JPS5524471A - Formation of electrodes - Google Patents

Formation of electrodes

Info

Publication number
JPS5524471A
JPS5524471A JP9731178A JP9731178A JPS5524471A JP S5524471 A JPS5524471 A JP S5524471A JP 9731178 A JP9731178 A JP 9731178A JP 9731178 A JP9731178 A JP 9731178A JP S5524471 A JPS5524471 A JP S5524471A
Authority
JP
Japan
Prior art keywords
electrode
weight
heating
substrate
spattering method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9731178A
Other languages
Japanese (ja)
Inventor
Fumio Ichikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Oki Electric Industry Co Ltd
Original Assignee
Oki Electric Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Oki Electric Industry Co Ltd filed Critical Oki Electric Industry Co Ltd
Priority to JP9731178A priority Critical patent/JPS5524471A/en
Publication of JPS5524471A publication Critical patent/JPS5524471A/en
Pending legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Conductive Materials (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)

Abstract

PURPOSE:When forming electrodes of Al-Si by spattering method, to give the larger contents than 2.0% by weight to Al and to spatter without heating a substrate so that pattern is made fine and the life of said electrode is elngated. CONSTITUTION:When an electrode is formed of Al-Si by magnetron spattering method, a larger quantity of Si than 2.0% by weight is added to Al as one of electrode materials. The substrate on which said electrode is to be formed is treated without heating. Thereby, if 3.0% by weight of Si is contained in Al, the grain diameter of Al-Si film becomes so small as about 800Angstrom . Thus, the fine pattern obtained by chemical etching with photo-resist is suitable for LSI wiring.
JP9731178A 1978-08-11 1978-08-11 Formation of electrodes Pending JPS5524471A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9731178A JPS5524471A (en) 1978-08-11 1978-08-11 Formation of electrodes

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9731178A JPS5524471A (en) 1978-08-11 1978-08-11 Formation of electrodes

Publications (1)

Publication Number Publication Date
JPS5524471A true JPS5524471A (en) 1980-02-21

Family

ID=14188935

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9731178A Pending JPS5524471A (en) 1978-08-11 1978-08-11 Formation of electrodes

Country Status (1)

Country Link
JP (1) JPS5524471A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211936A (en) * 1986-03-12 1987-09-17 Fujitsu Ltd Formation of interconnection layer
JPS6461935A (en) * 1987-09-02 1989-03-08 Mitsubishi Electric Corp Semiconductor device
JPH0216735A (en) * 1988-05-02 1990-01-19 Motorola Inc Metallization process of semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62211936A (en) * 1986-03-12 1987-09-17 Fujitsu Ltd Formation of interconnection layer
JPS6461935A (en) * 1987-09-02 1989-03-08 Mitsubishi Electric Corp Semiconductor device
JPH0216735A (en) * 1988-05-02 1990-01-19 Motorola Inc Metallization process of semiconductor device

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