JPS5529195A - Method of forming thin film mutual connecting system - Google Patents

Method of forming thin film mutual connecting system

Info

Publication number
JPS5529195A
JPS5529195A JP9621179A JP9621179A JPS5529195A JP S5529195 A JPS5529195 A JP S5529195A JP 9621179 A JP9621179 A JP 9621179A JP 9621179 A JP9621179 A JP 9621179A JP S5529195 A JPS5529195 A JP S5529195A
Authority
JP
Japan
Prior art keywords
thin film
connecting system
forming thin
mutual connecting
film mutual
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9621179A
Other languages
English (en)
Other versions
JPS6260813B2 (ja
Inventor
Chiyangu Kenesu
Seshiru Kosuman Deebitsudo
Mashiyuu Gaatonaa Herumiyuuto
Jiyon Hoogu Jiyunia Ansonii
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5529195A publication Critical patent/JPS5529195A/ja
Publication of JPS6260813B2 publication Critical patent/JPS6260813B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/09—Photosensitive materials characterised by structural details, e.g. supports, auxiliary layers
    • G03F7/094—Multilayer resist systems, e.g. planarising layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0332—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their composition, e.g. multilayer masks, materials
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/3213—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer
    • H01L21/32133—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only
    • H01L21/32135—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only
    • H01L21/32136—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas
    • H01L21/32137—Physical or chemical etching of the layers, e.g. to produce a patterned layer from a pre-deposited extensive layer by chemical means only by vapour etching only using plasmas of silicon-containing layers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76801—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing
    • H01L21/76802—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics characterised by the formation and the after-treatment of the dielectrics, e.g. smoothing by forming openings in dielectrics

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • General Chemical & Material Sciences (AREA)
  • Plasma & Fusion (AREA)
  • Architecture (AREA)
  • Structural Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Weting (AREA)
JP9621179A 1978-08-21 1979-07-30 Method of forming thin film mutual connecting system Granted JPS5529195A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/935,286 US4184909A (en) 1978-08-21 1978-08-21 Method of forming thin film interconnection systems

Publications (2)

Publication Number Publication Date
JPS5529195A true JPS5529195A (en) 1980-03-01
JPS6260813B2 JPS6260813B2 (ja) 1987-12-18

Family

ID=25466865

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9621179A Granted JPS5529195A (en) 1978-08-21 1979-07-30 Method of forming thin film mutual connecting system

Country Status (4)

Country Link
US (1) US4184909A (ja)
EP (1) EP0008359B1 (ja)
JP (1) JPS5529195A (ja)
DE (1) DE2963404D1 (ja)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5734390B1 (ja) * 1971-04-16 1982-07-22
JPS6040497U (ja) * 1983-08-27 1985-03-22 トヨタ自動車株式会社 帯電防止シ−トフアブリツク
JPS6468945A (en) * 1987-09-09 1989-03-15 Nec Corp Manufacture of semiconductor integrated circuit device
JPH0214936A (ja) * 1988-07-02 1990-01-18 Daiwa:Kk 自動車用マット

Families Citing this family (70)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2927824A1 (de) * 1978-07-12 1980-01-31 Vlsi Technology Res Ass Halbleitervorrichtungen und ihre herstellung
JPS5595340A (en) * 1979-01-10 1980-07-19 Chiyou Lsi Gijutsu Kenkyu Kumiai Preparation of semiconductor device
JPS5710926A (en) * 1980-06-25 1982-01-20 Toshiba Corp Manufacture of semiconductor device
US4307179A (en) * 1980-07-03 1981-12-22 International Business Machines Corporation Planar metal interconnection system and process
US4367119A (en) * 1980-08-18 1983-01-04 International Business Machines Corporation Planar multi-level metal process with built-in etch stop
US4447824A (en) * 1980-08-18 1984-05-08 International Business Machines Corporation Planar multi-level metal process with built-in etch stop
US4336295A (en) * 1980-12-22 1982-06-22 Eastman Kodak Company Method of fabricating a transparent metal oxide electrode structure on a solid-state electrooptical device
US4361599A (en) * 1981-03-23 1982-11-30 National Semiconductor Corporation Method of forming plasma etched semiconductor contacts
JPS59220952A (ja) * 1983-05-31 1984-12-12 Toshiba Corp 半導体装置の製造方法
US4625391A (en) * 1981-06-23 1986-12-02 Tokyo Shibaura Denki Kabushiki Kaisha Semiconductor device and method for manufacturing the same
US4409319A (en) * 1981-07-15 1983-10-11 International Business Machines Corporation Electron beam exposed positive resist mask process
US4366229A (en) * 1981-11-06 1982-12-28 The United States Of America As Represented By The Secretary Of The Army Method of making cold shield for infrared detector array
US4393096A (en) * 1981-11-16 1983-07-12 International Business Machines Corporation Aluminum-copper alloy evaporated films with low via resistance
US4391678A (en) * 1981-11-18 1983-07-05 The United States Of America As Represented By The Secretary Of The Army Methods of making infrared detector array cold shield
US4389482A (en) * 1981-12-14 1983-06-21 International Business Machines Corporation Process for forming photoresists with strong resistance to reactive ion etching and high sensitivity to mid- and deep UV-light
JPS5916978A (ja) * 1982-07-20 1984-01-28 Tokyo Denshi Kagaku Kabushiki 金属被膜の選択的エツチング方法
EP0101752B1 (de) * 1982-08-25 1986-08-27 Ibm Deutschland Gmbh Umkehrprozess zum Herstellen von Chrommasken
US4461672A (en) * 1982-11-18 1984-07-24 Texas Instruments, Inc. Process for etching tapered vias in silicon dioxide
US4415606A (en) * 1983-01-10 1983-11-15 Ncr Corporation Method of reworking upper metal in multilayer metal integrated circuits
GB2137808A (en) * 1983-04-06 1984-10-10 Plessey Co Plc Integrated circuit processing method
US4451326A (en) * 1983-09-07 1984-05-29 Advanced Micro Devices, Inc. Method for interconnecting metallic layers
US4517050A (en) * 1983-12-05 1985-05-14 E. I. Du Pont De Nemours And Company Process for forming conductive through-holes through a dielectric layer
US4501638A (en) * 1983-12-05 1985-02-26 E. I. Du Pont De Nemours And Company Liquid chemical process for forming conductive through-holes through a dielectric layer
US4472238A (en) * 1983-12-05 1984-09-18 E. I. Du Pont De Nemours And Company Process using plasma for forming conductive through-holes through a dielectric layer
US4845050A (en) * 1984-04-02 1989-07-04 General Electric Company Method of making mo/tiw or w/tiw ohmic contacts to silicon
US4523372A (en) * 1984-05-07 1985-06-18 Motorola, Inc. Process for fabricating semiconductor device
US4659427A (en) * 1984-12-31 1987-04-21 Gte Laboratories Incorporated Via formation for multilayered metalization
US4614021A (en) * 1985-03-29 1986-09-30 Motorola, Inc. Pillar via process
JPH0652732B2 (ja) * 1985-08-14 1994-07-06 三菱電機株式会社 パツシベ−シヨン膜の形成方法
US4723197A (en) * 1985-12-16 1988-02-02 National Semiconductor Corporation Bonding pad interconnection structure
GB2186424A (en) * 1986-01-30 1987-08-12 Plessey Co Plc Method for producing integrated circuit interconnects
US4963512A (en) * 1986-03-25 1990-10-16 Hitachi, Ltd. Method for forming conductor layers and method for fabricating multilayer substrates
US4840923A (en) * 1986-04-30 1989-06-20 International Business Machine Corporation Simultaneous multiple level interconnection process
US5069749A (en) * 1986-07-29 1991-12-03 Digital Equipment Corporation Method of fabricating interconnect layers on an integrated circuit chip using seed-grown conductors
US4721689A (en) * 1986-08-28 1988-01-26 International Business Machines Corporation Method for simultaneously forming an interconnection level and via studs
JPS63127551A (ja) * 1986-11-17 1988-05-31 Toshiba Corp 半導体装置の製造方法
DE3752259T2 (de) * 1986-12-19 1999-10-14 Applied Materials Inc Bromine-Ätzverfahren für Silizium
US4853341A (en) * 1987-03-25 1989-08-01 Mitsubishi Denki Kabushiki Kaisha Process for forming electrodes for semiconductor devices using focused ion beams
JP2544921B2 (ja) 1987-03-25 1996-10-16 三菱電機株式会社 半導体装置の電極形成方法
US4948749A (en) * 1987-03-25 1990-08-14 Mitsubishi Denki Kabushiki Kaisha Process for forming electrodes for semiconductor devices
JP2544396B2 (ja) * 1987-08-25 1996-10-16 株式会社日立製作所 半導体集積回路装置の製造方法
FR2630588A1 (fr) * 1988-04-22 1989-10-27 Philips Nv Procede pour realiser une configuration d'interconnexion sur un dispositif semiconducteur notamment un circuit a densite d'integration elevee
US5001083A (en) * 1988-07-12 1991-03-19 Microwave Modules & Devices Inc. Method of priming semiconductor substrate for subsequent photoresist masking and etching
US4997789A (en) * 1988-10-31 1991-03-05 Texas Instruments Incorporated Aluminum contact etch mask and etchstop for tungsten etchback
US4920072A (en) * 1988-10-31 1990-04-24 Texas Instruments Incorporated Method of forming metal interconnects
US5296407A (en) * 1990-08-30 1994-03-22 Seiko Epson Corporation Method of manufacturing a contact structure for integrated circuits
JPH04150017A (ja) * 1990-10-12 1992-05-22 Toshiba Corp 半導体装置の製造方法
US5225372A (en) * 1990-12-24 1993-07-06 Motorola, Inc. Method of making a semiconductor device having an improved metallization structure
US5756401A (en) * 1992-03-23 1998-05-26 Fujitsu Limited Process for the etching of polycide film
US5736457A (en) 1994-12-09 1998-04-07 Sematech Method of making a damascene metallization
JP2639369B2 (ja) * 1994-12-22 1997-08-13 日本電気株式会社 半導体装置の製造方法
US5534462A (en) * 1995-02-24 1996-07-09 Motorola, Inc. Method for forming a plug and semiconductor device having the same
JPH09129732A (ja) * 1995-10-31 1997-05-16 Nec Corp 半導体装置の製造方法
US5866484A (en) * 1996-07-09 1999-02-02 Nippon Steel Corporation Semiconductor device and process of producing same
US5985766A (en) * 1997-02-27 1999-11-16 Micron Technology, Inc. Semiconductor processing methods of forming a contact opening
TW408420B (en) * 1998-08-14 2000-10-11 Mosel Vitelic Inc A method to measure if the connecting via in the metal wiring layer is aligned correctly
KR100292407B1 (ko) * 1998-10-07 2001-06-01 윤종용 스트레스완화적층물을구비하는반도체장치및그제조방법
US6261947B1 (en) * 1999-02-18 2001-07-17 Micron Technology, Inc. Formation of electrical contacts to conductive elements in the fabrication of semiconductor integrated circuits
US6861670B1 (en) 1999-04-01 2005-03-01 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device having multi-layer wiring
DE19915245A1 (de) * 1999-04-03 2000-10-05 Philips Corp Intellectual Pty Verfahren zur Herstellung von elektronischen Bauelementen mit Streifenleitungen
US6461797B1 (en) * 1999-11-19 2002-10-08 International Business Machines Corporation Method and apparatus for selectively programming a semiconductor device
DE10011886A1 (de) * 2000-03-07 2001-09-20 Infineon Technologies Ag Verfahren zur Herstellung einer Leiterstruktur für einen integrierten Schaltkreis
US7064447B2 (en) * 2001-08-10 2006-06-20 Micron Technology, Inc. Bond pad structure comprising multiple bond pads with metal overlap
US7727888B2 (en) * 2005-08-31 2010-06-01 International Business Machines Corporation Interconnect structure and method for forming the same
US7528066B2 (en) 2006-03-01 2009-05-05 International Business Machines Corporation Structure and method for metal integration
US7800228B2 (en) * 2006-05-17 2010-09-21 International Business Machines Corporation Reliable via contact interconnect structure
US7396762B2 (en) * 2006-08-30 2008-07-08 International Business Machines Corporation Interconnect structures with linear repair layers and methods for forming such interconnection structures
US20080128907A1 (en) * 2006-12-01 2008-06-05 International Business Machines Corporation Semiconductor structure with liner
US7846834B2 (en) * 2008-02-04 2010-12-07 International Business Machines Corporation Interconnect structure and method for Cu/ultra low k integration
JP4811437B2 (ja) * 2008-08-11 2011-11-09 日本テキサス・インスツルメンツ株式会社 Ｉｃチップ上への電子部品の実装

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104269A (ja) * 1975-03-12 1976-09-14 Fujitsu Ltd Purazumaetsuchinguhoho

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3795557A (en) * 1972-05-12 1974-03-05 Lfe Corp Process and material for manufacturing semiconductor devices
US3961414A (en) * 1972-06-09 1976-06-08 International Business Machines Corporation Semiconductor structure having metallization inlaid in insulating layers and method for making same
US3914127A (en) * 1973-11-23 1975-10-21 Texas Instruments Inc Method of making charge-coupled devices
US3971684A (en) * 1973-12-03 1976-07-27 Hewlett-Packard Company Etching thin film circuits and semiconductor chips
US3994793A (en) * 1975-05-22 1976-11-30 International Business Machines Corporation Reactive ion etching of aluminum
FR2312114A1 (fr) * 1975-05-22 1976-12-17 Ibm Attaque de materiaux par ions reactifs
FR2340620A1 (fr) * 1976-02-06 1977-09-02 Ibm Procede de fabrication d'un dispositif integre a grande echelle ayant une surface plane
FR2341944A1 (fr) * 1976-02-20 1977-09-16 Radiotechnique Compelec Procede d'obtention d'un circuit integre comportant au moins un niveau de connexions et dispositif obtenu par ce procede
US4035276A (en) * 1976-04-29 1977-07-12 Ibm Corporation Making coplanar layers of thin films
US4076575A (en) * 1976-06-30 1978-02-28 International Business Machines Corporation Integrated fabrication method of forming connectors through insulative layers

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS51104269A (ja) * 1975-03-12 1976-09-14 Fujitsu Ltd Purazumaetsuchinguhoho

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5734390B1 (ja) * 1971-04-16 1982-07-22
JPS6040497U (ja) * 1983-08-27 1985-03-22 トヨタ自動車株式会社 帯電防止シ−トフアブリツク
JPS6344479Y2 (ja) * 1983-08-27 1988-11-18
JPS6468945A (en) * 1987-09-09 1989-03-15 Nec Corp Manufacture of semiconductor integrated circuit device
JPH0214936A (ja) * 1988-07-02 1990-01-18 Daiwa:Kk 自動車用マット
JPH0513864B2 (ja) * 1988-07-02 1993-02-23 Daiwa Kk

Also Published As

Publication number Publication date
US4184909A (en) 1980-01-22
DE2963404D1 (en) 1982-09-16
EP0008359A3 (en) 1980-03-19
EP0008359B1 (de) 1982-07-28
EP0008359A2 (de) 1980-03-05
JPS6260813B2 (ja) 1987-12-18

Similar Documents

Publication Publication Date Title
JPS5529195A (en) Method of forming thin film mutual connecting system
JPS5579443A (en) Film coating method
JPS57156032A (en) Method of forming thin film
JPS5514299A (en) Method of producing heattbonded polyolefin film
JPS5591843A (en) Method of forming thin film mutual connecting pattern
JPS5533087A (en) Method of forming liquiddphase epitaxial film
JPS54135003A (en) Method of measuring reduction of halfftone film
JPS55138892A (en) Method of forming thin film
JPS5582650A (en) Method of making compound film
JPS5569140A (en) Preparing method of multiicolor picture
JPS5534996A (en) Method of making flexible coat film
JPS54131761A (en) Method of producing thin film capacitor
JPS553696A (en) Method of postttreating thin layer
JPS54115063A (en) Method of forming metal film
JPS54152533A (en) Method of making presseddflower picture
JPS54129396A (en) Method of producing piezoothin film
JPS5573548A (en) Weatherrproof heattcontractible film and making method thereof
JPS5567461A (en) Laminating method of films
JPS559472A (en) Method of forming manganage oxide film
JPS5599793A (en) Method of forming thick film
SU694494A1 (ru) Способ получени 2-хлораллиламинов
JPS5541729A (en) Method of forming thick film pattern
JPS54115064A (en) Method of forming metal film
JPS54119557A (en) Method of making multiilayer thin film
JPS54163362A (en) Pattern formation method of thin film