JPS5512746A - Semiconductor base plate joining device - Google Patents

Semiconductor base plate joining device

Info

Publication number
JPS5512746A
JPS5512746A JP8559378A JP8559378A JPS5512746A JP S5512746 A JPS5512746 A JP S5512746A JP 8559378 A JP8559378 A JP 8559378A JP 8559378 A JP8559378 A JP 8559378A JP S5512746 A JPS5512746 A JP S5512746A
Authority
JP
Japan
Prior art keywords
pick
heating
base plate
semiconductor base
knotched
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP8559378A
Other languages
Japanese (ja)
Other versions
JPS5729844B2 (en
Inventor
Kazuaki Momo
Tsugio Murayama
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electronics Corp filed Critical Matsushita Electronics Corp
Priority to JP8559378A priority Critical patent/JPS5512746A/en
Publication of JPS5512746A publication Critical patent/JPS5512746A/en
Publication of JPS5729844B2 publication Critical patent/JPS5729844B2/ja
Granted legal-status Critical Current

Links

Abstract

PURPOSE: To shorten shifting distance of a pick-up device by providing under a semiconductor base plate supporting body heating device a hole for a film-fixing frame body to fit in and also a knotch section for the pick-up device to pass throgh.
CONSTITUTION: A heating device 2 for heating a semiconductor base plate supporting body 1 is supported by a heating supporter 12, in which cooling water supply pipes are embedded, in such a manner that they are to be thermally insulated with an insulator 13. A space 14 is formed under the heating supporter, and knotched slopes 15 and 16 are also formed at a section corresponding to reciprocating motion of a pick-up device 9. The pick-up device 9 is to make a reciprocating motion passing through points A' and B and also the knotched slopes 15 and 16, and a frame body supporting plate 7 moves into the space 14. It is possible, by doing so, to shorten shifting distance of the pick-up device and, at the same time, to improve index of joining operation.
COPYRIGHT: (C)1980,JPO&Japio
JP8559378A 1978-07-12 1978-07-12 Semiconductor base plate joining device Granted JPS5512746A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP8559378A JPS5512746A (en) 1978-07-12 1978-07-12 Semiconductor base plate joining device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8559378A JPS5512746A (en) 1978-07-12 1978-07-12 Semiconductor base plate joining device

Publications (2)

Publication Number Publication Date
JPS5512746A true JPS5512746A (en) 1980-01-29
JPS5729844B2 JPS5729844B2 (en) 1982-06-25

Family

ID=13863110

Family Applications (1)

Application Number Title Priority Date Filing Date
JP8559378A Granted JPS5512746A (en) 1978-07-12 1978-07-12 Semiconductor base plate joining device

Country Status (1)

Country Link
JP (1) JPS5512746A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154843A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Assembling device for semiconductor
JPH01315231A (en) * 1988-06-14 1989-12-20 Fanuc Ltd Coil winding structure for ac motor
JPH02142534U (en) * 1989-01-30 1990-12-04
JPH0330429U (en) * 1989-08-03 1991-03-26
US5177423A (en) * 1988-06-14 1993-01-05 Fanuc Ltd. Winding arrangement in an AC motor

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57154843A (en) * 1981-03-20 1982-09-24 Hitachi Ltd Assembling device for semiconductor
JPH01315231A (en) * 1988-06-14 1989-12-20 Fanuc Ltd Coil winding structure for ac motor
US5177423A (en) * 1988-06-14 1993-01-05 Fanuc Ltd. Winding arrangement in an AC motor
JPH02142534U (en) * 1989-01-30 1990-12-04
JPH0330429U (en) * 1989-08-03 1991-03-26

Also Published As

Publication number Publication date
JPS5729844B2 (en) 1982-06-25

Similar Documents

Publication Publication Date Title
JPS5512746A (en) Semiconductor base plate joining device
JPS52146574A (en) Semiconductor device
JPS53102589A (en) Device for retrieving flown oil
JPS5327775A (en) Brake cooling device
JPS5292936A (en) Heating body structure for warm wind generating device
JPS5359851A (en) Constant current circuit
JPS5431646A (en) Heater
JPS5218173A (en) Soldering method of semiconductor element
JPS5787588A (en) Heat pipe
JPS5384249A (en) High frequency wave heating device
JPS51148377A (en) Manufacturing method of mis type semiconductor device
JPS5376661A (en) Semiconductor device
JPS5243388A (en) Power-lead for super electric conducting apparatus
JPS52147973A (en) Semiconductor device
JPS5375760A (en) Manufacture for semiconductor device
JPS5373979A (en) Transistor device
JPS5267978A (en) Boiling-cooling type semiconductor unit
JPS51118965A (en) Insulation film of semiconductor device
JPS544568A (en) Semiconductor device and production of the same
JPS5234673A (en) Cooling apparatus of semiconductor device
JPS5442986A (en) Menufacture of semiconductor device
JPS51126032A (en) Cooling device
JPS5393813A (en) Floating type magnetic head
JPS5342938A (en) Manufacturing process of metal mould for golf balls
JPS5410683A (en) Production of smiconductor device