JPS5493361A - Manufacture for x-ray exposure mask - Google Patents

Manufacture for x-ray exposure mask

Info

Publication number
JPS5493361A
JPS5493361A JP15841977A JP15841977A JPS5493361A JP S5493361 A JPS5493361 A JP S5493361A JP 15841977 A JP15841977 A JP 15841977A JP 15841977 A JP15841977 A JP 15841977A JP S5493361 A JPS5493361 A JP S5493361A
Authority
JP
Japan
Prior art keywords
substrate
pattern
mask
window
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15841977A
Other languages
Japanese (ja)
Inventor
Kiyoshi Ozawa
Fumio Yamagishi
Taiji Takayama
Yushi Inagaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15841977A priority Critical patent/JPS5493361A/en
Publication of JPS5493361A publication Critical patent/JPS5493361A/en
Pending legal-status Critical Current

Links

Abstract

PURPOSE: To form the though hole for marker with good accuracy, by forming the device pattern and the alignment mark pattern on the Si substrate, and opening the window at the back of the substrate opposing to the alignment pattern, and performing etching through taking the alignment pattern as a mask.
CONSTITUTION: On the surface of Si substrate, the device pattern 2 and the alignment mark pattern 3 are formed, and the rear side of the substrate opposing to these regions is covered with the protective film 7. Next, while clipping the substrate 1 with the protector 8, etching is made by taking the film 7 as a mask, window 6 is opened on the rear side of the substrate, and the substrate 1 for this part is made to the thin film 1'. After that, the protector 8 is removed, the resist 10 is coated other than the window 6 corresponding to the pattern 3, and it is reinforced with the film 11 such as Ti, Cu, Au and Co. Next, the part other than the pattern 3 is covered with the resist 12, forming the through hole 9 with etching by fleon gas for the thin layer 1' and 11 and the mask having the hole 9 can be obtained by removing the resists 9 and 10.
COPYRIGHT: (C)1979,JPO&Japio
JP15841977A 1977-12-30 1977-12-30 Manufacture for x-ray exposure mask Pending JPS5493361A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15841977A JPS5493361A (en) 1977-12-30 1977-12-30 Manufacture for x-ray exposure mask

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15841977A JPS5493361A (en) 1977-12-30 1977-12-30 Manufacture for x-ray exposure mask

Publications (1)

Publication Number Publication Date
JPS5493361A true JPS5493361A (en) 1979-07-24

Family

ID=15671334

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15841977A Pending JPS5493361A (en) 1977-12-30 1977-12-30 Manufacture for x-ray exposure mask

Country Status (1)

Country Link
JP (1) JPS5493361A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4817921B1 (en) * 1969-02-20 1973-06-01

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4817921B1 (en) * 1969-02-20 1973-06-01

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