JPS55124244A - Method of fabricating chip component - Google Patents

Method of fabricating chip component

Info

Publication number
JPS55124244A
JPS55124244A JP3268479A JP3268479A JPS55124244A JP S55124244 A JPS55124244 A JP S55124244A JP 3268479 A JP3268479 A JP 3268479A JP 3268479 A JP3268479 A JP 3268479A JP S55124244 A JPS55124244 A JP S55124244A
Authority
JP
Japan
Prior art keywords
protective film
substrate
cutout
forming
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3268479A
Other languages
Japanese (ja)
Inventor
Akiyoshi Nomura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP3268479A priority Critical patent/JPS55124244A/en
Publication of JPS55124244A publication Critical patent/JPS55124244A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Dicing (AREA)

Abstract

PURPOSE:To readily enable mass production of chip components completely coated with protective film on a semiconductor element by forming the element on a support substrate, forming a dividing cutout reaching from the element side to the substrate and forming the protective film thereon in this state. CONSTITUTION:A semiconductor element 12 is formed on the main surface of a support substrate 11, and dividing cutouts 14 are formed from the element 12 side to reach the substrate 11. Then, a protective film 13 is formed on the surface side formed with the cutouts 14 by a sputter process or a chemical evaporation process or the like. Thus, the film 13 is formed not only on the bottom surface of the cutout 14 but on the side surface. Thereafter, the substrate 11 is divided along the cutout 14 to obtain a chip component coated with the protective film not only on the main surface of the element 12 but on the side surface thereof. Thus, it can readily fabricate in mass production the chip components which are stabilized in characteristics upon coating of the film 13 over the side surfaces of the element 12.
JP3268479A 1979-03-20 1979-03-20 Method of fabricating chip component Pending JPS55124244A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3268479A JPS55124244A (en) 1979-03-20 1979-03-20 Method of fabricating chip component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3268479A JPS55124244A (en) 1979-03-20 1979-03-20 Method of fabricating chip component

Publications (1)

Publication Number Publication Date
JPS55124244A true JPS55124244A (en) 1980-09-25

Family

ID=12365694

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3268479A Pending JPS55124244A (en) 1979-03-20 1979-03-20 Method of fabricating chip component

Country Status (1)

Country Link
JP (1) JPS55124244A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4904610A (en) * 1988-01-27 1990-02-27 General Instrument Corporation Wafer level process for fabricating passivated semiconductor devices
US5742094A (en) * 1993-01-25 1998-04-21 Intel Corporation Sealed semiconductor chip
US6680241B2 (en) * 2000-07-25 2004-01-20 Fujitsu Limited Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices
US11877388B2 (en) 2020-06-22 2024-01-16 AT&SAustria Technologie & Systemtechnik AG Component carrier with embedded component covered by functional film having an inhomogeneous thickness distribution

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4904610A (en) * 1988-01-27 1990-02-27 General Instrument Corporation Wafer level process for fabricating passivated semiconductor devices
US5742094A (en) * 1993-01-25 1998-04-21 Intel Corporation Sealed semiconductor chip
US5856705A (en) * 1993-01-25 1999-01-05 Intel Corporation Sealed semiconductor chip and process for fabricating sealed semiconductor chip
US6680241B2 (en) * 2000-07-25 2004-01-20 Fujitsu Limited Method of manufacturing semiconductor devices by dividing wafer into chips and such semiconductor devices
US11877388B2 (en) 2020-06-22 2024-01-16 AT&SAustria Technologie & Systemtechnik AG Component carrier with embedded component covered by functional film having an inhomogeneous thickness distribution

Similar Documents

Publication Publication Date Title
JPS5355986A (en) Manufacture of semiconductor device
JPS57132372A (en) Manufacture of p-n junction type thin silicon band
JPS55124244A (en) Method of fabricating chip component
EP0164132A3 (en) Vapour deposition apparatus
JPS5249772A (en) Process for production of semiconductor device
EP0132322A3 (en) Thermal crackers for forming pnictide films in high vacuum processes
JPS5331983A (en) Production of semiconductor substrates
JPS5748249A (en) Semiconductor device
JPS5315755A (en) Manufacture of display panel electrode
JPS53125761A (en) Manufacture for binary compound semiconductor thin film
JPS5795661A (en) Thin film semiconductor device
JPS6476736A (en) Manufacture of semiconductor device
JPS55130841A (en) Increasing method of adhesive strength between photoresist film and glass
JPS5688384A (en) Manufacture of josephson junction element
JPS6439018A (en) Intermetallic compound semiconductor thin film and manufacture thereof
JPS5364463A (en) Fixing tray of semiconductor wafers
JPS53130974A (en) Manufacture for silicon thin film
JPS5367353A (en) Manufacturing device of semiconductor crystal
JPS53105989A (en) Semiconductor device
JPS56120154A (en) Coil and its manufacture
JPS5258473A (en) Production of semiconductor device
JPS5223265A (en) Method of processing semiconductor materials
JPS5591835A (en) Electronic device
JPS51147292A (en) Semiconductor hall effect element and its manufacturing process
JPS5533079A (en) Thin film and method of fabricating the same