JPS623590B2 - - Google Patents

Info

Publication number
JPS623590B2
JPS623590B2 JP54010772A JP1077279A JPS623590B2 JP S623590 B2 JPS623590 B2 JP S623590B2 JP 54010772 A JP54010772 A JP 54010772A JP 1077279 A JP1077279 A JP 1077279A JP S623590 B2 JPS623590 B2 JP S623590B2
Authority
JP
Japan
Prior art keywords
electrode
glass
layer
pellet
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP54010772A
Other languages
English (en)
Japanese (ja)
Other versions
JPS55103762A (en
Inventor
Shigeru Sakashita
Takashi Mizuguchi
Masatake Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Home Electronics Ltd
NEC Corp
Original Assignee
NEC Home Electronics Ltd
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Home Electronics Ltd, Nippon Electric Co Ltd filed Critical NEC Home Electronics Ltd
Priority to JP1077279A priority Critical patent/JPS55103762A/ja
Publication of JPS55103762A publication Critical patent/JPS55103762A/ja
Publication of JPS623590B2 publication Critical patent/JPS623590B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/102—Material of the semiconductor or solid state bodies
    • H01L2924/1025—Semiconducting materials
    • H01L2924/10251—Elemental semiconductors, i.e. Group IV
    • H01L2924/10253—Silicon [Si]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Die Bonding (AREA)
JP1077279A 1979-01-31 1979-01-31 Dhd glass-sealed diode Granted JPS55103762A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1077279A JPS55103762A (en) 1979-01-31 1979-01-31 Dhd glass-sealed diode

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1077279A JPS55103762A (en) 1979-01-31 1979-01-31 Dhd glass-sealed diode

Publications (2)

Publication Number Publication Date
JPS55103762A JPS55103762A (en) 1980-08-08
JPS623590B2 true JPS623590B2 (enrdf_load_stackoverflow) 1987-01-26

Family

ID=11759615

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1077279A Granted JPS55103762A (en) 1979-01-31 1979-01-31 Dhd glass-sealed diode

Country Status (1)

Country Link
JP (1) JPS55103762A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS58135942U (ja) * 1982-03-09 1983-09-13 富士電機株式会社 ガラス封止ダイオ−ド
CN106057789A (zh) * 2016-07-01 2016-10-26 天津中环半导体股份有限公司 一种贴片式高压硅堆及其生产工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS518871A (en) * 1974-07-10 1976-01-24 Hitachi Ltd Handotaisochino denkyoku
JPS5165659U (enrdf_load_stackoverflow) * 1974-11-18 1976-05-24

Also Published As

Publication number Publication date
JPS55103762A (en) 1980-08-08

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