JPS55100992A - Electrodeposition of leaddtin covering layer to bearing structure - Google Patents
Electrodeposition of leaddtin covering layer to bearing structureInfo
- Publication number
- JPS55100992A JPS55100992A JP15821379A JP15821379A JPS55100992A JP S55100992 A JPS55100992 A JP S55100992A JP 15821379 A JP15821379 A JP 15821379A JP 15821379 A JP15821379 A JP 15821379A JP S55100992 A JPS55100992 A JP S55100992A
- Authority
- JP
- Japan
- Prior art keywords
- leaddtin
- electrodeposition
- covering layer
- bearing structure
- covering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
- C25D3/60—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/10—Bearings
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/18—Regeneration of process solutions of electrolytes
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/16—Regeneration of process solutions
- C25D21/20—Regeneration of process solutions of rinse-solutions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/56—Electroplating: Baths therefor from solutions of alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating Methods And Accessories (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US06/005,602 US4187166A (en) | 1979-01-22 | 1979-01-22 | Method of removing copper ions from a bath containing same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS55100992A true JPS55100992A (en) | 1980-08-01 |
| JPS6214038B2 JPS6214038B2 (US20030157376A1-20030821-M00001.png) | 1987-03-31 |
Family
ID=21716702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP15821379A Granted JPS55100992A (en) | 1979-01-22 | 1979-12-07 | Electrodeposition of leaddtin covering layer to bearing structure |
Country Status (12)
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0293096A (ja) * | 1988-09-30 | 1990-04-03 | Daiwa Kasei Kenkyusho:Kk | 滑り軸受の表面合金層の製造法 |
| JPH0491712U (US20030157376A1-20030821-M00001.png) * | 1990-12-28 | 1992-08-10 |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4405412A (en) * | 1982-03-29 | 1983-09-20 | Dart Industries Inc. | Removal of copper contamination from tin plating baths |
| DE3502278C2 (de) * | 1985-01-24 | 1987-05-07 | MTU Motoren- und Turbinen-Union München GmbH, 8000 München | Vorrichtung zur Erfassung von Meßwerten in rotierenden Anordnungen |
| JPH0288847A (ja) * | 1988-09-26 | 1990-03-29 | Oyo Kikaku:Kk | 二重床構築方法 |
| US6143146A (en) * | 1998-08-25 | 2000-11-07 | Strom; Doug | Filter system |
| US6332973B1 (en) * | 2000-01-25 | 2001-12-25 | Advanced Micro Devices, Inc. | CMOS chemical bath purification |
| US6740221B2 (en) | 2001-03-15 | 2004-05-25 | Applied Materials Inc. | Method of forming copper interconnects |
| WO2003063067A1 (en) * | 2002-01-24 | 2003-07-31 | Chatterbox Systems, Inc. | Method and system for locating positions in printed texts and delivering multimedia information |
| WO2003085713A1 (en) * | 2002-04-03 | 2003-10-16 | Applied Materials, Inc. | Homogeneous copper-tin alloy plating for enhancement of electro-migration resistance in interconnects |
| JP4243985B2 (ja) * | 2002-09-24 | 2009-03-25 | 大日本スクリーン製造株式会社 | 金属イオンの除去方法及び基板処理装置 |
| US20040118699A1 (en) * | 2002-10-02 | 2004-06-24 | Applied Materials, Inc. | Homogeneous copper-palladium alloy plating for enhancement of electro-migration resistance in interconnects |
| CN112135932A (zh) * | 2018-05-09 | 2020-12-25 | 应用材料公司 | 用于去除电镀系统内的污染物的系统及方法 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US2734024A (en) * | 1956-02-07 | Method of making bearings | ||
| FR1334413A (fr) * | 1962-06-25 | 1963-08-09 | Coussinets Ste Indle | Procédés de préparation ou de régénération de bains mixtes de fluoborates de plomb et d'étain |
| US3812020A (en) * | 1969-08-11 | 1974-05-21 | Allied Chem | Electrolyte and method for electroplating an indium-copper alloy and printed circuits so plated |
| US3940319A (en) * | 1974-06-24 | 1976-02-24 | Nasglo International Corporation | Electrodeposition of bright tin-nickel alloy |
-
1979
- 1979-01-22 US US06/005,602 patent/US4187166A/en not_active Expired - Lifetime
- 1979-11-28 DE DE19792947998 patent/DE2947998A1/de active Granted
- 1979-11-30 CA CA000340975A patent/CA1153728A/en not_active Expired
- 1979-12-03 GB GB7941690A patent/GB2039955B/en not_active Expired
- 1979-12-04 IT IT50987/79A patent/IT1120140B/it active
- 1979-12-06 AU AU53560/79A patent/AU527503B2/en not_active Ceased
- 1979-12-07 JP JP15821379A patent/JPS55100992A/ja active Granted
- 1979-12-12 FR FR7930466A patent/FR2446872A1/fr active Granted
- 1979-12-27 BR BR7908545A patent/BR7908545A/pt not_active IP Right Cessation
-
1980
- 1980-01-01 IN IN10/CAL/80A patent/IN152023B/en unknown
- 1980-01-15 MX MX180807A patent/MX153508A/es unknown
- 1980-01-19 KR KR1019800000192A patent/KR850000304B1/ko not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0293096A (ja) * | 1988-09-30 | 1990-04-03 | Daiwa Kasei Kenkyusho:Kk | 滑り軸受の表面合金層の製造法 |
| JPH0491712U (US20030157376A1-20030821-M00001.png) * | 1990-12-28 | 1992-08-10 |
Also Published As
| Publication number | Publication date |
|---|---|
| KR830002066A (ko) | 1983-05-21 |
| AU527503B2 (en) | 1983-03-10 |
| KR850000304B1 (ko) | 1985-03-18 |
| US4187166A (en) | 1980-02-05 |
| IN152023B (US20030157376A1-20030821-M00001.png) | 1983-10-01 |
| GB2039955A (en) | 1980-08-20 |
| DE2947998C2 (US20030157376A1-20030821-M00001.png) | 1988-10-27 |
| AU5356079A (en) | 1981-07-02 |
| CA1153728A (en) | 1983-09-13 |
| IT7950987A0 (it) | 1979-12-04 |
| FR2446872A1 (fr) | 1980-08-14 |
| IT1120140B (it) | 1986-03-19 |
| MX153508A (es) | 1986-11-10 |
| FR2446872B1 (US20030157376A1-20030821-M00001.png) | 1983-01-14 |
| DE2947998A1 (de) | 1980-07-31 |
| GB2039955B (en) | 1983-01-26 |
| JPS6214038B2 (US20030157376A1-20030821-M00001.png) | 1987-03-31 |
| BR7908545A (pt) | 1980-09-02 |
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