JPS5521166A - Manufacturing method of semiconductor device - Google Patents
Manufacturing method of semiconductor deviceInfo
- Publication number
- JPS5521166A JPS5521166A JP9426078A JP9426078A JPS5521166A JP S5521166 A JPS5521166 A JP S5521166A JP 9426078 A JP9426078 A JP 9426078A JP 9426078 A JP9426078 A JP 9426078A JP S5521166 A JPS5521166 A JP S5521166A
- Authority
- JP
- Japan
- Prior art keywords
- mesa
- slot
- lathe
- work
- manufacturing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Bipolar Transistors (AREA)
- Formation Of Insulating Films (AREA)
- Dicing (AREA)
Abstract
PURPOSE: To form a uniform mesa slot and various mesa configurations easily and permit a manufacture of an element having a high resistance to pressure with a formation of the mesa slot by an lathe or a milling work.
CONSTITUTION: A multiplicity of semiconductor elements are formed by a diffusion processing on a sheet of semiconductor wafer to form a mesa slot by lathe work or a milling work. In this case, the various mesa configurations 10, 20, 30, and 40 can be formed by changing the tool angle and shape of a bite. Thereafter, an insulation film is formed by a conventional manner.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9426078A JPS5521166A (en) | 1978-08-01 | 1978-08-01 | Manufacturing method of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9426078A JPS5521166A (en) | 1978-08-01 | 1978-08-01 | Manufacturing method of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5521166A true JPS5521166A (en) | 1980-02-15 |
Family
ID=14105304
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9426078A Pending JPS5521166A (en) | 1978-08-01 | 1978-08-01 | Manufacturing method of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5521166A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012230955A (en) * | 2011-04-25 | 2012-11-22 | Disco Abrasive Syst Ltd | Division method of wafer |
-
1978
- 1978-08-01 JP JP9426078A patent/JPS5521166A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012230955A (en) * | 2011-04-25 | 2012-11-22 | Disco Abrasive Syst Ltd | Division method of wafer |
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