JPS5364463A - Fixing tray of semiconductor wafers - Google Patents

Fixing tray of semiconductor wafers

Info

Publication number
JPS5364463A
JPS5364463A JP13955376A JP13955376A JPS5364463A JP S5364463 A JPS5364463 A JP S5364463A JP 13955376 A JP13955376 A JP 13955376A JP 13955376 A JP13955376 A JP 13955376A JP S5364463 A JPS5364463 A JP S5364463A
Authority
JP
Japan
Prior art keywords
semiconductor wafers
fixing tray
wafer
fixing
polyurethane
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13955376A
Other languages
Japanese (ja)
Other versions
JPS542537B2 (en
Inventor
Shojiro Miyake
Masao Nishijima
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nippon Telegraph and Telephone Corp
Original Assignee
Nippon Telegraph and Telephone Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Telegraph and Telephone Corp filed Critical Nippon Telegraph and Telephone Corp
Priority to JP13955376A priority Critical patent/JPS5364463A/en
Publication of JPS5364463A publication Critical patent/JPS5364463A/en
Publication of JPS542537B2 publication Critical patent/JPS542537B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Weting (AREA)

Abstract

PURPOSE:To make possible firm fixing of a wafer by securing and forming a thin film such as of polyurethane or other having a plurality of hole parts opening to the placement side of the semiconductor wafer and flat surface parts onto the plane surface of the substrate.
JP13955376A 1976-11-22 1976-11-22 Fixing tray of semiconductor wafers Granted JPS5364463A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP13955376A JPS5364463A (en) 1976-11-22 1976-11-22 Fixing tray of semiconductor wafers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP13955376A JPS5364463A (en) 1976-11-22 1976-11-22 Fixing tray of semiconductor wafers

Publications (2)

Publication Number Publication Date
JPS5364463A true JPS5364463A (en) 1978-06-08
JPS542537B2 JPS542537B2 (en) 1979-02-08

Family

ID=15247933

Family Applications (1)

Application Number Title Priority Date Filing Date
JP13955376A Granted JPS5364463A (en) 1976-11-22 1976-11-22 Fixing tray of semiconductor wafers

Country Status (1)

Country Link
JP (1) JPS5364463A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63120764U (en) * 1987-01-29 1988-08-04
JPH04180650A (en) * 1990-11-15 1992-06-26 Nec Kyushu Ltd Tape for full-cut dicing

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6391475U (en) * 1986-12-04 1988-06-13

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493320A (en) * 1972-05-02 1974-01-12
JPS5091460U (en) * 1973-12-24 1975-08-01
JPS50134574A (en) * 1974-04-01 1975-10-24

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS493320A (en) * 1972-05-02 1974-01-12
JPS5091460U (en) * 1973-12-24 1975-08-01
JPS50134574A (en) * 1974-04-01 1975-10-24

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63120764U (en) * 1987-01-29 1988-08-04
JPH04180650A (en) * 1990-11-15 1992-06-26 Nec Kyushu Ltd Tape for full-cut dicing

Also Published As

Publication number Publication date
JPS542537B2 (en) 1979-02-08

Similar Documents

Publication Publication Date Title
IT1091351B (en) PROCEDURE FOR FORMING AN EPITAXIAL LAYER ON THE SURFACE OF A SUBSTRATE, PARTICULARLY FOR SEMICONDUCTORS
JPS543480A (en) Manufacture of semiconductor device
IT8026866A0 (en) SYSTEM FOR COATING THIN SEMICONDUCTOR SUBSTRATES (WAFERS).
DE69132826T2 (en) Heater for semiconductor wafers or substrates
JPS5293285A (en) Structure for semiconductor device
IT7868866A0 (en) PROCEDURE FOR THE DEPOSIT OF CRYSTALLINE SILICON IN A THIN FILM ON A GRAPHITED SUBSTRATE
GB1542084A (en) Thin silicon semiconductor devices
JPS5364463A (en) Fixing tray of semiconductor wafers
JPS52156580A (en) Semiconductor integrated circuit device and its production
JPS6450439A (en) Manufacture of semiconductor device
JPS5331983A (en) Production of semiconductor substrates
JPS53104162A (en) Forming method for epitaxial layer on semiconductor wafer
JPS52156581A (en) Semiconductor device
JPS5325350A (en) Dicing method of semiconductor substrates
JPS5419681A (en) Dielectric isolating substrate and production of the same
JPS53105989A (en) Semiconductor device
JPS5336180A (en) Production of semiconductor device
GB1540675A (en) Substrate for epitaxial deposition of silicon
JPS5317286A (en) Production of semiconductor device
JPS5333579A (en) Semiconductor device production
JPS53117975A (en) Etching method of semiconductor substrates
JPS5351981A (en) Manufacture for semiconductor device
JPS5367353A (en) Manufacturing device of semiconductor crystal
JPS5338968A (en) Spinel crystal for semiconductor substrate
JPS5389656A (en) Production of semiconductor device