JPS5384465A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5384465A
JPS5384465A JP15948376A JP15948376A JPS5384465A JP S5384465 A JPS5384465 A JP S5384465A JP 15948376 A JP15948376 A JP 15948376A JP 15948376 A JP15948376 A JP 15948376A JP S5384465 A JPS5384465 A JP S5384465A
Authority
JP
Japan
Prior art keywords
manufacture
semiconductor device
metal layer
lamination
ensure
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15948376A
Other languages
Japanese (ja)
Other versions
JPS581544B2 (en
Inventor
Osamu Akanuma
Hajime Ishikawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP15948376A priority Critical patent/JPS581544B2/en
Publication of JPS5384465A publication Critical patent/JPS5384465A/en
Publication of JPS581544B2 publication Critical patent/JPS581544B2/en
Expired legal-status Critical Current

Links

Abstract

PURPOSE: To ensure a precision patterning for the electrode metal layer, by forming a high close adhesion mask through lamination of the resist via the Cr or Ti thin film onto the Ti-Pt-gold metal layer on the element.
COPYRIGHT: (C)1978,JPO&Japio
JP15948376A 1976-12-29 1976-12-29 Manufacturing method of semiconductor device Expired JPS581544B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15948376A JPS581544B2 (en) 1976-12-29 1976-12-29 Manufacturing method of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15948376A JPS581544B2 (en) 1976-12-29 1976-12-29 Manufacturing method of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5384465A true JPS5384465A (en) 1978-07-25
JPS581544B2 JPS581544B2 (en) 1983-01-11

Family

ID=15694745

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15948376A Expired JPS581544B2 (en) 1976-12-29 1976-12-29 Manufacturing method of semiconductor device

Country Status (1)

Country Link
JP (1) JPS581544B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012175089A (en) * 2011-02-24 2012-09-10 Fujitsu Ltd Semiconductor device and method of manufacturing semiconductor device
JP2016103646A (en) * 2015-12-14 2016-06-02 富士通株式会社 Semiconductor device and method of manufacturing semiconductor device

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012175089A (en) * 2011-02-24 2012-09-10 Fujitsu Ltd Semiconductor device and method of manufacturing semiconductor device
US9379229B2 (en) 2011-02-24 2016-06-28 Fujitsu Limited Semiconductor apparatus including protective film on gate electrode and method for manufacturing the semiconductor apparatus
US9685547B2 (en) 2011-02-24 2017-06-20 Fujitsu Limited Semiconductor apparatus including barrier film provided between electrode and protection film
JP2016103646A (en) * 2015-12-14 2016-06-02 富士通株式会社 Semiconductor device and method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS581544B2 (en) 1983-01-11

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