JPS55124077A - Semiconductor wafer electric characteristic testing apparatus - Google Patents
Semiconductor wafer electric characteristic testing apparatusInfo
- Publication number
- JPS55124077A JPS55124077A JP3144479A JP3144479A JPS55124077A JP S55124077 A JPS55124077 A JP S55124077A JP 3144479 A JP3144479 A JP 3144479A JP 3144479 A JP3144479 A JP 3144479A JP S55124077 A JPS55124077 A JP S55124077A
- Authority
- JP
- Japan
- Prior art keywords
- value
- testing
- subtractor
- warning
- defective
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
PURPOSE: To considerably reduce the IC pellets to be discarded by comparing non- defective quantities at every testing or intermittently, judging a fault when the difference of an arbitrary fixed quantity occurs in the non-defective quantities and stopping the testing apparatus.
CONSTITUTION: The non-defective quantities and defective quantities of the pellets being subjected to electric characteristic testing by, e.g., two sets of terminal groups, formed on a probe card 5, are calculated by counters 15, 16 respectively and the differences of the respective count values are calculated by a subtractor 21 at every testing or periodically. On the other hand, a warning value register 20 sets the threshold value, i.e., warning value, to be compared with the absolute value of the differences in the count values of the counters 15 and 16. The internal value of a warning value register 20 and the output of the subtractor 21 are compared in a comparator 22 and when the both are the same or the count value of the subtractor 21 exceeds the warning value, a signal is emitted from the comparator 22 and is fed to the prober 11. At the same time, it is displayed by lamp or buzzer in a warning display part 24.
COPYRIGHT: (C)1980,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3144479A JPS55124077A (en) | 1979-03-16 | 1979-03-16 | Semiconductor wafer electric characteristic testing apparatus |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3144479A JPS55124077A (en) | 1979-03-16 | 1979-03-16 | Semiconductor wafer electric characteristic testing apparatus |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS55124077A true JPS55124077A (en) | 1980-09-24 |
JPS6142829B2 JPS6142829B2 (en) | 1986-09-24 |
Family
ID=12331410
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3144479A Granted JPS55124077A (en) | 1979-03-16 | 1979-03-16 | Semiconductor wafer electric characteristic testing apparatus |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS55124077A (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58214844A (en) * | 1982-05-24 | 1983-12-14 | バリアン・アソシエイツ・インコ−ポレイテツド | Device for detecting breaking or damage of wafer |
JPS63234539A (en) * | 1987-03-24 | 1988-09-29 | Tokyo Electron Ltd | Probe device |
JPH0285374U (en) * | 1988-12-20 | 1990-07-04 | ||
CN105789076A (en) * | 2014-12-22 | 2016-07-20 | 旺矽科技股份有限公司 | Fault judgement method for prober |
CN110160918A (en) * | 2018-02-12 | 2019-08-23 | 黄彦凯 | The method that wafer is tested again |
-
1979
- 1979-03-16 JP JP3144479A patent/JPS55124077A/en active Granted
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58214844A (en) * | 1982-05-24 | 1983-12-14 | バリアン・アソシエイツ・インコ−ポレイテツド | Device for detecting breaking or damage of wafer |
JPH0370902B2 (en) * | 1982-05-24 | 1991-11-11 | Varian Associates | |
JPS63234539A (en) * | 1987-03-24 | 1988-09-29 | Tokyo Electron Ltd | Probe device |
JPH0285374U (en) * | 1988-12-20 | 1990-07-04 | ||
CN105789076A (en) * | 2014-12-22 | 2016-07-20 | 旺矽科技股份有限公司 | Fault judgement method for prober |
CN110160918A (en) * | 2018-02-12 | 2019-08-23 | 黄彦凯 | The method that wafer is tested again |
Also Published As
Publication number | Publication date |
---|---|
JPS6142829B2 (en) | 1986-09-24 |
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