JPS5534485A - Manufacture of resin sealed type semiconductor - Google Patents

Manufacture of resin sealed type semiconductor

Info

Publication number
JPS5534485A
JPS5534485A JP10786178A JP10786178A JPS5534485A JP S5534485 A JPS5534485 A JP S5534485A JP 10786178 A JP10786178 A JP 10786178A JP 10786178 A JP10786178 A JP 10786178A JP S5534485 A JPS5534485 A JP S5534485A
Authority
JP
Japan
Prior art keywords
burrs
lead
resin
burr
resin sealed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10786178A
Other languages
Japanese (ja)
Other versions
JPS5845189B2 (en
Inventor
Kazunari Michii
Hiroshi Shimoda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP10786178A priority Critical patent/JPS5845189B2/en
Publication of JPS5534485A publication Critical patent/JPS5534485A/en
Publication of JPS5845189B2 publication Critical patent/JPS5845189B2/en
Expired legal-status Critical Current

Links

Landscapes

  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PURPOSE: To prevent the generation of burrs of plated metal by removing burrs after plating on outer leads thru a process wherein semiconductor element being attached on lead frame is resin sealed and concave is made on the surface of lead in contact with resin burrs.
CONSTITUTION: Semiconductor element being attached on lead frame 1 is resin sealed 2, surface of outer lead 3 is scraped along the marginal area of outer leads in contact with resin burr 5 being generated between leads, and the surface is removed by providing concaved part 8 thru chemical polishing or the like. By the above processing, surface of the outer lead 3 is rounded making step between the burr 5 and lead 3, which acts as a dam at the time of plating 6 and the plated metal 6 never protrudes above the burr 5. Then, the burrs are removed and semiconductor device is available. Subsequently, generation of burrs of plated metal is prevented by which short circuiting caused by metal burrs is precluded.
COPYRIGHT: (C)1980,JPO&Japio
JP10786178A 1978-09-01 1978-09-01 Manufacturing method for resin-encapsulated semiconductor device Expired JPS5845189B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10786178A JPS5845189B2 (en) 1978-09-01 1978-09-01 Manufacturing method for resin-encapsulated semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10786178A JPS5845189B2 (en) 1978-09-01 1978-09-01 Manufacturing method for resin-encapsulated semiconductor device

Publications (2)

Publication Number Publication Date
JPS5534485A true JPS5534485A (en) 1980-03-11
JPS5845189B2 JPS5845189B2 (en) 1983-10-07

Family

ID=14469923

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10786178A Expired JPS5845189B2 (en) 1978-09-01 1978-09-01 Manufacturing method for resin-encapsulated semiconductor device

Country Status (1)

Country Link
JP (1) JPS5845189B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272061A (en) * 1987-04-30 1988-11-09 Kyocera Corp Manufacture of plug-in type semiconductor device housing package

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63272061A (en) * 1987-04-30 1988-11-09 Kyocera Corp Manufacture of plug-in type semiconductor device housing package

Also Published As

Publication number Publication date
JPS5845189B2 (en) 1983-10-07

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