JPS55103762A - Dhd glass-sealed diode - Google Patents
Dhd glass-sealed diodeInfo
- Publication number
- JPS55103762A JPS55103762A JP1077279A JP1077279A JPS55103762A JP S55103762 A JPS55103762 A JP S55103762A JP 1077279 A JP1077279 A JP 1077279A JP 1077279 A JP1077279 A JP 1077279A JP S55103762 A JPS55103762 A JP S55103762A
- Authority
- JP
- Japan
- Prior art keywords
- electrode
- semiconductor element
- glass
- dhd
- glass tube
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 abstract 3
- 229910052804 chromium Inorganic materials 0.000 abstract 2
- 239000011521 glass Substances 0.000 abstract 2
- 229910052759 nickel Inorganic materials 0.000 abstract 2
- 229910052709 silver Inorganic materials 0.000 abstract 2
- 230000015572 biosynthetic process Effects 0.000 abstract 1
- 230000002950 deficient Effects 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 abstract 1
- 239000002184 metal Substances 0.000 abstract 1
- 229910052751 metal Inorganic materials 0.000 abstract 1
- 238000007789 sealing Methods 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/35—Mechanical effects
- H01L2924/351—Thermal stress
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electrodes Of Semiconductors (AREA)
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1077279A JPS55103762A (en) | 1979-01-31 | 1979-01-31 | Dhd glass-sealed diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1077279A JPS55103762A (en) | 1979-01-31 | 1979-01-31 | Dhd glass-sealed diode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55103762A true JPS55103762A (en) | 1980-08-08 |
| JPS623590B2 JPS623590B2 (enrdf_load_stackoverflow) | 1987-01-26 |
Family
ID=11759615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1077279A Granted JPS55103762A (en) | 1979-01-31 | 1979-01-31 | Dhd glass-sealed diode |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS55103762A (enrdf_load_stackoverflow) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58135942U (ja) * | 1982-03-09 | 1983-09-13 | 富士電機株式会社 | ガラス封止ダイオ−ド |
| CN106057789A (zh) * | 2016-07-01 | 2016-10-26 | 天津中环半导体股份有限公司 | 一种贴片式高压硅堆及其生产工艺 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518871A (en) * | 1974-07-10 | 1976-01-24 | Hitachi Ltd | Handotaisochino denkyoku |
| JPS5165659U (enrdf_load_stackoverflow) * | 1974-11-18 | 1976-05-24 |
-
1979
- 1979-01-31 JP JP1077279A patent/JPS55103762A/ja active Granted
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS518871A (en) * | 1974-07-10 | 1976-01-24 | Hitachi Ltd | Handotaisochino denkyoku |
| JPS5165659U (enrdf_load_stackoverflow) * | 1974-11-18 | 1976-05-24 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS58135942U (ja) * | 1982-03-09 | 1983-09-13 | 富士電機株式会社 | ガラス封止ダイオ−ド |
| CN106057789A (zh) * | 2016-07-01 | 2016-10-26 | 天津中环半导体股份有限公司 | 一种贴片式高压硅堆及其生产工艺 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS623590B2 (enrdf_load_stackoverflow) | 1987-01-26 |
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