JPS55104495A - Gold plating liquid and gold plating method for using gold plating liquid - Google Patents

Gold plating liquid and gold plating method for using gold plating liquid

Info

Publication number
JPS55104495A
JPS55104495A JP867179A JP867179A JPS55104495A JP S55104495 A JPS55104495 A JP S55104495A JP 867179 A JP867179 A JP 867179A JP 867179 A JP867179 A JP 867179A JP S55104495 A JPS55104495 A JP S55104495A
Authority
JP
Japan
Prior art keywords
gold plating
gold
plating
plating liquid
carrying
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP867179A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6218637B2 (enExample
Inventor
Kazuhiro Higuchi
Yoshiyasu Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
EEJA Ltd
Original Assignee
Electroplating Engineers of Japan Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Electroplating Engineers of Japan Ltd filed Critical Electroplating Engineers of Japan Ltd
Priority to JP867179A priority Critical patent/JPS55104495A/ja
Publication of JPS55104495A publication Critical patent/JPS55104495A/ja
Publication of JPS6218637B2 publication Critical patent/JPS6218637B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electroplating And Plating Baths Therefor (AREA)
  • Electroplating Methods And Accessories (AREA)
JP867179A 1979-01-30 1979-01-30 Gold plating liquid and gold plating method for using gold plating liquid Granted JPS55104495A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP867179A JPS55104495A (en) 1979-01-30 1979-01-30 Gold plating liquid and gold plating method for using gold plating liquid

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP867179A JPS55104495A (en) 1979-01-30 1979-01-30 Gold plating liquid and gold plating method for using gold plating liquid

Publications (2)

Publication Number Publication Date
JPS55104495A true JPS55104495A (en) 1980-08-09
JPS6218637B2 JPS6218637B2 (enExample) 1987-04-23

Family

ID=11699388

Family Applications (1)

Application Number Title Priority Date Filing Date
JP867179A Granted JPS55104495A (en) 1979-01-30 1979-01-30 Gold plating liquid and gold plating method for using gold plating liquid

Country Status (1)

Country Link
JP (1) JPS55104495A (enExample)

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104493A (ja) * 1982-12-01 1984-06-16 Shinko Electric Ind Co Ltd 金ストライクめつき浴
JPS62149895A (ja) * 1985-12-23 1987-07-03 Hitachi Cable Ltd リ−ドフレ−ムの金めつき方法
JPS62151592A (ja) * 1985-12-25 1987-07-06 Hitachi Cable Ltd 金めつきリ−ドフレ−ムの製造方法
JPH05345997A (ja) * 1992-04-13 1993-12-27 Electroplating Eng Of Japan Co 金めっき品の製造方法
CN101818373A (zh) * 2010-04-27 2010-09-01 海洋王照明科技股份有限公司 金属表面形成稀土膜的方法及其应用
CN102154669A (zh) * 2011-03-28 2011-08-17 冠锋电子科技(梅州)有限公司 一种利用电镀薄金缸电镀厚软金的方法

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59104493A (ja) * 1982-12-01 1984-06-16 Shinko Electric Ind Co Ltd 金ストライクめつき浴
JPS62149895A (ja) * 1985-12-23 1987-07-03 Hitachi Cable Ltd リ−ドフレ−ムの金めつき方法
JPS62151592A (ja) * 1985-12-25 1987-07-06 Hitachi Cable Ltd 金めつきリ−ドフレ−ムの製造方法
JPH05345997A (ja) * 1992-04-13 1993-12-27 Electroplating Eng Of Japan Co 金めっき品の製造方法
CN101818373A (zh) * 2010-04-27 2010-09-01 海洋王照明科技股份有限公司 金属表面形成稀土膜的方法及其应用
CN102154669A (zh) * 2011-03-28 2011-08-17 冠锋电子科技(梅州)有限公司 一种利用电镀薄金缸电镀厚软金的方法
CN102154669B (zh) 2011-03-28 2013-03-13 冠锋电子科技(梅州)有限公司 一种利用电镀薄金缸电镀厚软金的方法

Also Published As

Publication number Publication date
JPS6218637B2 (enExample) 1987-04-23

Similar Documents

Publication Publication Date Title
JPS5754296A (en) Plating liquid for palladium nickel alloy
JPS55104495A (en) Gold plating liquid and gold plating method for using gold plating liquid
JPS55131193A (en) Electroplating method for alloy
JPS57140891A (en) Pretreating solution for silver plating
JPS55107795A (en) Gold tin alloy electroplating bath and plating method
JPS55115986A (en) Suppressing method for oxidation of tin in gold-tin alloy electroplating
JPS5380161A (en) Electrode formation of semiconductor
JPS53110460A (en) Electrode of compound semiconductor
JPS55164067A (en) Method for nonelectrolytic plating
JPS5641394A (en) Electrolytic electrode
JPS51129173A (en) Semi conductor with high voltage proof schottky electrode and it's man uacturing method.
JPS56136965A (en) Plating method
JPS5776196A (en) Silver-palladium alloy plating liquid
JPS53101975A (en) Treating method of semiconductor substrates
JPS5266374A (en) Galvanization of non electrolytic nickel for semiconductor substrate
JPS56136966A (en) Electroless plating method
JPS57146624A (en) Treatment of magnetic recording medium
JPS52143784A (en) Surface treating method of metal films provided to semiconductor device
JPS5426567A (en) Method of separating and rcovering component of chip of metal lining- laminated plate
JPS52143763A (en) Soldering method to holding substrate for semiconductor substrates
JPS52146176A (en) Formation of electrode in semiconductor device
JPS53135273A (en) Processing method of semiconductor compound substance
JPS5428584A (en) Manufacture of semiconductor laser element
JPS527950A (en) Preparation of ursodeoxycholic acid
JPS533064A (en) Production of semiconductor device