JPS5538075A - Wiring - Google Patents

Wiring

Info

Publication number
JPS5538075A
JPS5538075A JP11199378A JP11199378A JPS5538075A JP S5538075 A JPS5538075 A JP S5538075A JP 11199378 A JP11199378 A JP 11199378A JP 11199378 A JP11199378 A JP 11199378A JP S5538075 A JPS5538075 A JP S5538075A
Authority
JP
Japan
Prior art keywords
layers
wire
metallic
substrate
metallic layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11199378A
Other languages
Japanese (ja)
Other versions
JPS611891B2 (en
Inventor
Koichi Kobayashi
Tetsuya Ogawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP11199378A priority Critical patent/JPS5538075A/en
Publication of JPS5538075A publication Critical patent/JPS5538075A/en
Publication of JPS611891B2 publication Critical patent/JPS611891B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Drying Of Semiconductors (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)

Abstract

PURPOSE: To obtain higher integration and dnsity in an IC or a LSI by forming upper and lower wire layers on the surface of a substrate with steep and deep grooves and on the groove bottoms and dividing each wire layer in the direction of the substrate thickness.
CONSTITUTION: A metallic layer pattern 12 composed of Al, etc. is formed on a substrate 11 of SiO2,Si, etc., active spatter etching by CF4 gas, etc. is carried out using this metallic layer pattern as a mask and grooves 13 with steep slopes 13a are formed. At this time the metallic masks 12 become dull and part of them hang over each groove. Wire materials such as Al, poly Si,Mo, etc. are let to adhere to these metallic layers 12 in the mask of the layers and upper and lower wire layers 14,15 are formed on the metallic layer surface and the groove bottoms. Therefore, the spaces between the upper and the lower wrie layers are allowed to partially be overlapped in two dimensions but separated in three dimensions and the wire density can be improved.
COPYRIGHT: (C)1980,JPO&Japio
JP11199378A 1978-09-12 1978-09-12 Wiring Granted JPS5538075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP11199378A JPS5538075A (en) 1978-09-12 1978-09-12 Wiring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11199378A JPS5538075A (en) 1978-09-12 1978-09-12 Wiring

Publications (2)

Publication Number Publication Date
JPS5538075A true JPS5538075A (en) 1980-03-17
JPS611891B2 JPS611891B2 (en) 1986-01-21

Family

ID=14575249

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11199378A Granted JPS5538075A (en) 1978-09-12 1978-09-12 Wiring

Country Status (1)

Country Link
JP (1) JPS5538075A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727047A (en) * 1980-07-25 1982-02-13 Seiko Epson Corp Semiconductor device
JPS5730345A (en) * 1980-07-31 1982-02-18 Seiko Epson Corp Semiconductor device
JPS5731160A (en) * 1980-08-01 1982-02-19 Seiko Epson Corp Semiconductor device
JPS5773970A (en) * 1980-10-28 1982-05-08 Seiko Epson Corp Semiconductor device
JPS6357776U (en) * 1986-10-01 1988-04-18

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5727047A (en) * 1980-07-25 1982-02-13 Seiko Epson Corp Semiconductor device
JPS5730345A (en) * 1980-07-31 1982-02-18 Seiko Epson Corp Semiconductor device
JPS5731160A (en) * 1980-08-01 1982-02-19 Seiko Epson Corp Semiconductor device
JPS5773970A (en) * 1980-10-28 1982-05-08 Seiko Epson Corp Semiconductor device
JPS6357776U (en) * 1986-10-01 1988-04-18

Also Published As

Publication number Publication date
JPS611891B2 (en) 1986-01-21

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