CN110126477A - A kind of film thermal printing head repairs resistance method and device - Google Patents
A kind of film thermal printing head repairs resistance method and device Download PDFInfo
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- CN110126477A CN110126477A CN201910502475.3A CN201910502475A CN110126477A CN 110126477 A CN110126477 A CN 110126477A CN 201910502475 A CN201910502475 A CN 201910502475A CN 110126477 A CN110126477 A CN 110126477A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/375—Protection arrangements against overheating
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Abstract
What the present invention proposed a kind of film thermal printing head repairs resistance method and device, measurement has the resistance value of multiple heating resistors of essentially identical thermal capacity and thermal resistance one by one, periodically increasing to the voltage that aforementioned heating resistor applies reduces resistance value, apply every time and cooled down between voltage and survey resistance, aforementioned resistance value reaches RFirst upper limitBefore, increase the voltage amplitude of phasic Chang significantly according to change in resistance, according to temperature with the pulse voltage for the pulse width for repairing the application variation of resistance rate relationship;Aforementioned resistance value reaches RFirst upper limitWhen, increase the voltage amplitude of phasic Chang smaller according to change in resistance, according to temperature with the pulse voltage for the pulse width for repairing the application variation of resistance rate relationship;Aforementioned resistance value reaches RSecond upper limitWhen, stop applying pulse voltage.The above method can both avoid exceeding heater tolerable temperature, lead to the damage of heater, can also be improved the efficiency and precision for repairing resistance due to directly repairing resistance method using temperature adjustment etc..
Description
Technical field
Resistance method and dress are repaired the present invention relates to thermal printing technique field more particularly to a kind of film thermal printing head
It sets.
Background technique
It is well known that as shown in Figure 1, film thermal printing head by heat-radiating substrate 1, ceramic substrate 2, PCB3, IC package 4,
Sockets 6 etc. are constituted, and ceramic substrate 2 is equipped with heater 5.Body region generate heat as shown in Fig. 2, single by recuperation layer 7, electrode 8, fever
Member 9, protective layer 10 etc. are constituted.Heater is made of thin-film technique (example steams, ion plating, magnetron sputtering etc.), due to target
Uniform sex differernce and the reasons such as difference of filming equipment to will cause the heater film layer on same product inhomogenous, will
Lead to the deviation of heater resistance value, according to the following formula:
P=U^2/R, P indicate heating power;U indicates to apply voltage;R indicates heater resistance value.
When heater resistance value is inhomogenous, it is different to result in heater heating power, to cause to go out on printing specimen page
Existing black muscle or white muscle, resistance value is high, energy is small just prints white muscle, and resistance value is low, energy just prints greatly black muscle.Common product resistance value deviation
It can reach 5~10%, but print more demanding occasion for picture etc., it is desirable that resistance value deviation is even more small below 1%,
So will carry out repairing resistance to print head, keeps its resistance value uniform or resistance value customizes.
The heater of film thermal printing head is made of Ta system or other high thermal efficiencies, high heat resistance material etc., is had
The characteristics of application is more than the voltage of certain breadth and amplitude, and resistance value changes, under the conditions of a certain temperature range, heater material
Crystallization occurs for material, crystal grain rearranges then resistance value reduction, and under the conditions of other temperature, heater occurs oxidation or cracking and causes
Resistance value increases, and when both above conditions prints usually is not up to, and using this characteristic, (former hinders far from it not destroying
Value, example deviation are more than 40% or more to be easy for destroying) under the premise of heater resistance value, applies voltage appropriate, make its resistance
Value achievees the purpose that homogenization or customization.
Related art is as follows:
Japanese Laid-Open Patent Publication 4-339667 Mitsubishi Electric patent, the description of resistance method is repaired about thermal printing head, is mentioned for not
Applying different voltages with the deviation of target value according to it with resistance makes resistance decrease to achieve the purpose that repair resistance, but specifically how to adjust
There is no specifically describe for whole voltage and energy.In addition there are also the descriptions that resistance value influences gradation of drop-out colour.
Japanese Laid-Open Patent Publication 4-164655 kyocera patent, the description of resistance is repaired about film print head, and method is that experiment obtains first
The pulsewidth and power of voltage (rise or fall) relationship relative to resistance varying-ratio, carry out repairing resistance according still further to this variation relation.
Japanese Laid-Open Patent Publication 4-298360 kyocera patent, the description of resistance is repaired about film print head, and method is that experiment obtains first
The pulsewidth and power of voltage, as correction curve, apply voltage according to this correction curve and are repaired relative to resistance varying-ratio curve
Resistance.Heater is grouped again, resistive rate amendment correction curve is repaired according to previous group is practical, then again using revised
Correction curve carries out later group to repair resistance, promotes precision and efficiency with this.
Japanese Laid-Open Patent Publication 4-226767 kyocera patent, the description of resistance is repaired about film print head, and method is according to current fever
Bulk area repairs resistance power with the ratio of reference area.
Japanese Laid-Open Patent Publication 4-261872 kyocera patent, repairs the description of resistance about film print head, and method is low after resistance for repairing
In the point of target zone, then resistance is repaired, increase to meet goal standard it.
It, all can larger shadow since the material of heater portion (including recuperation layer, heat-generating units, protective layer etc.), size are different
The structure and accumulation of heat heat-sinking capability of entire fever body region are rung, therefore different product starting repairs resistance condition and repairs resistance process condition and all can
It is widely different.Though describing in the above pertinent literature, thermal printing head made of thick film and thin-film technique is various to repair resistance side
Method and its improved method, but the setting of these initial conditions and repair the method for adjustment of resistance process conditional and belong to and change indirectly
The method for the condition that hinders of turning revisionism needs to grope to repair again resistance condition or correction curve for different series product, may influence to repair resistance
Precision and efficiency.
Summary of the invention
In order to solve the problems in the existing technology, resistance method is repaired the invention proposes a kind of film thermal printing head
And device, resistance precision and efficiency are repaired to improve.
To achieve the goals above, resistance method, the method packet are repaired the invention proposes a kind of film thermal printing head
Include following steps: measurement has the resistance value of a plurality of heating resistors of essentially identical thermal capacity and thermal resistance one by one, periodically
Increasing to the voltage that aforementioned heating resistor applies reduces resistance value, applies cooled down between voltage and survey resistance every time, aforementioned
Before resistance value reaches the first upper limit value of desired target resistance values, the voltage amplitude of phasic Chang is made according to the variation of resistance value
Significantly increase, applies the pulse voltage of the pulse width of variation under the premise of controlling temperature and meeting and currently repair resistance rate;It is aforementioned
When resistance value reaches the first upper limit value of desired target resistance values, according to the variation of resistance value make the voltage amplitude of phasic Chang compared with
Increase smallly, continues to the pulse voltage of the pulse width of variation with the relationship for repairing resistance rate according to temperature;Aforementioned resistance value reaches
When the second upper limit value of desired target resistance values, the second upper limit value then stops applying pulse voltage less than the first upper limit value.
The invention also proposes repair resistance using above method to repair resistance device.
What the beneficial effect of the program of the present invention was above-mentioned film thermal printing head repairs resistance method and device, due to adopting
Resistance method directly is repaired with temperature adjustment etc., heater tolerable temperature can be both avoided exceeding, lead to the damage of heater, it can also
To improve the efficiency and precision of repairing resistance.
Detailed description of the invention
Fig. 1 shows the overall structure diagram of thermal printing head according to the present invention.
Fig. 2 shows the structural schematic diagrams in the heater portion of film thermal printing head according to the present invention.
Fig. 3 shows the temperature of heater according to the present invention and repairs resistance rate graph of relation.
Fig. 4 shows the thermal response curve figure in heater portion according to the present invention.
Fig. 5 shows the Standard resistance range schematic diagram that heater according to the present invention repairs resistance process.
Fig. 6, which is shown, according to the present invention repairs resistance flow diagram.
Appended drawing reference: 1- heat-radiating substrate, 2- ceramic substrate, 3-PCB, 4-IC encapsulation, 5- heater, 6- socket, 7- accumulation of heat
Layer, 8- electrode, 9- heat-generating units, 10- protective layer.
Specific embodiment
A specific embodiment of the invention is further described with reference to the accompanying drawing.
Film thermal printing head according to the present invention repairs resistance method by surveying resistance and carrying out a series of resistance values, thermometer
It calculates, resistance algorithm is repaired in optimization, the breadth and amplitude of the voltage being applied on heater is controlled, in two stages to the resistance value of heater
It is adjusted, to reach the technical goal of homogenization or the customization of resistance value.It is directly changed since the method for temperature-compensating belongs to
The method for repairing resistance condition, but also be divided into two according to the range of the same target value of resistance value (or specification value) difference and repair the resistance stage,
It can significantly improve and repair resistance efficiency and precision.
Film heating body is made of Ta system or other high thermal efficiencies, high heat resistance material etc..The material tool of this general series
There is the voltage for applying certain breadth and amplitude, the characteristics of resistance value changes, under the conditions of a certain temperature range, heating material
Crystallization occurs and crystal grain rearranges then resistance value reduction, under the conditions of other temperature, heater then occurs to aoxidize or crack and lead
Resistance value is caused to increase.According to material, this feature can find the corresponding pass for repairing resistance rate relative to temperature by previous experiments and calculating
System, as shown in Figure 3.
The resistance method of repairing of film thermal printing head according to the present invention includes the following steps, as shown in Figure 6:
Step S1, the first ruler according to heater portion (including recuperation layer, heat-generating units, protective layer etc.) is needed before repairing resistance
Very little, material calculates the thermal capacity (Cth) and thermal resistance (Rth) in heater portion in conjunction with temperature experimental data before.Work as heat
Capacity and thermal resistance be determine in the case where, the thermal response curve in heater portion be it is determining, as shown in Figure 4.
Further according to hot differential formulas:
C dT+AT dt=Q dt;
C i.e. Cth: thermal capacity (J/K);
T: temperature (K);
A: thermal diffusion coefficient Rth=1/A (W/K);
T: time (s);That is the breadth of voltage;
Q: heating power (W).
In the case that product has determined, thermal capacity C and thermal diffusion coefficient A be it is known, power can refer to current machine
The calibration power of kind, the amplitude of voltage can be calculated according to power and preset resistive value, as shown in figure 3, if repairing resistance rate is
It (can be set as needed) in known situation, then could be aware that temperature T, and then pass through the heat in heater portion shown in Fig. 4
Response curve, then the breadth of voltage can be calculated by above-mentioned hot differential formulas.
Step S2, it sets the starting resistance estimated, repair resistance target value, repair resistance upper lower limit value, repair resistance step number and step pitch etc. just
Beginning reference conditions, during actually repairing resistance, these conditions may change according to resistance result is repaired.According to calculating above-mentioned
It is assured that resistance condition, i.e. starting voltage amplitude and breadth are repaired in starting.It avoids generating correction curve before repairing resistance, and effectively
Apply the time waste that the pulse voltage of resistance condition is repaired in many useless searchings before repairing resistance.
Step S3, survey resistance is carried out to heating resistors all on thermal printing head by surveying resistance circuit.
Step S4, the judgement whether resistance value reaches target value is carried out, terminates to repair resistance if reaching, otherwise continues to repair resistance.
Step S5, according to the difference of the step S3 current value measured and target value, corresponding repair is selected to hold required for the resistance stage
Capable repairs choked flow journey.
According to the difference of the step S3 current value measured and target value, can carry out repairing resistance in two stages, as shown in figure 5, the
One stage was initially to repair the resistance stage, and current value is larger with target value gap, was greater than the first upper limit value of R target, i.e., in the first stage:
R>RTheOneThe upper limit;Second stage is that current value reaches the first upper limit value of R target, needs to reduce and repairs resistance step pitch, i.e., in second stage: RThe
TwoThe upper limit<R<RTheOneThe upper limit.Voltage conditions are made of two parts, i.e. amplitude and breadth, and amplitude is mainly related with power, and breadth is main
Related with energy, power acts on temperature rise more significant during repairing resistance, so in the initial phase for repairing resistance, it is higher in order to obtain
Efficiency needs that voltage amplitude is continuously improved, quickly to promote temperature;The accumulation of energy may result in heater oxidation or
Cracking, so as to cause resistance value destruction, so energy should be reduced as far as possible.
When the current value that step S3 is measured is in the first stage, S11~S15 is thened follow the steps:
Step S11, the raised amplitude, ao U of voltage is determined with the difference of target value according to the current value measured1, difference is bigger
Need raised amplitude bigger.Since in the first stage, current value is larger with target value deviation, so repairing resistance step pitch will also compare
(it is big that step pitch is hindered than repairing in preset initial conditions) greatly, i.e. amplitude enhancement coefficient K1Larger namely voltage increasing degree is larger.
Step S12, this (is skipped if resistance is repaired for the first time according to the amplitude that the current value calculating previous step measured repairs resistance
Step), determine the raised amplitude, ao U of voltage currently walked2If previous step repairs resistance, amplitude is bigger, and the voltage currently walked is raised
Amplitude is smaller, if previous step repairs resistance, amplitude is smaller, and the raised amplitude of the voltage currently walked is bigger, as one of the coefficient of correction
K2(example, K2Value range is 0.1~2), therefore Δ U2=K2×ΔU1.Wherein previous step refers to the process step of last round of execution
Suddenly;Current step refers to currently performed process step S11~S15.
Step S13, power can be calculated according to the voltage of current value and setting measured, if repairing resistance, voltage etc. for the first time
The amplitude of the voltage calculated in initial conditions adds the raised amplitude of voltage currently walked, repairs resistance, voltage etc. for the first time if non-
The raised amplitude of voltage currently walked is added in the amplitude for the voltage that previous step calculates;Further according to conditions such as Cth/Rth and work as
Preceding step repairs the corresponding temperature of resistance rate and (repairs resistance to R due to currently walking to have set to presetx, therefore repairing of currently walking can be calculated
Resistance rate), the pulse width for needing to apply can be calculated using hot differential formulas, and the amplitude and breadth of voltage have just been determined in this way.
Step S14, pulse voltage is applied according to the step S13 voltage amplitude determined and breadth.
Step S15, it is cooled down, and turns again to step S3 and carry out survey resistance.
When the current value that step S3 is measured is in second stage, S21~S25 is thened follow the steps:
Step S21, the raised amplitude, ao U of voltage is determined with the difference of target value according to the current value measured1, difference is bigger
Need raised amplitude bigger.Since in second stage, current value is smaller with target value deviation, also it is less than so repairing resistance step pitch
Resistance step pitch, i.e. amplitude enhancement coefficient K are repaired in step S111Smaller namely voltage increasing degree is smaller.
Step S22, this (is skipped if resistance is repaired for the first time according to the amplitude that the current value calculating previous step measured repairs resistance
Step), determine the raised amplitude, ao U of voltage currently walked2If previous step repairs resistance, amplitude is bigger, and the voltage currently walked is raised
Amplitude is smaller, if previous step repairs resistance, amplitude is smaller, and the raised amplitude of the voltage currently walked is bigger, as one of the coefficient of correction
K2(example, K2Value range is 0.1~2), therefore Δ U2=K2×ΔU1.Wherein previous step refers to the process step of last round of execution
Suddenly;Current step refers to currently performed process step S21~S25.
Step S23, power can be calculated according to the voltage of current value and setting measured, if repairing resistance, voltage etc. for the first time
The amplitude of the voltage calculated in initial conditions adds the raised amplitude of voltage currently walked, repairs resistance, voltage etc. for the first time if non-
The raised amplitude of voltage currently walked is added in the amplitude for the voltage that previous step calculates;Further according to conditions such as Cth/Rth and work as
Preceding step repairs the corresponding temperature of resistance rate and (repairs resistance to R due to currently walking to have set to presetx, therefore repairing of currently walking can be calculated
Resistance rate), the pulse width for needing to apply can be calculated using hot differential formulas, and the amplitude and breadth of voltage have just been determined in this way.
Step S24, pulse voltage is applied according to the step S23 voltage amplitude determined and breadth.
Step S25, it is cooled down, and turns again to step S3 and carry out survey resistance.
The two above stage is repeated repairs resistance until resistance value is up to specification, according to resistance amplitude is repaired, repair resistance number from 1~
100steps etc..
Due to directly repairing resistance method using temperature adjustment etc., both it can also be improved and repair to avoid the damage of heater
The efficiency and precision of resistance.
Embodiment 1
In the present embodiment, it is illustrated by taking a certain 200dpi photo film print head as an example, heater portion includes storing
Thermosphere 7, heat-generating units 9 and protective layer 10, wherein recuperation layer 7 be lead borosilicate based on glass (30~50um of thickness), hair
Hot body 5 is Ta based material, and the heater 5 includes that (size of each heat-generating units 9 is as follows: width is several heat-generating units 9
100um, length be 100~130um, with a thickness of 0.1~0.3um), protective layer 10 be SIALON (with a thickness of 8~12um).
Choked flow journey S1 is repaired in execution, the first size according to heater portion, material is needed before repairing resistance, in conjunction with temperature before
Experimental data is spent, the thermal capacity and thermal resistance in heater portion are calculated.It will form in thermal printing head according to the number of heat-generating units 9
The heater portion of corresponding number, the thermal capacity and thermal resistance in each heater portion are essentially identical.
Further according to hot differential formulas: C dT+AT dt=Q dt, in the case that product has determined, thermal capacity C and heat
Diffusion coefficient A be it is known, power can refer to the calibration power of current machine, can be calculated according to power and preset resistive value
The amplitude of voltage, as shown in figure 3, if repairing resistance rate is that could be aware that temperature T, and then by shown in Fig. 4 in known situation
Heater portion thermal response curve, then the amplitude of voltage can be calculated by above-mentioned hot differential formulas.In the present embodiment,
It uses and repairs resistance voltage amplitude range as 15~50V.It uses and repairs resistance voltage time breadth range as 0.1~100ms.
Process S2 is executed, is assured that resistance condition, i.e. starting voltage amplitude and breadth are repaired in starting according to calculating above-mentioned,
Example 28V and 1ms.It concurrently sets and estimates 900 Ω of starting resistance, repairs resistance 800 Ω of target value, bound ± 1% repairs resistance step number
The initial references condition such as 40steps and step pitch 0.5V/step, actually these conditions may be hindered according to repairing during repairing resistance
As a result it changes.
Process S3 is executed, survey resistance, example resistance are carried out to all the points on thermal printing head (heating resistor) by surveying resistance circuit
Value range is R0:900 Ω ± 3%, and 0.1% should at least be reached by surveying resistance precision.
Process S4 is executed, the judgement whether resistance value reaches target value is carried out, terminates to repair resistance if reaching, otherwise continue to repair
Resistance.
Process S5 is executed, according to the difference of the step S3 current value measured and target value, selects corresponding repair needed for the resistance stage
What is executed repairs choked flow journey.
According to the difference of the step S3 current value measured and target value, carry out repairing resistance in two stages, the first stage is initial
The resistance stage is repaired, current value is larger with target value gap, is greater than the first upper limit value of R target, and example current value is R target value * 108%;
The current value of second stage reaches the first upper limit value of R target, and example current value is R target value * 102%, needs to reduce at this time and repairs resistance
Step pitch.
The step of if current value measured is in the first stage, executes S11~S15.
S11 is first carried out, according to the resistance value measured, 864 Ω of example, with the difference of target value, 64 Ω of example determines that voltage increases
Amplitude, ao U1, difference is bigger to need raised bigger (the example Δ U of amplitude1=0.5V/step).Since the resistance value of first stage is same
Target value deviates larger, example 8%, so repairing resistance step pitch also wants bigger, i.e. amplitude enhancement coefficient K1It is larger.
Then the amplitude that the computing the resistor value previous step that execution S12, basis measure repairs resistance (skips this if resistance is repaired for the first time
Step), determine the raised amplitude, ao U of voltage currently walked2If previous step repairs resistance, amplitude is bigger, and the voltage currently walked is raised
Amplitude is smaller, if previous step repairs resistance, amplitude is smaller, and the raised amplitude of the voltage currently walked is bigger, as one of the coefficient of correction
K2, example K2=1.2, the then raised amplitude, ao U of the voltage currently walked2=0.5V/step*1.2=0.6V/step.
Then it executes S13, power can be calculated according to the voltage of resistance value and setting measured, if repairing resistance, voltage for the first time
Amplitude equal to the voltage calculated in initial conditions adds the raised amplitude of voltage currently walked, repairs resistance, voltage for the first time if non-
Amplitude equal to the voltage of previous step calculating adds the raised amplitude of voltage currently walked;Further according to conditions such as Cth/Rth and
Current step repairs the corresponding temperature of resistance rate and (repairs resistance to R due to currently walking to have set to presetx, therefore can calculate and currently to walk
Repair resistance rate), example is repaired from -4% to -5% 505 DEG C of corresponding temperature example, and the arteries and veins for needing to apply can be calculated using hot differential formulas
Breadth is rushed, example 1ms has just determined the amplitude and breadth of voltage in this way.
It executes S14, pulse voltage is applied according to the voltage amplitude (example 28.6V) and breadth (example 1ms) of aforementioned determination.Apply
Voltage terminates, and in order to keep survey resistance more acurrate, the influence of removal TCR (temperature-coefficient of electrical resistance) will carry out cooling appropriate, and the time sets
Determine range about 0.5~10s.
It executes S15, cooled down, example 1s, and turn again to step S3 and carry out survey resistance.
The step of if current value measured is in second stage, executes S21~S25.
S21 is first carried out, the raised amplitude, ao U of voltage is determined with the difference of target value according to the resistance value measured1, difference gets over
Bigger (the example Δ U of raised amplitude is needed greatly1=0.2V/step).Since the resistance value of second stage deviates smaller, example with target value
2%, so repairing resistance step pitch also wants smaller, i.e. amplitude enhancement coefficient K1Smaller, i.e., the amplitude of voltage can increase smaller.
Then the amplitude that the computing the resistor value previous step that execution S22, basis measure repairs resistance (skips this if resistance is repaired for the first time
Step), determine the raised amplitude, ao U of voltage currently walked2If previous step repairs resistance, amplitude is bigger, and the voltage currently walked is raised
Amplitude is smaller, if previous step repairs resistance, amplitude is smaller, and the raised amplitude of the voltage currently walked is bigger, as one of the coefficient of correction
K2(example, K2Value is 1.1) therefore Δ U2=0.2V/step*1.1=0.22V/step.
Then it executes S23, power can be calculated according to the voltage of resistance value and setting measured, if repairing resistance, voltage for the first time
Amplitude equal to the voltage calculated in initial conditions adds the raised amplitude of voltage currently walked, repairs resistance, voltage for the first time if non-
Amplitude equal to the voltage of previous step calculating adds the raised amplitude of voltage currently walked;Further according to conditions such as Cth/Rth and
Current step repairs the corresponding temperature of resistance rate and (repairs resistance to R due to currently walking to have set to presetx, therefore can calculate and currently to walk
Repair resistance rate), the pulse width for needing to apply, example 0.7ms can be calculated using hot differential formulas.The width of voltage has just been determined in this way
Degree and breadth.
It executes S24, pulse voltage is applied according to the voltage amplitude and breadth of aforementioned determination.
It executes S25, cooled down, and turn again to step S3 and carry out survey resistance.
The two above stage is repeated repairs resistance until resistance value is up to specification, according to resistance amplitude is repaired, repair resistance number from 1~
100steps etc..
Film thermal printing head according to the present invention repairs resistance method due to directly repairing resistance side using temperature adjustment etc.
Method can both avoid exceeding heater tolerable temperature, lead to the damage of heater, can also be improved the efficiency and precision for repairing resistance.
Claims (2)
1. a kind of film thermal printing head repairs resistance method, it is characterised in that: the described method comprises the following steps: measurement tool one by one
There is the resistance value of a plurality of heating resistors of essentially identical thermal capacity and thermal resistance, periodically increases and applied to aforementioned heating resistor
The voltage added reduces resistance value, applies cooled down between voltage and survey resistance every time, aforementioned resistance value reaches desired target resistance
Before first upper limit value of value, increase the voltage amplitude of phasic Chang significantly according to the variation of resistance value, in control temperature
Meet the pulse voltage for applying the pulse width of variation under the premise of currently repairing resistance rate;Aforementioned resistance value reaches desired target resistance
When the first upper limit value of value, increase the voltage amplitude of phasic Chang smaller according to the variation of resistance value, is repaired according to temperature is same
The relationship of resistance rate continues to the pulse voltage of the pulse width of variation;Aforementioned resistance value reaches the of desired target resistance values
When two upper limit values, the second upper limit value then stops applying pulse voltage less than the first upper limit value.
2. a kind of film thermal printing head repairs resistance device, it is characterised in that: measurement has essentially identical thermal capacity and heat one by one
The resistance value of a plurality of heating resistors of resistance, periodically increasing to the voltage that aforementioned heating resistor applies reduces resistance value,
Apply voltage every time and survey between resistance and is cooled down, before aforementioned resistance value reaches the first upper limit value of desired target resistance values,
Increase the voltage amplitude of phasic Chang significantly according to the variation of resistance value, the premise for currently repairing resistance rate is met in control temperature
The pulse voltage of the lower pulse width for applying variation;When aforementioned resistance value reaches the first upper limit value of desired target resistance values, root
Increase the voltage amplitude of phasic Chang smaller according to the variation of resistance value, continues to become with the relationship for repairing resistance rate according to temperature
The pulse voltage of the pulse width of change;When aforementioned resistance value reaches the second upper limit value of desired target resistance values, second upper limit
Value then stops the device for applying pulse voltage less than the first upper limit value.
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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CN112644183A (en) * | 2020-11-30 | 2021-04-13 | 山东华菱电子股份有限公司 | Multi-pulse heating control method based on segmented multipoint resistance measurement and printing head |
CN113815317A (en) * | 2020-11-30 | 2021-12-21 | 山东华菱电子股份有限公司 | Printing head heating control device and method based on segmented multipoint resistance measurement and printing head |
CN114905862A (en) * | 2021-02-08 | 2022-08-16 | 山东华菱电子股份有限公司 | Heating substrate for thin film thermal sensitive printing head and manufacturing method thereof |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55107487A (en) * | 1979-02-13 | 1980-08-18 | Hitachi Ltd | Method for formation of exothermic resistor for heat sensible recording head |
JPS6246658A (en) * | 1985-08-26 | 1987-02-28 | Mitsubishi Electric Corp | Thermal head |
JPH0233904A (en) * | 1988-07-25 | 1990-02-05 | Copal Co Ltd | Pulse generation circuit for thick film resistor trimming |
JPH04128055A (en) * | 1990-09-19 | 1992-04-28 | Hitachi Ltd | Electronic circuit device and its manufacture |
JPH04164655A (en) * | 1990-05-31 | 1992-06-10 | Kyocera Corp | Method for trimming resistors of thin-film thermal head |
JPH04261872A (en) * | 1991-01-21 | 1992-09-17 | Kyocera Corp | Method for trimming resistor for thin film thermal head |
JPH06227016A (en) * | 1993-02-05 | 1994-08-16 | Fuji Xerox Co Ltd | Method and apparatus for trimming of thermal head |
-
2019
- 2019-06-11 CN CN201910502475.3A patent/CN110126477B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55107487A (en) * | 1979-02-13 | 1980-08-18 | Hitachi Ltd | Method for formation of exothermic resistor for heat sensible recording head |
JPS6246658A (en) * | 1985-08-26 | 1987-02-28 | Mitsubishi Electric Corp | Thermal head |
JPH0233904A (en) * | 1988-07-25 | 1990-02-05 | Copal Co Ltd | Pulse generation circuit for thick film resistor trimming |
JPH04164655A (en) * | 1990-05-31 | 1992-06-10 | Kyocera Corp | Method for trimming resistors of thin-film thermal head |
JPH04128055A (en) * | 1990-09-19 | 1992-04-28 | Hitachi Ltd | Electronic circuit device and its manufacture |
JPH04261872A (en) * | 1991-01-21 | 1992-09-17 | Kyocera Corp | Method for trimming resistor for thin film thermal head |
JPH06227016A (en) * | 1993-02-05 | 1994-08-16 | Fuji Xerox Co Ltd | Method and apparatus for trimming of thermal head |
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