JPS55107487A - Method for formation of exothermic resistor for heat sensible recording head - Google Patents

Method for formation of exothermic resistor for heat sensible recording head

Info

Publication number
JPS55107487A
JPS55107487A JP1423179A JP1423179A JPS55107487A JP S55107487 A JPS55107487 A JP S55107487A JP 1423179 A JP1423179 A JP 1423179A JP 1423179 A JP1423179 A JP 1423179A JP S55107487 A JPS55107487 A JP S55107487A
Authority
JP
Japan
Prior art keywords
film
resistor
patern
tantalate
recording head
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1423179A
Other languages
Japanese (ja)
Inventor
Michiyoshi Kawahito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP1423179A priority Critical patent/JPS55107487A/en
Publication of JPS55107487A publication Critical patent/JPS55107487A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To reduce the manufacturing process of the exothermic resistor for the heat sensible recording head greatly, and to lower the manufacturing cost, by forming the resistor patern as the result of trimming the resistance film formed on the substrate by means of a laser trimmer.
CONSTITUTION: Thin film resistant film 4 consisting of nitriding tantalate is formed on alumina substrate 8 provided with grades, which is done by means of the mask spattering, then, the resistant film 4 consisting of nitride tantalate is divided by space 9 formed by means of trimming using a laser trimmer, to form the resistor patern. Next, conductive film 5 is formed by means of an usual vacuum evaculation method, and then the patern of the conductive film 5 is formed by means of photographic etching. Next, silicon oxide film 6 and tantalate pentoxide film 7 are sequentially formed as the resistor protection layer by means of a spattering method.
COPYRIGHT: (C)1980,JPO&Japio
JP1423179A 1979-02-13 1979-02-13 Method for formation of exothermic resistor for heat sensible recording head Pending JPS55107487A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1423179A JPS55107487A (en) 1979-02-13 1979-02-13 Method for formation of exothermic resistor for heat sensible recording head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1423179A JPS55107487A (en) 1979-02-13 1979-02-13 Method for formation of exothermic resistor for heat sensible recording head

Publications (1)

Publication Number Publication Date
JPS55107487A true JPS55107487A (en) 1980-08-18

Family

ID=11855290

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1423179A Pending JPS55107487A (en) 1979-02-13 1979-02-13 Method for formation of exothermic resistor for heat sensible recording head

Country Status (1)

Country Link
JP (1) JPS55107487A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110126477A (en) * 2019-06-11 2019-08-16 山东华菱电子股份有限公司 A kind of film thermal printing head repairs resistance method and device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110126477A (en) * 2019-06-11 2019-08-16 山东华菱电子股份有限公司 A kind of film thermal printing head repairs resistance method and device
CN110126477B (en) * 2019-06-11 2020-03-06 山东华菱电子股份有限公司 Method and device for repairing resistance of thin-film thermal sensitive printing head

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