JPS5534429A - Bonding device - Google Patents

Bonding device

Info

Publication number
JPS5534429A
JPS5534429A JP10644378A JP10644378A JPS5534429A JP S5534429 A JPS5534429 A JP S5534429A JP 10644378 A JP10644378 A JP 10644378A JP 10644378 A JP10644378 A JP 10644378A JP S5534429 A JPS5534429 A JP S5534429A
Authority
JP
Japan
Prior art keywords
distance
bonding
capillary
level
daturm
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10644378A
Other languages
Japanese (ja)
Other versions
JPS5758056B2 (en
Inventor
Kazuo Kachi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP10644378A priority Critical patent/JPS5534429A/en
Publication of JPS5534429A publication Critical patent/JPS5534429A/en
Publication of JPS5758056B2 publication Critical patent/JPS5758056B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H01L2224/78302—Shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78343—Means for applying energy, e.g. heating means by means of pressure by ultrasonic vibrations
    • H01L2224/78344—Eccentric cams
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE: To uniformalize the strength of bonding, by equalizing the crush width of a wire by measuring distance between a datum level and a bonding surface and by adjusting an operational extent of a pressure welding body so that the quantity of the pressure welding body, which sinks, become fixed in response to the distance.
CONSTITUTION: When a bonding arm 4 is oscillated up and down by means of a cam 8, etc., and a nose portion of a capillary 2 contacts with a bonding pad 1 surface of an IC chip installed to a datum level G, distance H between the daturm level G and a surface where the IC chip contacts with the capillary is measured by means of methods, such as, the output of electric signals corresponding to distance L between an electrostatic capacity displacement meter 12 and a cover plate 13. When the distance deviates from fixed value, a controller 14 puts out signals increasing or decreasing distance l between the daturm level G and a fulcrum 5 of the bonding arm 4, the whole arm drive system support body 6 is moved up and down, the quantity of the capillary 2, which sinks, is corrected and the crush width ϕD of a wire 3 is continually made constant.
COPYRIGHT: (C)1980,JPO&Japio
JP10644378A 1978-08-31 1978-08-31 Bonding device Granted JPS5534429A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP10644378A JPS5534429A (en) 1978-08-31 1978-08-31 Bonding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10644378A JPS5534429A (en) 1978-08-31 1978-08-31 Bonding device

Publications (2)

Publication Number Publication Date
JPS5534429A true JPS5534429A (en) 1980-03-11
JPS5758056B2 JPS5758056B2 (en) 1982-12-08

Family

ID=14433759

Family Applications (1)

Application Number Title Priority Date Filing Date
JP10644378A Granted JPS5534429A (en) 1978-08-31 1978-08-31 Bonding device

Country Status (1)

Country Link
JP (1) JPS5534429A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPH0272644A (en) * 1988-09-07 1990-03-12 Hitachi Ltd Method and apparatus for manufacturing semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5574152A (en) * 1978-11-22 1980-06-04 Kulicke & Soffa Ind Inc Wire bonding device
JPH0152896B2 (en) * 1978-11-22 1989-11-10 Kurike Ando Sofua Ind Inc
JPH0272644A (en) * 1988-09-07 1990-03-12 Hitachi Ltd Method and apparatus for manufacturing semiconductor device
JP2569142B2 (en) * 1988-09-07 1997-01-08 株式会社日立製作所 Semiconductor device manufacturing equipment

Also Published As

Publication number Publication date
JPS5758056B2 (en) 1982-12-08

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