer dielectric
JP2014201452A (en) * 2013-04-01 2014-10-27 日本電気硝子株式会社 Glass-ceramic joined body

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