JPS5516499A - Method of and device for manufacturing printed circuit board and printed circuit board - Google Patents

Method of and device for manufacturing printed circuit board and printed circuit board

Info

Publication number
JPS5516499A
JPS5516499A JP8755479A JP8755479A JPS5516499A JP S5516499 A JPS5516499 A JP S5516499A JP 8755479 A JP8755479 A JP 8755479A JP 8755479 A JP8755479 A JP 8755479A JP S5516499 A JPS5516499 A JP S5516499A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
manufacturing
manufacturing printed
board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP8755479A
Other languages
English (en)
Inventor
Dagurasu Eidoshiyan Chiyaarusu
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Micro-Plate Inc
Original Assignee
Micro-Plate Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Micro-Plate Inc filed Critical Micro-Plate Inc
Publication of JPS5516499A publication Critical patent/JPS5516499A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/06—Suspending or supporting devices for articles to be coated
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/022—Electroplating of selected surface areas using masking means
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/08—Electroplating with moving electrolyte e.g. jet electroplating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/117—Pads along the edge of rigid circuit boards, e.g. for pluggable connectors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0703—Plating
    • H05K2203/0723—Electroplating, e.g. finish plating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Manufacturing Of Printed Wiring (AREA)
JP8755479A 1978-07-13 1979-07-12 Method of and device for manufacturing printed circuit board and printed circuit board Pending JPS5516499A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/923,939 US4186062A (en) 1978-07-13 1978-07-13 Continuous tab plater and method

Publications (1)

Publication Number Publication Date
JPS5516499A true JPS5516499A (en) 1980-02-05

Family

ID=25449496

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8755479A Pending JPS5516499A (en) 1978-07-13 1979-07-12 Method of and device for manufacturing printed circuit board and printed circuit board

Country Status (9)

Country Link
US (1) US4186062A (ja)
JP (1) JPS5516499A (ja)
BE (1) BE877535A (ja)
CH (1) CH643005A5 (ja)
DE (1) DE2928904A1 (ja)
FR (1) FR2431241A1 (ja)
GB (1) GB2039952B (ja)
NL (1) NL7905419A (ja)
SE (1) SE7905652L (ja)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL7812196A (nl) * 1978-12-15 1980-06-17 Galentan Ag Inrichting voor het electrolytisch aanbrengen van metalen deklagen.
US4364328A (en) * 1979-06-01 1982-12-21 Nippon Kokan Kabushiki Kaisha Apparatus for continuous dip-plating on one-side of steel strip
DE3108358C2 (de) * 1981-03-05 1985-08-29 Siemens AG, 1000 Berlin und 8000 München Vorrichtung zum partiellen Galvanisieren von zu elektrisch leitenden Bändern, Streifen oder dgl. zusammengefaßten Teilen im Durchlaufverfahren
NL8101106A (nl) * 1981-03-07 1982-10-01 Galentan Ag Inrichting voor het galvanisch aanbrengen van vlekvormige bedekkingen.
US4374004A (en) * 1981-06-29 1983-02-15 Northern Telecom Limited Method and apparatus for surface-treating predetermined areas of a surface of a body
US4359366A (en) * 1981-07-27 1982-11-16 Micro-Plate, Inc. Plating cell with continuous cathode contact and method
US4376684A (en) * 1981-08-24 1983-03-15 Micro-Plate, Inc. Shielded plating cell and method
US4377461A (en) * 1981-09-23 1983-03-22 Napco, Inc. Tab plater for circuit boards or the like
US4402800A (en) * 1981-10-02 1983-09-06 Ash James J Apparatus and method of treating tabs of printed circuit boards and the like
US4402799A (en) * 1981-10-02 1983-09-06 Chemcut Corporation Apparatus and method of treating tabs of printed circuit boards and the like
US4385967A (en) * 1981-10-07 1983-05-31 Chemcut Corporation Electroplating apparatus and method
US4376017A (en) * 1982-01-04 1983-03-08 Western Electric Co., Inc. Methods of electrolytically treating portions of digitated strips and treating cell
US4425213A (en) * 1982-03-22 1984-01-10 National Semiconductor Corporation Discrete length strip plater
US4409924A (en) * 1982-07-01 1983-10-18 National Semiconductor Corporation Self-adjusting plating mask
DE3339328A1 (de) * 1982-11-01 1984-05-10 Omi International Corp., 48089 Warren, Mich. Anodenstruktur fuer eine plattierungszelle
DE3317970A1 (de) * 1983-05-13 1984-11-15 Schering AG, 1000 Berlin und 4709 Bergkamen Vorrichtung und verfahren zur galvanischen abscheidung von metallen
FR2549336B1 (fr) * 1983-06-23 1986-11-21 Telmec Spa Tec Elett Mecc Machine pour la dorure en continu de connecteurs lamellaires de circuits imprimes, avec groupe de transport pouvant effectuer une translation
US4826243A (en) * 1987-06-25 1989-05-02 Super Sagless Corporation Recliner chairs
DE3839223C2 (de) * 1988-11-19 1994-10-20 Degussa Vorrichtung zur selektiven galvanischen Beschichtung
US5228553A (en) * 1992-02-24 1993-07-20 Circuit Chemistry Equipment, Inc. Drive mechanism for a conveyor of a printer circuit board processor
DE4405919A1 (de) * 1994-02-24 1995-08-31 Teves Gmbh Alfred Mit galvanisierten , untereinander über Stanzgitter verbundenen Anschlüssen versehene elektrische Baugruppe sowie Herstellungsverfahren hierzu
US5545440A (en) * 1994-12-05 1996-08-13 At&T Global Information Solutions Company (Aka Ncr Corporation) Method and apparatus for polymer coating of substrates
US5597469A (en) * 1995-02-13 1997-01-28 International Business Machines Corporation Process for selective application of solder to circuit packages
US6153064A (en) * 1998-11-25 2000-11-28 Oliver Sales Company Apparatus for in line plating
JP2002198635A (ja) * 2000-12-27 2002-07-12 Matsushita Electric Ind Co Ltd 配線板及びその製造方法
US20050006205A1 (en) * 2003-07-07 2005-01-13 Kuo Ming Hong Transporting device for a vertical-type thin circuit board etching machine
DE102005053930B4 (de) * 2005-11-11 2014-10-30 Rohde & Schwarz Gmbh & Co. Kg Befestigungs- und Kontaktvorrichtung für ein Substrat

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3274092A (en) * 1962-08-28 1966-09-20 Columbia Cable & Electric Corp Apparatus for electroplating narrow strips
US3933615A (en) * 1969-06-09 1976-01-20 The United States Of America As Represented By The Secretary Of The Air Force Fluid flow stripping and plating system
US3723283A (en) * 1970-12-23 1973-03-27 Select Au Matic Selective plating system
US3835017A (en) * 1972-12-22 1974-09-10 Buckbee Mears Co Reusable shields for selective electrodeposition
FR2215013B1 (ja) * 1973-01-22 1978-09-29 Plisson Yvon
US4000045A (en) * 1975-01-27 1976-12-28 Burroughs Corporation Electroplating contacts of printed circuits
JPS51137629A (en) * 1975-05-23 1976-11-27 Nippon Electro Plating Highhspeed continuous plating method
US3974056A (en) * 1975-05-23 1976-08-10 Ann Arbor Circuits, Inc. Electroplating selected portions of a strip
US4093520A (en) * 1976-02-17 1978-06-06 Bell Telephone Laboratories, Incorporated Process for gold plating
US4029564A (en) * 1976-03-26 1977-06-14 Electroplating Engineers Of Japan, Limited High speed plating device for rectangular sheets

Also Published As

Publication number Publication date
DE2928904A1 (de) 1980-01-31
BE877535A (fr) 1979-11-05
GB2039952B (en) 1982-09-08
SE7905652L (sv) 1980-01-14
NL7905419A (nl) 1980-01-15
FR2431241A1 (fr) 1980-02-08
US4186062A (en) 1980-01-29
FR2431241B1 (ja) 1984-02-03
CH643005A5 (fr) 1984-05-15
GB2039952A (en) 1980-08-20

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