JPS55118683A - Manufacture of pellet - Google Patents

Manufacture of pellet

Info

Publication number
JPS55118683A
JPS55118683A JP2611279A JP2611279A JPS55118683A JP S55118683 A JPS55118683 A JP S55118683A JP 2611279 A JP2611279 A JP 2611279A JP 2611279 A JP2611279 A JP 2611279A JP S55118683 A JPS55118683 A JP S55118683A
Authority
JP
Japan
Prior art keywords
insb
wafer
adhesive
desired thickness
forming
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2611279A
Other languages
Japanese (ja)
Inventor
Kazutaka Terajima
Shoichi Inoue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP2611279A priority Critical patent/JPS55118683A/en
Publication of JPS55118683A publication Critical patent/JPS55118683A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N52/00—Hall-effect devices
    • H10N52/01—Manufacture or treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Hall/Mr Elements (AREA)

Abstract

PURPOSE:To prevent an InSb Hall element or the like from deteriorating its characteristics by polishing and etching the surface of a wafer secured onto a substrare with adhesive to form it in desired thickness and forming a thin wafer. CONSTITUTION:The bulk crystal wafer 12 of InSb monocrystal is secured using adhesive such as epoxy resin or the like on the surface of a silicon or the like semiconductor substrate 11. Then, the surface of the crystal wafer 12 is mirror polished, etched, and formed in desired thickness. After forming Hall element bodys 14a-14d at thin InSb boards 18a-18d, respectively, a cut line 16 is formed thereon, and pellets 18a-18d are separated. Thus, it can improve the characteristics of the InSb Hall elements or the like.
JP2611279A 1979-03-08 1979-03-08 Manufacture of pellet Pending JPS55118683A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2611279A JPS55118683A (en) 1979-03-08 1979-03-08 Manufacture of pellet

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2611279A JPS55118683A (en) 1979-03-08 1979-03-08 Manufacture of pellet

Publications (1)

Publication Number Publication Date
JPS55118683A true JPS55118683A (en) 1980-09-11

Family

ID=12184492

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2611279A Pending JPS55118683A (en) 1979-03-08 1979-03-08 Manufacture of pellet

Country Status (1)

Country Link
JP (1) JPS55118683A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5925287A (en) * 1982-07-31 1984-02-09 Pioneer Electronic Corp Magnetoelectric conversion element
JPS60257187A (en) * 1984-06-01 1985-12-18 Denki Onkyo Co Ltd Manufacture of semiconductor element
US4584552A (en) * 1982-03-26 1986-04-22 Pioneer Electronic Corporation Hall element with improved composite substrate
JPS62102575A (en) * 1985-10-29 1987-05-13 Victor Co Of Japan Ltd Manufacture of element with thin film pattern coated with protecting film

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4584552A (en) * 1982-03-26 1986-04-22 Pioneer Electronic Corporation Hall element with improved composite substrate
JPS5925287A (en) * 1982-07-31 1984-02-09 Pioneer Electronic Corp Magnetoelectric conversion element
JPS60257187A (en) * 1984-06-01 1985-12-18 Denki Onkyo Co Ltd Manufacture of semiconductor element
JPS62102575A (en) * 1985-10-29 1987-05-13 Victor Co Of Japan Ltd Manufacture of element with thin film pattern coated with protecting film

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