JPS55111155A - Semiconductor device and manufacturing method thereof - Google Patents

Semiconductor device and manufacturing method thereof

Info

Publication number
JPS55111155A
JPS55111155A JP1873479A JP1873479A JPS55111155A JP S55111155 A JPS55111155 A JP S55111155A JP 1873479 A JP1873479 A JP 1873479A JP 1873479 A JP1873479 A JP 1873479A JP S55111155 A JPS55111155 A JP S55111155A
Authority
JP
Japan
Prior art keywords
diffused region
oxide film
low
density
drain diffused
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1873479A
Other languages
Japanese (ja)
Inventor
Yasushi Fukatsu
Shiyouji Ariizumi
Fujio Masuoka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Tokyo Shibaura Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp, Tokyo Shibaura Electric Co Ltd filed Critical Toshiba Corp
Priority to JP1873479A priority Critical patent/JPS55111155A/en
Publication of JPS55111155A publication Critical patent/JPS55111155A/en
Priority to US06/545,002 priority patent/US4475964A/en
Priority to US06/665,081 priority patent/US4558343A/en
Pending legal-status Critical Current

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  • Semiconductor Integrated Circuits (AREA)

Abstract

PURPOSE: To heighten the density of a metal oxide semiconductor and a load resistor and improve electric properties, by placing at least one end of a low-concentration layer of high resistivity in direct contact with the diffused layer of a driving transistor.
CONSTITUTION: A field oxide film 20 is provided by high-temperature oxidation on a semiconductor substrate 21. A gate oxide film 24 is then provided. Boron is injected to provide a gate electrode 25. The gate electrode is used as a mask to produce a source diffused region 22 and a drain diffused region 23 to provide a MOSFET. A contact hole 27a, which communicates with the drain diffused region 23, is provided. A member 26 of high resistivity is provided by injection of P ions. An silicon oxide film 29 is grown. A protective film 30 and a wiring metal 28 are provided. Since one end of the low-concentration layer 26 is located in direct contact with the drain diffused region 23 of the driving MOSFET, the contact is easily realized and its scattering is reduced. Since a high-resistance portion and a low-resistance portion do not need to be separated from each other, the density can be raised.
COPYRIGHT: (C)1980,JPO&Japio
JP1873479A 1979-02-20 1979-02-20 Semiconductor device and manufacturing method thereof Pending JPS55111155A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP1873479A JPS55111155A (en) 1979-02-20 1979-02-20 Semiconductor device and manufacturing method thereof
US06/545,002 US4475964A (en) 1979-02-20 1983-10-24 Method of manufacturing a semiconductor device
US06/665,081 US4558343A (en) 1979-02-20 1984-10-26 Semiconductor device having a high resistivity layer in direct contact with a polycrystalline silicon layer of high impurity concentration

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1873479A JPS55111155A (en) 1979-02-20 1979-02-20 Semiconductor device and manufacturing method thereof

Publications (1)

Publication Number Publication Date
JPS55111155A true JPS55111155A (en) 1980-08-27

Family

ID=11979892

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1873479A Pending JPS55111155A (en) 1979-02-20 1979-02-20 Semiconductor device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JPS55111155A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244832A (en) * 1985-10-16 1993-09-14 Texas Instruments Incorporated Method for fabricating a poly emitter logic array and apparatus produced thereby

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109487A (en) * 1977-03-07 1978-09-25 Matsushita Electric Ind Co Ltd Manufacture for semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53109487A (en) * 1977-03-07 1978-09-25 Matsushita Electric Ind Co Ltd Manufacture for semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5244832A (en) * 1985-10-16 1993-09-14 Texas Instruments Incorporated Method for fabricating a poly emitter logic array and apparatus produced thereby

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