JPS55107776A - Planer type high speed magnetron sputtering apparatus - Google Patents

Planer type high speed magnetron sputtering apparatus

Info

Publication number
JPS55107776A
JPS55107776A JP1483379A JP1483379A JPS55107776A JP S55107776 A JPS55107776 A JP S55107776A JP 1483379 A JP1483379 A JP 1483379A JP 1483379 A JP1483379 A JP 1483379A JP S55107776 A JPS55107776 A JP S55107776A
Authority
JP
Japan
Prior art keywords
magnetic pole
high speed
magnetron sputtering
type high
sputtering apparatus
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1483379A
Other languages
Japanese (ja)
Inventor
Yoshitsugu Miura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1483379A priority Critical patent/JPS55107776A/en
Publication of JPS55107776A publication Critical patent/JPS55107776A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering
    • H01J37/3408—Planar magnetron sputtering

Landscapes

  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Physical Vapour Deposition (AREA)

Abstract

PURPOSE:To obtain a uniform distribution of metallizing coating thickness which is not inferior to that obtained by using an annular magnetic pole of a large diameter, by using a magnetic pole, in which a number of small-sized permanent magnet are arranged annularly, in a plasma-focusing magnetic field generation unit installed at the cathode. CONSTITUTION:Use of a magnetic pole made by arranging a number of small permanent magnets 6 annularly on the peripheral part of a circular yoke of convex section gives a plasma-focusing effect which is not inferior to that given when a large annular magnetic pole of the same bore is used, thereby forming metallizing coating of uniform thickness distribution at a low cost and at a high efficiency.
JP1483379A 1979-02-10 1979-02-10 Planer type high speed magnetron sputtering apparatus Pending JPS55107776A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1483379A JPS55107776A (en) 1979-02-10 1979-02-10 Planer type high speed magnetron sputtering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1483379A JPS55107776A (en) 1979-02-10 1979-02-10 Planer type high speed magnetron sputtering apparatus

Publications (1)

Publication Number Publication Date
JPS55107776A true JPS55107776A (en) 1980-08-19

Family

ID=11872026

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1483379A Pending JPS55107776A (en) 1979-02-10 1979-02-10 Planer type high speed magnetron sputtering apparatus

Country Status (1)

Country Link
JP (1) JPS55107776A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189372A (en) * 1982-04-30 1983-11-05 Toshiba Corp Magnetron sputtering device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58189372A (en) * 1982-04-30 1983-11-05 Toshiba Corp Magnetron sputtering device
US4441974A (en) * 1982-04-30 1984-04-10 Tokyo Shibaura Denki Kabushiki Kaisha Magnetron sputtering apparatus
JPH0411625B2 (en) * 1982-04-30 1992-03-02 Toshiba Kk

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