JPS5480075A - Resin sealed semiconductor device and its assembling method - Google Patents
Resin sealed semiconductor device and its assembling methodInfo
- Publication number
- JPS5480075A JPS5480075A JP14707577A JP14707577A JPS5480075A JP S5480075 A JPS5480075 A JP S5480075A JP 14707577 A JP14707577 A JP 14707577A JP 14707577 A JP14707577 A JP 14707577A JP S5480075 A JPS5480075 A JP S5480075A
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- header
- metal mold
- semiconductor device
- assembling method
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
PURPOSE: To reduce the space for the sealing metal mold by attaching the element for resin sealing with the heat sink isolated from the header.
CONSTITUTION: Header 1 and heat sink 2 are formed independently and then put together after the dlement is assembled on the heat sink with resin sealing. Pellet 3 is fixed on the upper surface of the heat sink of the copper-group material with connection 6 given, and then inserted into the metal mold to be sealed with resin 7. After this, the lead frame is separated, and the lower part of the heat sink is pressed into fitting hole 8 of the header made of iron, Al, etc. With such method, more amount of the resin sealing is possible with the same metal mold space.
COPYRIGHT: (C)1979,JPO&Japio
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14707577A JPS5480075A (en) | 1977-12-09 | 1977-12-09 | Resin sealed semiconductor device and its assembling method |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP14707577A JPS5480075A (en) | 1977-12-09 | 1977-12-09 | Resin sealed semiconductor device and its assembling method |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5480075A true JPS5480075A (en) | 1979-06-26 |
Family
ID=15421897
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP14707577A Pending JPS5480075A (en) | 1977-12-09 | 1977-12-09 | Resin sealed semiconductor device and its assembling method |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5480075A (en) |
-
1977
- 1977-12-09 JP JP14707577A patent/JPS5480075A/en active Pending
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