JPS5480075A - Resin sealed semiconductor device and its assembling method - Google Patents

Resin sealed semiconductor device and its assembling method

Info

Publication number
JPS5480075A
JPS5480075A JP14707577A JP14707577A JPS5480075A JP S5480075 A JPS5480075 A JP S5480075A JP 14707577 A JP14707577 A JP 14707577A JP 14707577 A JP14707577 A JP 14707577A JP S5480075 A JPS5480075 A JP S5480075A
Authority
JP
Japan
Prior art keywords
heat sink
header
metal mold
semiconductor device
assembling method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP14707577A
Other languages
Japanese (ja)
Inventor
Hisashi Yoshida
Keizo Otsuki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP14707577A priority Critical patent/JPS5480075A/en
Publication of JPS5480075A publication Critical patent/JPS5480075A/en
Pending legal-status Critical Current

Links

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

PURPOSE: To reduce the space for the sealing metal mold by attaching the element for resin sealing with the heat sink isolated from the header.
CONSTITUTION: Header 1 and heat sink 2 are formed independently and then put together after the dlement is assembled on the heat sink with resin sealing. Pellet 3 is fixed on the upper surface of the heat sink of the copper-group material with connection 6 given, and then inserted into the metal mold to be sealed with resin 7. After this, the lead frame is separated, and the lower part of the heat sink is pressed into fitting hole 8 of the header made of iron, Al, etc. With such method, more amount of the resin sealing is possible with the same metal mold space.
COPYRIGHT: (C)1979,JPO&Japio
JP14707577A 1977-12-09 1977-12-09 Resin sealed semiconductor device and its assembling method Pending JPS5480075A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14707577A JPS5480075A (en) 1977-12-09 1977-12-09 Resin sealed semiconductor device and its assembling method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14707577A JPS5480075A (en) 1977-12-09 1977-12-09 Resin sealed semiconductor device and its assembling method

Publications (1)

Publication Number Publication Date
JPS5480075A true JPS5480075A (en) 1979-06-26

Family

ID=15421897

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14707577A Pending JPS5480075A (en) 1977-12-09 1977-12-09 Resin sealed semiconductor device and its assembling method

Country Status (1)

Country Link
JP (1) JPS5480075A (en)

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