JPS5533080A - Method of adhering semiconductor substrate - Google Patents
Method of adhering semiconductor substrateInfo
- Publication number
- JPS5533080A JPS5533080A JP10679178A JP10679178A JPS5533080A JP S5533080 A JPS5533080 A JP S5533080A JP 10679178 A JP10679178 A JP 10679178A JP 10679178 A JP10679178 A JP 10679178A JP S5533080 A JPS5533080 A JP S5533080A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- support
- substrate
- fed
- semiconductor substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/741—Apparatus for manufacturing means for bonding, e.g. connectors
- H01L24/743—Apparatus for manufacturing layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/75—Apparatus for connecting with bump connectors or layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Die Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10679178A JPS5533080A (en) | 1978-08-30 | 1978-08-30 | Method of adhering semiconductor substrate |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP10679178A JPS5533080A (en) | 1978-08-30 | 1978-08-30 | Method of adhering semiconductor substrate |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5533080A true JPS5533080A (en) | 1980-03-08 |
Family
ID=14442709
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP10679178A Pending JPS5533080A (en) | 1978-08-30 | 1978-08-30 | Method of adhering semiconductor substrate |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5533080A (ja) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6945447B2 (en) * | 2002-06-05 | 2005-09-20 | Northrop Grumman Corporation | Thermal solder writing eutectic bonding process and apparatus |
JP2015056661A (ja) * | 2013-09-11 | 2015-03-23 | エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド | 活性化フォーミングガスを利用するダイ取付装置及び方法 |
-
1978
- 1978-08-30 JP JP10679178A patent/JPS5533080A/ja active Pending
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6945447B2 (en) * | 2002-06-05 | 2005-09-20 | Northrop Grumman Corporation | Thermal solder writing eutectic bonding process and apparatus |
JP2015056661A (ja) * | 2013-09-11 | 2015-03-23 | エーエスエム・テクノロジー・シンガポール・ピーティーイー・リミテッド | 活性化フォーミングガスを利用するダイ取付装置及び方法 |
US10399170B2 (en) | 2013-09-11 | 2019-09-03 | Asm Technology Singapore Pte Ltd | Die attachment apparatus and method utilizing activated forming gas |
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