JPS5483774A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPS5483774A JPS5483774A JP15196177A JP15196177A JPS5483774A JP S5483774 A JPS5483774 A JP S5483774A JP 15196177 A JP15196177 A JP 15196177A JP 15196177 A JP15196177 A JP 15196177A JP S5483774 A JPS5483774 A JP S5483774A
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- pellets
- metal ring
- conductive film
- manufacture
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Dicing (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
PURPOSE: To inspect characteristics by making a wafer in airtight contact with a conductive film and by electrically connecting an electrode from the substrate of the wafer to a measuring instrument.
CONSTITUTION: The wafer after an element is formed is adhered to conductive film 3 and divided into pellets 1, and then the film is elogated and connected to metal ring 2, so that a constant interval will be produced among pellets. Metal ring 2 is connected to the measring instrument and measurements of the element are made by probe 4, thereby fulfilling definite quality selection with high efficiency.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15196177A JPS5483774A (en) | 1977-12-16 | 1977-12-16 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP15196177A JPS5483774A (en) | 1977-12-16 | 1977-12-16 | Manufacture of semiconductor device |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5483774A true JPS5483774A (en) | 1979-07-04 |
JPS6118859B2 JPS6118859B2 (en) | 1986-05-14 |
Family
ID=15529988
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP15196177A Granted JPS5483774A (en) | 1977-12-16 | 1977-12-16 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5483774A (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57122528A (en) * | 1981-01-23 | 1982-07-30 | Nippon Telegr & Teleph Corp <Ntt> | Drawing system for electron beam exposure apparatus |
JPS63178333U (en) * | 1987-05-09 | 1988-11-18 | ||
JP2011049337A (en) * | 2009-08-27 | 2011-03-10 | Fuji Electric Systems Co Ltd | Method of manufacturing semiconductor device |
-
1977
- 1977-12-16 JP JP15196177A patent/JPS5483774A/en active Granted
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57122528A (en) * | 1981-01-23 | 1982-07-30 | Nippon Telegr & Teleph Corp <Ntt> | Drawing system for electron beam exposure apparatus |
JPS63178333U (en) * | 1987-05-09 | 1988-11-18 | ||
JP2011049337A (en) * | 2009-08-27 | 2011-03-10 | Fuji Electric Systems Co Ltd | Method of manufacturing semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
JPS6118859B2 (en) | 1986-05-14 |
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