JPS5524403A - Detecting device of bonding face height - Google Patents
Detecting device of bonding face heightInfo
- Publication number
- JPS5524403A JPS5524403A JP9609578A JP9609578A JPS5524403A JP S5524403 A JPS5524403 A JP S5524403A JP 9609578 A JP9609578 A JP 9609578A JP 9609578 A JP9609578 A JP 9609578A JP S5524403 A JPS5524403 A JP S5524403A
- Authority
- JP
- Japan
- Prior art keywords
- block
- capillary
- bonding
- contact
- moves
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/7825—Means for applying energy, e.g. heating means
- H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
- H01L2224/78301—Capillary
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/788—Means for moving parts
- H01L2224/78801—Lower part of the bonding apparatus, e.g. XY table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/859—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector involving monitoring, e.g. feedback loop
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Wire Bonding (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9609578A JPS5524403A (en) | 1978-08-09 | 1978-08-09 | Detecting device of bonding face height |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9609578A JPS5524403A (en) | 1978-08-09 | 1978-08-09 | Detecting device of bonding face height |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5524403A true JPS5524403A (en) | 1980-02-21 |
JPS5758054B2 JPS5758054B2 (ja) | 1982-12-08 |
Family
ID=14155827
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9609578A Granted JPS5524403A (en) | 1978-08-09 | 1978-08-09 | Detecting device of bonding face height |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5524403A (ja) |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5574152A (en) * | 1978-11-22 | 1980-06-04 | Kulicke & Soffa Ind Inc | Wire bonding device |
JPS5854645A (ja) * | 1981-09-28 | 1983-03-31 | Toshiba Corp | ワイヤボンデイング装置 |
JPS58210629A (ja) * | 1982-06-02 | 1983-12-07 | Marine Instr Co Ltd | ボンデイング方法及びその装置 |
US4586642A (en) * | 1985-05-13 | 1986-05-06 | Kulicke And Soffa Industries Inc. | Wire bond monitoring system |
JPH01144642A (ja) * | 1988-07-08 | 1989-06-06 | Nec Corp | ワイヤボンデイング方法 |
JPH03114239A (ja) * | 1990-08-13 | 1991-05-15 | Marine Instr Co Ltd | ボンディング面接触検出装置 |
US6676005B2 (en) | 1999-09-09 | 2004-01-13 | International Business Machines Corporation | Wire bonding method and apparatus |
-
1978
- 1978-08-09 JP JP9609578A patent/JPS5524403A/ja active Granted
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5574152A (en) * | 1978-11-22 | 1980-06-04 | Kulicke & Soffa Ind Inc | Wire bonding device |
JPH0152896B2 (ja) * | 1978-11-22 | 1989-11-10 | Kurike Ando Sofua Ind Inc | |
JPS5854645A (ja) * | 1981-09-28 | 1983-03-31 | Toshiba Corp | ワイヤボンデイング装置 |
JPS58210629A (ja) * | 1982-06-02 | 1983-12-07 | Marine Instr Co Ltd | ボンデイング方法及びその装置 |
JPH0141023B2 (ja) * | 1982-06-02 | 1989-09-01 | Kaijo Denki Kk | |
US4586642A (en) * | 1985-05-13 | 1986-05-06 | Kulicke And Soffa Industries Inc. | Wire bond monitoring system |
JPH01144642A (ja) * | 1988-07-08 | 1989-06-06 | Nec Corp | ワイヤボンデイング方法 |
JPH05854B2 (ja) * | 1988-07-08 | 1993-01-06 | Nippon Electric Co | |
JPH03114239A (ja) * | 1990-08-13 | 1991-05-15 | Marine Instr Co Ltd | ボンディング面接触検出装置 |
JPH0474860B2 (ja) * | 1990-08-13 | 1992-11-27 | ||
US6676005B2 (en) | 1999-09-09 | 2004-01-13 | International Business Machines Corporation | Wire bonding method and apparatus |
Also Published As
Publication number | Publication date |
---|---|
JPS5758054B2 (ja) | 1982-12-08 |
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