JPS55150233A - Apparatus for treating semiconductor wafer - Google Patents
Apparatus for treating semiconductor waferInfo
- Publication number
- JPS55150233A JPS55150233A JP4463480A JP4463480A JPS55150233A JP S55150233 A JPS55150233 A JP S55150233A JP 4463480 A JP4463480 A JP 4463480A JP 4463480 A JP4463480 A JP 4463480A JP S55150233 A JPS55150233 A JP S55150233A
- Authority
- JP
- Japan
- Prior art keywords
- etching solution
- flowing paths
- solution
- box
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title abstract 2
- 238000005530 etching Methods 0.000 abstract 8
- 235000012431 wafers Nutrition 0.000 abstract 5
- 239000007788 liquid Substances 0.000 abstract 2
- 230000000007 visual effect Effects 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- ing And Chemical Polishing (AREA)
- Weting (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4463480A JPS55150233A (en) | 1980-04-07 | 1980-04-07 | Apparatus for treating semiconductor wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4463480A JPS55150233A (en) | 1980-04-07 | 1980-04-07 | Apparatus for treating semiconductor wafer |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3962572A Division JPS5546054B2 (enrdf_load_stackoverflow) | 1972-04-21 | 1972-04-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55150233A true JPS55150233A (en) | 1980-11-22 |
| JPS5734651B2 JPS5734651B2 (enrdf_load_stackoverflow) | 1982-07-24 |
Family
ID=12696852
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4463480A Granted JPS55150233A (en) | 1980-04-07 | 1980-04-07 | Apparatus for treating semiconductor wafer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55150233A (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007058876A1 (de) * | 2007-12-06 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Bearbeitung von Waferoberflächen |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6268349U (enrdf_load_stackoverflow) * | 1985-10-17 | 1987-04-28 |
-
1980
- 1980-04-07 JP JP4463480A patent/JPS55150233A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102007058876A1 (de) * | 2007-12-06 | 2009-06-10 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Bearbeitung von Waferoberflächen |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5734651B2 (enrdf_load_stackoverflow) | 1982-07-24 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US3987816A (en) | Entrance duct with weir | |
| DE19549488C2 (de) | Anlage zur chemischen Naßbehandlung | |
| JP2912538B2 (ja) | 浸漬型基板処理装置 | |
| DE3370119D1 (en) | Immersion cooled high density electronic assembly | |
| ATE112694T1 (de) | Vorrichtung zur durchflussabscheidung von öl aus wasser mit mäanderförmiger strömung. | |
| KR930020596A (ko) | 세정(洗淨)장치용 처리조(處理糟) | |
| US6352084B1 (en) | Substrate treatment device | |
| CN111359971A (zh) | 一种清洗装置 | |
| KR102399869B1 (ko) | 기판 처리 장치 | |
| JPS55150233A (en) | Apparatus for treating semiconductor wafer | |
| US5374325A (en) | Liquid agitation and purification system | |
| IT8048755A0 (it) | Galleggiante per dispositivi di misura del livello di un liquido in serbatoi | |
| DE3476342D1 (en) | Filtering device | |
| JPH05152273A (ja) | 枚葉洗浄用オーバーフロー槽 | |
| US2304248A (en) | Liquor treating apparatus | |
| JPS55150232A (en) | Treating method of semiconductor wafer | |
| JPS5556625A (en) | Semiconductor crystal growing device | |
| CN217748362U (zh) | 一种兼容的槽体结构以及清洗设备 | |
| US1743974A (en) | Gas washer | |
| US5512174A (en) | Filtering device for the clarification of liquids | |
| CN101412587B (zh) | 衬底薄化设备、方法和组件 | |
| JPH03266431A (ja) | 基板の洗浄装置 | |
| JP3185387B2 (ja) | 洗浄装置及びこれを用いた半導体ウエハなどの基板の洗浄方法 | |
| JPS60257858A (ja) | 切削或るいは研削液に含まれる切粉の分離方法および装置 | |
| KR0125681Y1 (ko) | 웨이퍼 세정조 |