JPS5483774A - Manufacture of semiconductor device - Google Patents

Manufacture of semiconductor device

Info

Publication number
JPS5483774A
JPS5483774A JP15196177A JP15196177A JPS5483774A JP S5483774 A JPS5483774 A JP S5483774A JP 15196177 A JP15196177 A JP 15196177A JP 15196177 A JP15196177 A JP 15196177A JP S5483774 A JPS5483774 A JP S5483774A
Authority
JP
Japan
Prior art keywords
wafer
pellets
metal ring
conductive film
manufacture
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP15196177A
Other languages
Japanese (ja)
Other versions
JPS6118859B2 (en
Inventor
Kenji Oka
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP15196177A priority Critical patent/JPS5483774A/en
Publication of JPS5483774A publication Critical patent/JPS5483774A/en
Publication of JPS6118859B2 publication Critical patent/JPS6118859B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Dicing (AREA)

Abstract

PURPOSE: To inspect characteristics by making a wafer in airtight contact with a conductive film and by electrically connecting an electrode from the substrate of the wafer to a measuring instrument.
CONSTITUTION: The wafer after an element is formed is adhered to conductive film 3 and divided into pellets 1, and then the film is elogated and connected to metal ring 2, so that a constant interval will be produced among pellets. Metal ring 2 is connected to the measring instrument and measurements of the element are made by probe 4, thereby fulfilling definite quality selection with high efficiency.
COPYRIGHT: (C)1979,JPO&Japio
JP15196177A 1977-12-16 1977-12-16 Manufacture of semiconductor device Granted JPS5483774A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15196177A JPS5483774A (en) 1977-12-16 1977-12-16 Manufacture of semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15196177A JPS5483774A (en) 1977-12-16 1977-12-16 Manufacture of semiconductor device

Publications (2)

Publication Number Publication Date
JPS5483774A true JPS5483774A (en) 1979-07-04
JPS6118859B2 JPS6118859B2 (en) 1986-05-14

Family

ID=15529988

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15196177A Granted JPS5483774A (en) 1977-12-16 1977-12-16 Manufacture of semiconductor device

Country Status (1)

Country Link
JP (1) JPS5483774A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122528A (en) * 1981-01-23 1982-07-30 Nippon Telegr & Teleph Corp <Ntt> Drawing system for electron beam exposure apparatus
JPS63178333U (en) * 1987-05-09 1988-11-18
JP2011049337A (en) * 2009-08-27 2011-03-10 Fuji Electric Systems Co Ltd Method of manufacturing semiconductor device

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57122528A (en) * 1981-01-23 1982-07-30 Nippon Telegr & Teleph Corp <Ntt> Drawing system for electron beam exposure apparatus
JPS63178333U (en) * 1987-05-09 1988-11-18
JP2011049337A (en) * 2009-08-27 2011-03-10 Fuji Electric Systems Co Ltd Method of manufacturing semiconductor device

Also Published As

Publication number Publication date
JPS6118859B2 (en) 1986-05-14

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