JPS55110063A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS55110063A
JPS55110063A JP1770379A JP1770379A JPS55110063A JP S55110063 A JPS55110063 A JP S55110063A JP 1770379 A JP1770379 A JP 1770379A JP 1770379 A JP1770379 A JP 1770379A JP S55110063 A JPS55110063 A JP S55110063A
Authority
JP
Japan
Prior art keywords
discharge plate
conductor
heat discharge
wiring
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1770379A
Other languages
Japanese (ja)
Inventor
Takahiko Shirato
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP1770379A priority Critical patent/JPS55110063A/en
Publication of JPS55110063A publication Critical patent/JPS55110063A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
    • H01L2224/491—Disposition
    • H01L2224/4912—Layout
    • H01L2224/49171—Fan-out arrangements

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE:To improve reliability by fixing a conductor to a heat discharge plate through an intermediary of an insulating material and eliminating contact between heat discharge plate and conductor. CONSTITUTION:Heat resisting insulation film 9, made of polyimide resin, is provided between heat discharge plate 2 and external lead conductor 3 and thereby a fixed distance is maintained between them. The film is provided with opening 9a in its center. An IC chip is fixed on the exposed part of heat discharge plate 2. After wiring 4 is provided, this is sealed with resin 8. By this structure, there is no contact between heat discharge plate and external lead conductor. Since conductor 3 is not slackened by pressure at the time of wiring, wiring becomes easy and no wire cut or deviation occurs. Since the heat discharge plate and the conductor are fixed by means of an adhesive, manufacturing is made easy.
JP1770379A 1979-02-16 1979-02-16 Semiconductor device Pending JPS55110063A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1770379A JPS55110063A (en) 1979-02-16 1979-02-16 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1770379A JPS55110063A (en) 1979-02-16 1979-02-16 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS55110063A true JPS55110063A (en) 1980-08-25

Family

ID=11951135

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1770379A Pending JPS55110063A (en) 1979-02-16 1979-02-16 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS55110063A (en)

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