JPS5534485A - Manufacture of resin sealed type semiconductor - Google Patents
Manufacture of resin sealed type semiconductorInfo
- Publication number
- JPS5534485A JPS5534485A JP10786178A JP10786178A JPS5534485A JP S5534485 A JPS5534485 A JP S5534485A JP 10786178 A JP10786178 A JP 10786178A JP 10786178 A JP10786178 A JP 10786178A JP S5534485 A JPS5534485 A JP S5534485A
- Authority
- JP
- Japan
- Prior art keywords
- burrs
- lead
- resin
- burr
- resin sealed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
PURPOSE: To prevent the generation of burrs of plated metal by removing burrs after plating on outer leads thru a process wherein semiconductor element being attached on lead frame is resin sealed and concave is made on the surface of lead in contact with resin burrs.
CONSTITUTION: Semiconductor element being attached on lead frame 1 is resin sealed 2, surface of outer lead 3 is scraped along the marginal area of outer leads in contact with resin burr 5 being generated between leads, and the surface is removed by providing concaved part 8 thru chemical polishing or the like. By the above processing, surface of the outer lead 3 is rounded making step between the burr 5 and lead 3, which acts as a dam at the time of plating 6 and the plated metal 6 never protrudes above the burr 5. Then, the burrs are removed and semiconductor device is available. Subsequently, generation of burrs of plated metal is prevented by which short circuiting caused by metal burrs is precluded.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10786178A JPS5845189B2 (en) | 1978-09-01 | 1978-09-01 | Manufacturing method for resin-encapsulated semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10786178A JPS5845189B2 (en) | 1978-09-01 | 1978-09-01 | Manufacturing method for resin-encapsulated semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5534485A true JPS5534485A (en) | 1980-03-11 |
JPS5845189B2 JPS5845189B2 (en) | 1983-10-07 |
Family
ID=14469923
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10786178A Expired JPS5845189B2 (en) | 1978-09-01 | 1978-09-01 | Manufacturing method for resin-encapsulated semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5845189B2 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63272061A (en) * | 1987-04-30 | 1988-11-09 | Kyocera Corp | Manufacture of plug-in type semiconductor device housing package |
-
1978
- 1978-09-01 JP JP10786178A patent/JPS5845189B2/en not_active Expired
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63272061A (en) * | 1987-04-30 | 1988-11-09 | Kyocera Corp | Manufacture of plug-in type semiconductor device housing package |
Also Published As
Publication number | Publication date |
---|---|
JPS5845189B2 (en) | 1983-10-07 |
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